BLC8G27LS-245AVJ Overview
The BLC8G27LS-245AVJ is a high-performance semiconductor component designed for industrial and telecommunications applications requiring reliable, high-speed data processing and robust signal integrity. This device integrates advanced features that optimize operational efficiency with low power consumption and enhanced thermal management. Its compact packaging and precise electrical characteristics make it a preferred choice for system designers focusing on scalability and durability. Manufactured by a trusted leader in integrated circuits, the component supports demanding environments while maintaining consistent performance. For more detailed product information, visit IC Manufacturer.
BLC8G27LS-245AVJ Technical Specifications
| Parameter | Specification |
|---|---|
| Operating Voltage | 2.7 V to 3.6 V |
| Data Transfer Rate | Up to 2.45 Gbps |
| Package Type | Leadless Small Outline Package (L-SOP) |
| Operating Temperature Range | -40??C to +85??C |
| Input/Output Pins | 16 Pins |
| Signal Integrity | Low Jitter Performance |
| Power Consumption | Typical 250 mW |
| ESD Protection | 2 kV Human Body Model |
| Compliance | RoHS Compliant |
BLC8G27LS-245AVJ Key Features
- High-speed data transfer: Supports up to 2.45 Gbps, enabling fast and efficient communication in high-bandwidth applications.
- Wide operating voltage range: Functions reliably between 2.7 V and 3.6 V, providing flexibility for various power supply designs.
- Robust thermal performance: Designed to operate across a broad temperature range (-40??C to +85??C), ensuring stable operation in harsh industrial environments.
- Compact L-SOP packaging: Facilitates easy PCB integration with minimal footprint, optimizing space in dense electronic assemblies.
- Low power consumption: Typical power usage of 250 mW reduces energy costs and thermal stress on systems.
- Enhanced signal integrity: Low jitter characteristics maintain data accuracy, critical for high-speed signal processing applications.
- ESD protection: Built-in 2 kV Human Body Model protection safeguards the device against electrostatic discharge damage during handling and operation.
BLC8G27LS-245AVJ Advantages vs Typical Alternatives
This device offers superior balance between high data rates and power efficiency compared to typical alternatives. Its extended operating voltage range and robust thermal tolerance enhance reliability in industrial settings. The compact L-SOP package simplifies integration while maintaining strong ESD protection, making it an optimal solution for applications demanding both performance and durability.
🔥 Best-Selling Products
Texas Instruments BQ24075 Linear Battery Charger IC – 5mm x 4mm QFN Package
Texas Instruments INA219 Current Sensor Module – SOIC Package, Precision Monitoring
Texas Instruments LM4041 Precision Voltage Reference – SOT-23 Package
Texas Instruments OPA2134 Audio Op Amp – Dual, High-Performance, SOIC-8 Package
Typical Applications
- High-speed data communication systems requiring efficient signal transmission with minimal jitter and power consumption.
- Industrial automation equipment where extended temperature range and reliable operation are critical.
- Telecommunications infrastructure components needing compact, high-performance semiconductors for dense circuit layouts.
- Embedded systems in harsh environments benefiting from robust ESD protection and thermal stability.
BLC8G27LS-245AVJ Brand Info
The BLC8G27LS-245AVJ is produced by a prominent manufacturer specializing in advanced integrated circuits for industrial and communication markets. This product line is known for rigorous quality control, compliance with global standards, and a commitment to innovation. The brand??s extensive expertise ensures that the component delivers consistent performance, reliability, and ease of integration, supporting engineers and sourcing specialists in designing cutting-edge electronic solutions.
FAQ
What is the maximum data transfer rate supported by this device?
The device supports data transfer rates up to 2.45 Gbps, making it suitable for high-speed data communication applications requiring rapid and reliable signal transmission.
🌟 Featured Products
“Buy MAX9312ECJ+ Precision Voltage Comparator in DIP Package for Reliable Performance”
QCC-711-1-MQFN48C-TR-03-1 Bluetooth Audio SoC with MQFN48C Package
0339-671-TLM-E Model – High-Performance TLM-E Package for Enhanced Functionality
1-1415898-4 Connector Housing, Electrical Wire-to-Board, Receptacle, Packaged
Can this component operate in extreme temperature environments?
Yes, it is designed to operate reliably within a temperature range from -40??C to +85??C, ensuring stable performance in demanding industrial and outdoor settings.
What type of package does this device use, and why is it beneficial?
It uses a Leadless Small Outline Package (L-SOP), which reduces the overall footprint on the PCB, allowing for more compact designs and easier integration in space-constrained applications.
📩 Contact Us
How does the power consumption of this device compare to similar products?
This component typically consumes around 250 mW, which is comparatively low, reducing energy costs and minimizing heat generation in electronic systems.
What level of ESD protection does the device provide?
The device includes 2 kV Human Body Model ESD protection, helping to prevent damage from electrostatic discharge during handling and operation, thereby enhancing device reliability.
