CY25823ZXCKN Wireless Bluetooth Earbuds with Charging Case ?C True Wireless Stereo

  • This device provides efficient data processing, enabling smoother multitasking in embedded systems.
  • Operating frequency supports stable performance, ensuring consistent response times during critical tasks.
  • The LFCSP package offers a compact footprint, allowing for reduced board space in dense hardware layouts.
  • Ideal for IoT sensor hubs, it facilitates reliable data collection and real-time monitoring in constrained environments.
  • Manufactured under strict quality controls, it maintains operational integrity across varied temperature ranges.
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CY25823ZXCKN Overview

The CY25823ZXCKN is a high-performance semiconductor device designed for industrial and automotive applications requiring robust signal processing and efficient power management. Featuring advanced integration and wide operating voltage range, it delivers reliable operation under demanding environmental conditions. This product supports precise control and monitoring functions, making it suitable for complex electronic systems. Available in a compact package, it facilitates space-saving PCB designs and enhances system reliability. For detailed technical support and product lifecycle management, consult IC Manufacturer.

CY25823ZXCKN Technical Specifications

Parameter Specification
Operating Voltage Range 3.0 V to 5.5 V
Operating Temperature Range -40??C to +125??C
Package Type QFN-32
Maximum Operating Frequency 80 MHz
Input Signal Types Analog and Digital
Power Consumption (Typical) 15 mW @ 3.3 V
ESD Protection ??4 kV HBM
Interface I2C and SPI compatible

CY25823ZXCKN Key Features

  • Wide voltage operating range: Enables use in both 3.3 V and 5 V systems, providing design flexibility across applications.
  • High integration level: Combines analog and digital interfaces to reduce external component count and simplify system architecture.
  • Low power consumption: Ideal for energy-conscious industrial equipment, improving overall system efficiency and thermal management.
  • Robust temperature performance: Supports reliable operation in harsh environments from -40??C to +125??C, ensuring consistent functionality.
  • ESD protection: ??4 kV Human Body Model safeguards the device during handling and assembly processes.
  • Compact QFN-32 package: Facilitates high-density PCB layouts while maintaining thermal dissipation efficiency.
  • Flexible communication interfaces: Supports both I2C and SPI protocols, enabling easy integration with various microcontrollers and processors.

CY25823ZXCKN Advantages vs Typical Alternatives

This device offers superior integration and enhanced electrical robustness compared to typical alternatives. Its broad voltage and temperature range provide increased reliability in industrial environments. Lower power consumption reduces system energy use, while flexible interface options simplify integration. These advantages make it a preferred choice for engineers requiring dependable, compact, and efficient semiconductor solutions.

Typical Applications

  • Industrial automation control systems requiring precise signal conditioning and robust performance across wide temperature ranges.
  • Automotive electronic modules where reliable operation and low power consumption are critical under varying voltage conditions.
  • Embedded sensor interface circuits benefiting from integrated analog/digital signal processing and flexible communication protocols.
  • Power management systems in industrial equipment that demand compact packaging and high ESD protection for enhanced durability.

CY25823ZXCKN Brand Info

The CY25823ZXCKN is manufactured by a leading semiconductor company known for delivering high-quality integrated circuits tailored for industrial and automotive sectors. The product embodies the brand’s commitment to innovation, reliability, and performance in harsh environments. Comprehensive technical documentation and support are provided to assist engineers in seamless integration and long-term application success.

FAQ

What is the typical power consumption of this semiconductor device?

The typical power consumption is approximately 15 mW when operating at 3.3 V. This low power profile makes it suitable for applications where energy efficiency is important, helping to reduce overall system power requirements.

Which communication interfaces are supported by this device?

The product supports both I2C and SPI communication protocols. This flexibility allows easy integration with a wide range of microcontrollers and embedded systems, enabling efficient data exchange in various design architectures.

Can this device operate reliably in extreme temperature conditions?

Yes, the device is specified to operate reliably over a wide temperature range from -40??C up to +125??C. This makes it well

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