BGSA14M3N10E6327XTSA1 Overview
The BGSA14M3N10E6327XTSA1 is a highly integrated, compact RF switch solution designed for demanding wireless and communication systems. Engineered for superior linearity and low insertion loss, this RF switch enables efficient signal routing in space-constrained designs. Its advanced silicon technology and small footprint make it ideal for next-generation mobile devices, wireless modules, and IoT infrastructure. By delivering robust isolation and reliability, it supports high-performance requirements in RF front-end applications. For sourcing and design, explore more at IC Manufacturer.
BGSA14M3N10E6327XTSA1 Technical Specifications
| Parameter | Value |
|---|---|
| Device Type | RF Switch |
| Switch Configuration | Single-Pole, Four-Throw (SP4T) |
| Technology | Silicon on Insulator (SOI) |
| Package / Case | TSNP-10 (10-pin, 1.1 x 1.5 mm) |
| Mounting Type | Surface Mount (SMD/SMT) |
| Operating Frequency | Up to 6.0 GHz |
| Control Interface | Digital |
| RoHS Compliance | Lead Free / RoHS Compliant |
| Manufacturer Series | BGSA |
BGSA14M3N10E6327XTSA1 Key Features
- SP4T RF switch configuration: Enables flexible signal routing between four different signal paths, which is essential for multi-band RF front ends in wireless designs.
- Advanced SOI process: Offers low insertion loss and high isolation, ensuring minimal signal degradation and robust interference suppression in critical circuits.
- Ultra-compact TSNP-10 package: Saves PCB space, allowing high-density placement in space-constrained mobile devices and modules.
- Surface-mount compatibility: Simplifies automated assembly and supports efficient high-volume manufacturing.
- Wide frequency range: Suitable for applications up to 6 GHz, supporting a broad array of RF communication standards.
- Lead-free and RoHS compliant: Meets environmental regulations and global supply requirements.
BGSA14M3N10E6327XTSA1 Advantages vs Typical Alternatives
Compared to standard RF switches, the BGSA14M3N10E6327XTSA1 provides enhanced integration with its SP4T topology, minimizing board area and BOM complexity. Its SOI technology delivers superior isolation and low insertion loss, which are critical for signal integrity in high-frequency designs. The device??s compact, lead-free TSNP-10 package suits modern, miniaturized electronics and meets stringent environmental standards, offering significant value for OEMs and design engineers focused on efficiency and compliance.
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Typical Applications
- Mobile device RF front ends: Ideal for smartphones, tablets, and wireless modules requiring multi-band switching, optimizing antenna performance and signal clarity in compact layouts.
- IoT wireless infrastructure: Supports smart meters, home automation, and sensor gateways where reliable RF path selection is essential for connectivity and low-power operation.
- Test and measurement equipment: Facilitates signal routing in RF test setups, allowing flexible signal path selection to enhance measurement accuracy.
- Communication modules: Used in LTE, GNSS, and Wi-Fi modules to manage multiple frequency bands and antenna paths in compact embedded systems.
BGSA14M3N10E6327XTSA1 Brand Info
The BGSA14M3N10E6327XTSA1 belongs to a reputable line of RF switching solutions, known for high integration and reliable performance across communication platforms. This product is manufactured to rigorous quality standards, focusing on RF signal integrity and system-level flexibility. The device??s advanced SOI technology and innovative package underline the brand??s commitment to supporting engineers with robust, environmentally responsible options for modern wireless and IoT designs. Its proven architecture and compliance credentials make it a trusted choice for global electronics manufacturers.
FAQ
What type of applications benefit most from the BGSA14M3N10E6327XTSA1?
This device is ideally suited for RF front-end modules in mobile devices, IoT nodes, and wireless communication platforms where multi-band switching and compact board layouts are critical. Its SP4T configuration and low insertion loss help optimize antenna and signal performance.
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How does the SOI process technology improve the device??s performance?
Silicon on Insulator (SOI) technology enables lower insertion loss and higher isolation compared to conventional processes. This ensures minimal signal loss and better interference suppression, which are crucial for maintaining signal integrity in high-frequency RF applications.
What are the main advantages of the TSNP-10 package?
The TSNP-10 package offers an ultra-small footprint (1.1 x 1.5 mm), allowing significant PCB space savings. Its surface-mount design supports automated assembly, making it suitable for high-density, high-volume production environments in portable and embedded systems.
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Is the BGSA14M3N10E6327XTSA1 compliant with environmental regulations?
Yes, this device is lead-free and fully RoHS compliant, making it suitable for global markets and environmentally conscious manufacturing processes. Compliance ensures it meets the requirements for green electronics initiatives worldwide.
Can this device handle multiple RF frequency bands?
The switch is designed for operation up to 6 GHz, making it compatible with a wide range of RF standards. It is well-suited for applications demanding multi-band support, such as LTE, Wi-Fi, and GNSS, enhancing design flexibility for system architects.
