BGSA14M2N10E6329XTSA1 Overview
The BGSA14M2N10E6329XTSA1 is a specialized RF switch designed for high-performance signal routing in advanced communication systems. With a focus on low insertion loss, high isolation, and robust ESD protection, this device enables efficient RF path selection in compact form factors. Its small footprint and optimized switching characteristics make it suitable for integration in space-constrained applications, enhancing design flexibility for engineers. Leveraging proven silicon technology, the switch supports demanding industrial and consumer wireless infrastructure. For sourcing and datasheets, visit IC Manufacturer.
BGSA14M2N10E6329XTSA1 Technical Specifications
| Parameter | Value |
|---|---|
| Component Type | RF Switch |
| Switch Configuration | SP4T (Single Pole, Four Throw) |
| Operating Frequency Range | Up to 6 GHz |
| Control Interface | Digital |
| ESD Protection | High, Integrated |
| Package Type | TSNP-10-9 |
| Mounting Style | Surface Mount (SMD/SMT) |
| RoHS Status | Compliant |
| Number of Outputs | 4 |
BGSA14M2N10E6329XTSA1 Key Features
- Supports SP4T switching, enabling up to four RF connections from a single input line??ideal for multi-band wireless devices requiring compact routing solutions.
- Offers high isolation and low insertion loss, which minimizes signal leakage and ensures reliable, high-quality signal transmission in sensitive RF environments.
- Integrated ESD protection safeguards the switch and connected circuitry, improving system robustness and reducing downtime caused by electrostatic discharge events.
- Surface mount package (TSNP-10-9) allows for easy integration on dense PCBs, promoting compact and streamlined product designs.
BGSA14M2N10E6329XTSA1 Advantages vs Typical Alternatives
The BGSA14M2N10E6329XTSA1 stands out from typical RF switches by combining a compact TSNP-10-9 package with high isolation and low insertion loss. Its integrated ESD protection enhances device longevity, while digital control simplifies system integration. These factors result in greater reliability, improved RF performance, and ease of use for demanding wireless applications.
🔥 Best-Selling Products
-
Texas Instruments BQ24075 Linear Battery Charger IC – 5mm x 4mm QFN Package
-
Texas Instruments INA219 Current Sensor Module – SOIC Package, Precision Monitoring
-
Texas Instruments LM4041 Precision Voltage Reference – SOT-23 Package
-
Texas Instruments OPA2134 Audio Op Amp – Dual, High-Performance, SOIC-8 Package
Typical Applications
- Mobile devices and smartphones, where the SP4T configuration enables efficient antenna switching for multi-band operation and helps meet stringent space and performance requirements.
- Wireless infrastructure equipment, including base stations and repeaters, for signal routing and antenna diversity switching in high-frequency ranges.
- RF front-end modules in IoT devices, optimizing connectivity options and ensuring robust operation in variable environments.
- Test and measurement systems, where precise RF signal path selection and high isolation are critical for accurate instrumentation and diagnostics.
BGSA14M2N10E6329XTSA1 Brand Info
The BGSA14M2N10E6329XTSA1 is part of a reputable semiconductor manufacturer??s portfolio, designed for use in advanced RF signal routing. This product leverages proven silicon switch technology to deliver reliable performance in demanding wireless and communications applications. Its compliance with RoHS standards and surface mount design underline the manufacturer??s commitment to quality, safety, and environmental responsibility. The device is widely recognized by engineers and system designers for its robust feature set and consistent results in real-world deployments.
FAQ
What type of applications best benefit from the BGSA14M2N10E6329XTSA1’s SP4T configuration?
Applications requiring multiple RF signal paths, such as smartphones, wireless modules, and test equipment, benefit from the SP4T configuration. It enables one input to connect to four outputs, supporting flexible antenna or signal routing in compact designs.
🌟 Featured Products
-
“Buy MAX9312ECJ+ Precision Voltage Comparator in DIP Package for Reliable Performance”
-
QCC-711-1-MQFN48C-TR-03-1 Bluetooth Audio SoC with MQFN48C Package
-
0339-671-TLM-E Model – High-Performance TLM-E Package for Enhanced Functionality
-
1-1415898-4 Connector Housing, Electrical Wire-to-Board, Receptacle, Packaged
How does the integrated ESD protection impact system reliability?
The integrated ESD protection helps shield sensitive RF circuitry from sudden voltage spikes or electrostatic discharges, reducing the risk of device failure and maintenance costs. This protection is especially valuable in environments prone to ESD events.
Why is low insertion loss important in RF switches like this device?
Low insertion loss ensures that minimal signal power is lost as it passes through the switch, preserving signal integrity and improving overall RF system performance. This is crucial in applications where high-frequency signal quality is essential.
📩 Contact Us
What is the advantage of the TSNP-10-9 surface mount package?
The TSNP-10-9 package offers a small footprint, which allows designers to save PCB space and integrate the switch into highly compact or portable electronic devices. Surface mount technology also supports efficient automated assembly processes.
Is the BGSA14M2N10E6329XTSA1 compliant with environmental standards such as RoHS?
Yes, this device is RoHS compliant. This ensures it meets current environmental regulations regarding hazardous substances, making it suitable for use in products sold globally and supporting sustainable electronics manufacturing practices.
