BGSA142MN12E6327XTSA1 RF Switch, SP4T, 1.8GHz, TSLP Package

  • Provides efficient RF switching, enabling signal routing in wireless communication circuits and test setups.
  • Integrates an SP4T (Single Pole Four Throw) configuration, allowing flexible signal selection for complex designs.
  • Surface-mount package saves board space and supports high-density, compact electronic assemblies.
  • Ideal for use in multi-band wireless systems, where reliable channel switching is critical for performance.
  • Manufactured to meet industry standards, ensuring dependable operation over extended use and environmental conditions.
SKU: BGSA142MN12E6327XTSA1 Category: Brand:
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产品上方询盘

BGSA142MN12E6327XTSA1 Overview

The BGSA142MN12E6327XTSA1 is a specialized semiconductor switch designed for advanced RF front-end applications. Engineered for high-frequency operation, it enables precise signal routing in demanding wireless systems. Integrating robust switching performance with compact packaging, it is ideal for modern RF circuit designs where board space, reliability, and performance are critical. The device??s optimized characteristics make it suitable for applications ranging from mobile communication to IoT hardware. For sourcing and detailed technical support, visit IC Manufacturer.

BGSA142MN12E6327XTSA1 Technical Specifications

Parameter Value
Product Category RF Switch ICs
Type Single Pole Four Throw (SP4T)
Configuration 4-channel
Operating Frequency Up to 6 GHz
Package TSLP-12-10
Mounting Style Surface Mount
Operating Temperature Range -30??C to +85??C
RoHS Compliant Yes

BGSA142MN12E6327XTSA1 Key Features

  • High-frequency operation up to 6 GHz, enabling compatibility with modern LTE and 5G RF bands for versatile wireless deployments.
  • Single Pole Four Throw (SP4T) configuration allows flexible signal path routing, minimizing the need for multiple discrete components and reducing board complexity.
  • Compact TSLP-12-10 surface-mount package supports dense PCB layouts, enhancing space efficiency in miniaturized designs.
  • Wide operating temperature range ensures reliable performance in both consumer and industrial environments.

BGSA142MN12E6327XTSA1 Advantages vs Typical Alternatives

Compared to standard RF switch ICs, this device offers superior high-frequency support and a compact, surface-mountable package, making it ideal for next-generation wireless systems. The integrated SP4T configuration streamlines design, reduces BOM counts, and enhances signal integrity, delivering more reliable performance in densely packed RF front-ends and portable electronics.

Typical Applications

  • Wireless communication systems: Enables precise RF signal path selection in smartphones, tablets, and other mobile devices, supporting multi-band operation and dynamic signal routing.
  • IoT modules: Integrates seamlessly into Internet-of-Things hardware, optimizing antenna selection and RF resource allocation for connected devices in compact form factors.
  • RF test equipment: Used in automated test setups to switch between different signal paths or antennas, improving test throughput and equipment flexibility.
  • Consumer electronics: Supports advanced RF switching in devices such as smart wearables, wireless routers, and home automation equipment requiring efficient multi-antenna management.

BGSA142MN12E6327XTSA1 Brand Info

The BGSA142MN12E6327XTSA1 is manufactured by a leading supplier of advanced RF semiconductor solutions. This product exemplifies the brand??s commitment to delivering high-performance, compact, and reliable components for the rapidly evolving wireless sector. Its robust specification and proven quality make it a trusted choice for engineers seeking dependable RF switch technology in high-volume and mission-critical designs.

FAQ

What type of RF switching configuration does this device offer?

This component features a Single Pole Four Throw (SP4T) configuration, allowing it to route a single RF input to one of four distinct outputs, simplifying complex signal path management in compact circuits.

Is this device suitable for high-frequency applications such as 5G?

Yes, its frequency support up to 6 GHz makes it well-suited for modern wireless applications, including LTE and emerging 5G systems, where high-frequency performance and signal integrity are essential.

What are the advantages of the TSLP-12-10 package?

The TSLP-12-10 surface-mount package offers a compact footprint, enabling high-density PCB layouts. This is especially beneficial for mobile devices and space-constrained RF modules.

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产品中间询盘

Can this device operate in harsh temperature environments?

With an operating temperature range from -30??C to +85??C, it is engineered to perform reliably in a variety of environmental conditions, from consumer electronics to industrial deployments.

Is this RF switch compliant with environmental standards?

Yes, the product is RoHS compliant, ensuring it meets international environmental and safety requirements for lead-free manufacturing and sustainable supply chain practices.

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