CYBL10163-56LQXI Overview
The CYBL10163-56LQXI is a Bluetooth Low Energy (BLE) System-on-Chip (SoC) solution designed for wireless communication applications that demand robust connectivity, low power consumption, and compact integration. Featuring a 56-pin QFN package and optimized architecture, this device delivers reliable Bluetooth Smart connectivity for industrial and commercial embedded designs. Its advanced features and integration make it suitable for a wide range of IoT, sensor, and control applications where efficiency and performance are essential. For more information, visit IC Manufacturer.
CYBL10163-56LQXI Technical Specifications
| Parameter | Value |
|---|---|
| Device Type | Bluetooth Low Energy System-on-Chip (SoC) |
| Package | 56-QFN (Quad Flat No-lead) |
| Pin Count | 56 |
| Operating Voltage | 1.8V to 3.6V |
| Core Architecture | ARM Cortex-M0 |
| Bluetooth Standard | Bluetooth Smart (Low Energy) |
| Interface Support | GPIO, I2C, SPI, UART |
| Operating Temperature Range | -40??C to +85??C |
| Mounting Type | Surface Mount |
CYBL10163-56LQXI Key Features
- Integrated Bluetooth Low Energy transceiver enables wireless connectivity with minimal external components, reducing board space and design complexity.
- ARM Cortex-M0 core delivers efficient processing performance with low power consumption, ideal for battery-powered systems.
- Versatile peripheral support including GPIO, I2C, SPI, and UART interfaces allows flexible integration with diverse sensors and actuators.
- Wide operating temperature range from -40??C to +85??C ensures reliability in demanding industrial and commercial environments.
CYBL10163-56LQXI Advantages vs Typical Alternatives
This device stands out with its highly integrated BLE functionality, minimizing the need for external components and streamlining design cycles. Its low power ARM Cortex-M0 core contributes to longer battery life in portable devices, while the wide temperature range supports robust operation in harsh conditions. These attributes make it a preferred choice over less integrated or less efficient wireless SoCs.
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Typical Applications
- Wireless sensor networks: The chip??s BLE capability and broad interface support make it ideal for managing distributed sensor data and supporting real-time wireless communication in industrial automation and building management systems.
- Wearable devices: Its small QFN package and low power operation enable compact, long-lasting health and fitness monitors, smartwatches, and medical sensors.
- Asset tracking: With integrated BLE and robust environmental tolerance, the SoC is suitable for asset tracking tags and inventory management solutions in logistics and warehousing.
- Remote controls and human-machine interfaces: The flexible I/O and wireless connectivity empower responsive, low-power remote controls and user interfaces in smart home and commercial installations.
CYBL10163-56LQXI Brand Info
The CYBL10163-56LQXI is engineered by a leading manufacturer focusing on high-performance wireless connectivity solutions. This SoC is part of a product family known for dependable Bluetooth Low Energy performance and flexible integration, meeting the needs of both emerging IoT designs and established industrial systems. The product reflects a commitment to quality, robustness, and innovation in wireless semiconductor technologies, making it a trusted choice in demanding application domains.
FAQ
What makes the CYBL10163-56LQXI suitable for industrial environments?
Its extended operating temperature range (-40??C to +85??C), robust QFN package, and reliable BLE connectivity ensure consistent performance in harsh or demanding industrial and commercial settings, supporting long-term operation and device longevity.
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Can this SoC be used in battery-powered devices?
Yes, the combination of a power-efficient ARM Cortex-M0 core and Bluetooth Low Energy transceiver enables the device to operate with minimal power consumption, making it highly suitable for battery-operated or energy-sensitive systems.
What interfaces does the CYBL10163-56LQXI support for peripheral integration?
This device offers multiple interface options including GPIO, I2C, SPI, and UART, providing engineers with flexible connectivity for sensors, actuators, and communication modules in a wide variety of embedded applications.
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Is the package size suitable for compact or portable designs?
The 56-QFN surface mount package delivers a compact footprint, enabling the development of space-constrained and portable solutions, such as wearables, wireless tags, and small form-factor controllers.
How does the integration of BLE in this SoC benefit product design?
By integrating the BLE radio and protocol stack, the device reduces the need for external components, shortens design cycles, lowers BOM costs, and simplifies certification, accelerating time-to-market for wireless-enabled products.
