BCM4365EKMMLW1G Overview
The BCM4365EKMMLW1G is a high-performance wireless communication module designed to deliver robust connectivity and efficient integration in advanced networking applications. It supports dual-band 802.11ac Wi-Fi standards, providing enhanced data throughput and improved signal reliability. Engineered with integrated power management and optimized RF performance, this device ensures low power consumption while maintaining high sensitivity. Suitable for industrial and consumer-grade electronics, it enables seamless wireless networking with simplified system design. The module is offered by IC Manufacturer, renowned for delivering cutting-edge semiconductor solutions tailored for demanding wireless environments.
BCM4365EKMMLW1G Technical Specifications
| Parameter | Specification |
|---|---|
| Wireless Standard | IEEE 802.11ac (Wi-Fi 5) |
| Frequency Bands | 2.4 GHz and 5 GHz dual-band |
| Maximum Data Rate | Up to 1.3 Gbps |
| Antenna Configuration | 3×3 MIMO (Multiple Input Multiple Output) |
| Modulation | OFDM (Orthogonal Frequency-Division Multiplexing) |
| Power Supply Voltage | 3.3 V nominal |
| Operating Temperature Range | -40??C to +85??C |
| Package Type | Compact module suitable for surface mount |
| Integrated Features | Power management, RF front-end, baseband processing |
BCM4365EKMMLW1G Key Features
- Dual-band 802.11ac support: Enables simultaneous 2.4 GHz and 5 GHz operation for enhanced network flexibility and reduced interference, improving overall wireless performance.
- 3×3 MIMO technology: Provides higher throughput and more reliable signal quality by transmitting multiple data streams concurrently, essential for demanding data applications.
- Integrated power management: Optimizes energy consumption to extend device runtime and reduce thermal dissipation, critical in battery-powered and compact systems.
- Robust RF front-end design: Ensures high sensitivity and improved signal-to-noise ratio, allowing for stable connections even in noisy electromagnetic environments.
BCM4365EKMMLW1G Advantages vs Typical Alternatives
This module offers a competitive edge through its advanced 3×3 MIMO configuration and integrated power management, delivering superior data rates and energy efficiency compared to many standard Wi-Fi modules. Its dual-band capability enhances network resilience and reduces interference, while the comprehensive RF integration boosts reliability and sensitivity. These factors combine to provide a robust, compact solution ideal for industrial-grade wireless applications.
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Typical Applications
- High-speed wireless routers and access points requiring reliable dual-band connectivity and enhanced throughput for dense network environments.
- Internet of Things (IoT) gateways that demand efficient power management alongside stable Wi-Fi communication.
- Smart home devices where compact form factor and robust wireless performance are essential for seamless user experience.
- Industrial automation systems benefiting from resilient wireless links in harsh and electromagnetically challenging settings.
BCM4365EKMMLW1G Brand Info
The BCM4365EKMMLW1G is part of a product line developed by a leading semiconductor manufacturer specializing in wireless communication ICs. This brand is recognized for combining innovative RF design with advanced digital processing to meet the rigorous demands of modern wireless connectivity. The module embodies the company??s commitment to delivering reliable, high-performance solutions optimized for integration in a wide range of networking and embedded applications.
FAQ
What wireless standards does the BCM4365EKMMLW1G support?
The module supports IEEE 802.11ac, commonly known as Wi-Fi 5, enabling dual-band communication across 2.4 GHz and 5 GHz frequencies. This allows for high data rates and compatibility with a wide range of wireless networks.
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How does the 3×3 MIMO configuration improve wireless performance?
3×3 MIMO technology uses three transmit and three receive antennas to send multiple data streams simultaneously. This enhances throughput, improves signal reliability, and reduces the effect of multi-path interference, making it suitable for high-demand wireless applications.
Can the BCM4365EKMMLW1G operate in harsh temperature conditions?
Yes, it is designed to operate reliably within a temperature range from -40??C to +85??C, making it suitable for industrial environments and applications exposed to varying temperature extremes.
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What integration features are included to support system design?
The module integrates power management circuits, RF front-end components, and baseband processing, which reduce the need for external components and simplify system design while improving energy efficiency and performance.
Is this module suitable for battery-powered devices?
Its integrated power management capabilities help optimize energy consumption, making it a good choice for battery-powered and portable devices where power efficiency is critical.
