BGSA143ML10E6327XTSA1 Overview
The BGSA143ML10E6327XTSA1 is a high-performance RF switch IC designed for demanding wireless connectivity and signal routing applications. Featuring advanced integration and robust performance, this component is optimized for use in compact, high-frequency systems where precise signal path control is essential. Its small footprint and reliable switching characteristics make it an ideal solution for modern RF front-end modules in consumer and industrial electronics. Discover more at IC Manufacturer.
BGSA143ML10E6327XTSA1 Technical Specifications
| Parameter | Value |
|---|---|
| Product Category | RF Switch ICs |
| Mounting Style | Surface Mount |
| Package / Case | MLP-10 |
| Number of Pins | 10 |
| RoHS Status | RoHS Compliant |
| Manufacturer Series | BGSA |
| Operating Temperature Range | -40??C to +85??C |
| Packaging | Tape & Reel (TR) |
| Lead-Free Status | Lead-Free |
BGSA143ML10E6327XTSA1 Key Features
- Highly integrated RF switch function, enabling efficient signal routing in compact device footprints.
- Surface-mount MLP-10 package supports automated assembly and dense PCB layouts, ideal for space-constrained designs.
- RoHS and lead-free compliance ensures environmental compatibility and meets global regulatory standards for hazardous substances.
- Wide operating temperature range from -40??C to +85??C allows deployment in varied industrial and consumer environments.
BGSA143ML10E6327XTSA1 Advantages vs Typical Alternatives
Compared to standard RF switches, this device offers greater integration and a smaller MLP-10 package, reducing PCB area and simplifying circuit design. Its robust environmental compliance ensures safer manufacturing, while surface-mount capability streamlines automated production. These factors make it a superior choice for high-density, high-reliability RF applications.
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Typical Applications
- Wireless communication modules benefit from the precise RF path selection and low insertion loss, improving signal integrity in smartphones, tablets, and IoT devices.
- Industrial automation equipment requiring robust, compact RF switches for reliable connectivity in harsh environments.
- Consumer electronics, such as Wi-Fi routers and smart home devices, where space-saving signal switching and compliance are critical.
- Test and measurement instruments that demand repeatable, high-performance RF switching for accurate signal routing.
BGSA143ML10E6327XTSA1 Brand Info
The BGSA143ML10E6327XTSA1 is part of the BGSA series, which is recognized for delivering reliable and high-density RF switch solutions. Designed for seamless surface-mount integration, this component is manufactured to stringent quality standards, supporting both innovation and compliance in modern electronic system design. Its inclusion in the BGSA family underscores a commitment to high-performance RF signal management for both consumer and industrial markets.
FAQ
What type of applications is the BGSA143ML10E6327XTSA1 best suited for?
This component is ideal for wireless communication modules, test and measurement equipment, industrial automation, and compact consumer devices. Its robust feature set supports RF signal routing in both high-frequency and space-restricted environments.
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What are the main packaging and mounting options for this device?
The device is offered in a 10-pin MLP (Micro Leadframe Package), which is optimized for surface-mount assembly. This makes it suitable for automated PCB manufacturing and high-density electronic designs.
Is the BGSA143ML10E6327XTSA1 environmentally compliant?
Yes, the device is RoHS compliant and lead-free, making it suitable for manufacturing processes that adhere to global environmental and safety regulations regarding hazardous substances.
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What temperature range can this RF switch operate in?
The device is rated for operation from -40??C to +85??C, allowing it to function reliably in both consumer electronics and more demanding industrial settings.
How does the BGSA143ML10E6327XTSA1 improve design efficiency?
Its high level of integration and compact package reduce PCB space requirements and simplify the design of RF switching networks, enabling faster production cycles and more reliable performance in end applications.
