BGSF18DM20E6327XUMA1 Overview
The BGSF18DM20E6327XUMA1 is a high-performance RF switch designed to meet the demanding requirements of modern wireless communication systems. Engineered for precise signal routing, this semiconductor device delivers reliable switching functionality in a compact and efficient package. Its integration capability, low insertion loss, and high isolation support efficient signal management, making it a strong choice for RF front-end modules and antenna tuning networks. With robust performance characteristics, the component addresses the needs of engineers seeking reliable operation in mobile, IoT, and embedded wireless applications. IC Manufacturer
BGSF18DM20E6327XUMA1 Technical Specifications
| Parameter | Value |
|---|---|
| Product Category | RF Switch ICs |
| Switch Type | SPDT (Single Pole Double Throw) |
| Configuration | Dual, DPDT (Double Pole Double Throw) |
| Frequency Range | Up to 2.7 GHz |
| Voltage Supply | 1.65 V to 2.0 V |
| Package / Case | TSLP-10-2 |
| Operating Temperature Range | -30??C to +85??C |
| Mounting Style | Surface Mount (SMD/SMT) |
| Lead Free Status | RoHS Compliant |
BGSF18DM20E6327XUMA1 Key Features
- Low insertion loss ensures minimal signal degradation, supporting high-efficiency RF transmission in communication modules.
- High isolation between switch paths reduces undesired signal coupling, which is critical for multi-band and multi-antenna systems.
- Compact TSLP-10-2 package enables dense PCB layouts, optimizing space for portable and embedded designs.
- Operates across a broad frequency range up to 2.7 GHz, making it suitable for LTE, GSM, and WCDMA wireless applications.
- RoHS compliance and lead-free status facilitate environmental and regulatory compatibility for global markets.
- Works reliably within a supply voltage as low as 1.65V, supporting battery-powered and low-voltage designs.
- Surface-mount design streamlines automated assembly and enhances manufacturing efficiency for high-volume production.
BGSF18DM20E6327XUMA1 Advantages vs Typical Alternatives
Compared to standard RF switch solutions, this device offers an optimized blend of low insertion loss and high isolation, delivering precise signal routing even in compact layouts. Its support for low-voltage operation increases compatibility with energy-constrained designs, while the surface-mount package simplifies integration into modern high-density PCBs. These advantages help engineers achieve reliable RF performance without sacrificing board space or power efficiency.
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Typical Applications
- Mobile wireless communication devices: Ideal for use in smartphones, tablets, and feature phones, where reliable RF switching and minimal signal loss are critical to data throughput and voice quality.
- IoT and M2M modules: The component’s small footprint and efficient switching make it suitable for embedded wireless modules, where space and power consumption are at a premium.
- RF front-end modules: Used in antenna tuning and signal path selection, supporting multi-band and multi-antenna configurations for complex radio architectures.
- Automotive telematics: Enables robust connectivity for telematics control units, supporting reliable wireless communication in automotive environments.
BGSF18DM20E6327XUMA1 Brand Info
This RF switch IC is designed and manufactured by a leading global supplier of semiconductors, recognized for innovation in wireless communication components. The BGSF18DM20E6327XUMA1 reflects the brand??s commitment to quality, integration, and performance, providing a robust solution for engineers building advanced RF systems. By focusing on compact packaging, environmental compliance, and operational reliability, the product supports diverse markets ranging from consumer devices to industrial and automotive segments.
FAQ
What frequency range does the BGSF18DM20E6327XUMA1 support?
This RF switch is specified for operation up to 2.7 GHz, accommodating a wide variety of wireless standards including LTE, GSM, and WCDMA. Its broad frequency coverage makes it suitable for multi-band RF applications across consumer and industrial sectors.
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Which package type is used for this device?
The component is offered in a TSLP-10-2 package, which is a compact surface-mount form factor. This enables efficient use of PCB area, especially important in portable or space-constrained electronic designs.
Is the BGSF18DM20E6327XUMA1 compliant with environmental regulations?
Yes, this device is RoHS compliant and lead-free, supporting environmentally responsible manufacturing and meeting global regulatory standards for hazardous substances.
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What are common application areas for this RF switch?
It is commonly used in mobile devices, IoT modules, RF front-end circuits, and automotive telematics units. Its robust switching characteristics and compact size make it versatile for a range of wireless connectivity needs.
What supply voltage range is required for operation?
The device operates reliably with a supply voltage between 1.65 V and 2.0 V. This low-voltage capability ensures compatibility with modern battery-powered and low-power electronic systems.
