BGS15GA14E6327XTSA1 Overview
The BGS15GA14E6327XTSA1 is a highly integrated RF switch designed for demanding wireless communication applications. Featuring advanced performance in a compact footprint, this device is engineered to provide reliable signal routing and minimal insertion loss. Its versatile configuration supports multiple frequency bands, making it ideal for modern RF front-ends. With robust ESD protection and optimized switching characteristics, this component helps streamline design while boosting overall system reliability. To learn more about sourcing and specifications, visit the IC Manufacturer site.
BGS15GA14E6327XTSA1 Technical Specifications
| Parameter | Value |
|---|---|
| Product Type | RF Switch |
| Configuration | SPDT (Single Pole Double Throw) |
| Frequency Range | Up to 3.8 GHz |
| Operating Voltage | 1.65 V to 2.1 V |
| Package Type | TSNP-6-10 |
| On-State Resistance | Low (exact value per datasheet) |
| ESD Protection | High |
| Operating Temperature Range | -30??C to +85??C |
| RoHS Compliance | Yes |
BGS15GA14E6327XTSA1 Key Features
- Compact SPDT configuration: Allows seamless signal routing in space-constrained designs, maximizing board efficiency.
- Wide frequency support: Operates up to 3.8 GHz, making it suitable for multi-band RF applications and enhanced flexibility in circuit design.
- Robust ESD protection: Minimizes failures due to electrostatic discharge, improving device reliability in harsh industrial or mobile environments.
- Low operating voltage: Supports operation from 1.65 V, reducing overall power consumption for energy-conscious applications.
BGS15GA14E6327XTSA1 Advantages vs Typical Alternatives
The BGS15GA14E6327XTSA1 stands out among RF switches due to its low insertion loss, high ESD robustness, and compact TSNP-6-10 package. Its ability to operate over a broad frequency range and at low voltages makes it highly suitable for next-generation wireless designs, offering improved integration, reliability, and energy efficiency compared to standard alternatives.
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Typical Applications
- Wireless communication modules: Ideal for smartphones, tablets, and portable wireless devices requiring reliable RF signal switching and minimal board area usage.
- RF front-end circuits: Used in multi-band transceivers for efficient antenna selection or band switching in base stations and access points.
- Industrial IoT devices: Ensures robust and energy-efficient wireless connectivity in sensor nodes and gateway equipment.
- Test and measurement equipment: Suitable for automated test setups that demand high isolation and repeatable signal routing.
BGS15GA14E6327XTSA1 Brand Info
This product is offered by a leading developer in RF semiconductor technology, recognized for delivering high-quality, reliable components for the communication industry. The BGS15GA14E6327XTSA1 exemplifies the brand??s focus on miniaturization, robust ESD protection, and compatibility with advanced high-frequency designs. Its reputation for quality and innovation ensures confidence in both prototyping and high-volume production environments.
FAQ
What is the primary function of the BGS15GA14E6327XTSA1?
This component is designed as a single pole double throw (SPDT) RF switch, enabling the routing of high-frequency signals between two distinct paths. It is commonly deployed in wireless communication front-ends for signal selection or antenna switching.
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Which applications benefit most from using this RF switch?
Products like wireless modules, RF front-end circuits, and industrial IoT devices benefit greatly due to the device??s broad frequency support, low power requirements, and compact size, making it suitable for both portable and fixed installations.
How does the device handle ESD (Electrostatic Discharge) events?
It features robust ESD protection, helping to safeguard sensitive RF circuitry from damage during manufacturing and operation. This resilience contributes to higher reliability in demanding environments.
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What packaging format is available for this component?
The device is supplied in a TSNP-6-10 lead package, which is compact and suitable for high-density PCB layouts, supporting modern miniaturized electronics without sacrificing performance or durability.
Is the BGS15GA14E6327XTSA1 compliant with environmental regulations?
Yes, it is RoHS compliant, ensuring it meets current environmental and safety standards for hazardous substances, making it suitable for global manufacturing and deployment in eco-conscious product lines.
