CD5309 Digital Temperature Controller with Display – Compact Panel Mount Package

CD5309 Overview

The CD5309 is a versatile 12-stage programmable frequency divider with a wide range of division ratios, designed for precision frequency synthesis and timing applications. It supports frequencies up to 12 MHz and offers flexible programmable division ratios from 3 to 4095, enabling fine control in frequency division tasks. Its TTL-compatible inputs and outputs ensure easy integration into digital systems, while the device’s robust design supports reliable operation in industrial and communication environments. Engineers and sourcing specialists can rely on this component to deliver consistent performance in diverse electronic applications requiring accurate frequency division. For more details, visit IC Manufacturer.

CD5309 Technical Specifications

CD5309 Key Features

• Programmable 12-stage divider: Allows division ratios from 3 to 4095, enabling precise frequency synthesis tailored to specific application requirements.
• High maximum input frequency: Supports input signals up to 12 MHz, making it suitable for high-speed digital circuits.
• TTL-compatible inputs and outputs: Ensures seamless integration into standard digital logic systems without additional interface circuitry.
• Low power consumption: Typical power dissipation of 20 mW supports energy-efficient designs, reducing thermal management needs.
• Robust 16-pin DIP packaging: Facilitates easy handling and soldering, suitable for prototyping and mass production alike.

CD5309 Advantages vs Typical Alternatives

Compared to typical frequency dividers, this device offers a wider programmable division range and higher maximum input frequency, providing engineers with enhanced flexibility and performance. Its TTL compatibility simplifies system integration, while low power dissipation improves reliability and reduces thermal stress. These advantages make it a preferred choice for industrial and communication frequency division needs.

Typical Applications

• Frequency synthesis in communication equipment, where adjustable division ratios enable precise output frequencies for transmitters and receivers.
• Digital clock generation circuits requiring stable and programmable frequency division.
• Timing and control circuits in industrial automation systems, benefiting from its high-speed operation and programmability.
• Test equipment and instrumentation that need accurate frequency scaling for measurement and calibration purposes.

CD5309 Brand Info

The CD5309 is a dependable programmable frequency divider offered by a leading semiconductor manufacturer, known for delivering high-quality digital logic components. This product is designed with emphasis on precision, reliability, and ease of integration, supporting engineers in creating robust frequency control and timing solutions. Its well-established design and adherence to stringent quality standards make it a trusted component across various industrial and communication applications.

FAQ

What is the maximum input frequency supported by this frequency divider?

The device supports a maximum input frequency of 12 MHz, making it suitable for high-speed digital circuits and ensuring reliable operation within this frequency range.

How flexible is the division ratio on this device?

The division ratio is programmable and ranges from 3 to 4095, allowing precise adjustment for a wide variety of frequency division requirements in complex systems.

Is the device compatible with standard TTL logic levels?

Yes, both inputs and outputs are TTL-compatible. This compatibility facilitates straightforward integration with standard digital logic families without the need for additional level shifting.

What package type does the CD5309 come in?

The product is available in a 16-pin Dual Inline Package (DIP), which is widely used for easy handling and soldering in both prototype and production environments.

What are the typical power dissipation characteristics of this device?

Typical power dissipation is about 20 milliwatts, supporting low-power designs and reducing thermal management challenges in various electronic systems.