BGS15AN16E6327XTSA1 Overview
The BGS15AN16E6327XTSA1 is a compact, high-performance RF switch component designed specifically for demanding wireless communication applications. Engineered for optimal signal routing in RF front-end modules, it features SPDT (Single Pole Double Throw) architecture and operates effectively at a broad frequency range. Its small form factor and low insertion loss make it an ideal choice for integration in space-constrained designs. The device also provides excellent isolation and high linearity, supporting enhanced signal integrity in mobile and wireless infrastructure systems. For further sourcing details, visit IC Manufacturer.
BGS15AN16E6327XTSA1 Technical Specifications
| Parameter | Value |
|---|---|
| Function | SPDT (Single Pole Double Throw) RF Switch |
| Frequency Range | Up to 6 GHz |
| Package | TSNP-10 |
| Operating Voltage | 1.65 V to 2.05 V |
| Operating Temperature | -30??C to 85??C |
| Insertion Loss | Low (typical for this class) |
| Isolation | High isolation between RF paths |
| ESD Protection | Integrated |
| Control Logic | 1.8 V logic compatible |
BGS15AN16E6327XTSA1 Key Features
- SPDT RF switch architecture delivers flexible signal routing, enabling easy integration into complex RF front-end designs without significant board space impact.
- Wide frequency coverage up to 6 GHz supports use across multiple wireless standards, ensuring compatibility with a broad range of applications and future-proofing system designs.
- Low insertion loss and high isolation enhance overall system efficiency and signal clarity, resulting in better performance in transmission and reception chains.
- Compact TSNP-10 package minimizes layout footprint, making it suitable for miniaturized and portable devices where PCB real estate is at a premium.
- Integrated ESD protection increases reliability and robustness, reducing the risk of damage during assembly and operation.
- 1.8 V logic compatibility allows seamless interface with standard control circuits, simplifying design and reducing power consumption.
BGS15AN16E6327XTSA1 Advantages vs Typical Alternatives
Compared to standard RF switches, this device offers lower insertion loss and higher isolation, ensuring improved signal integrity in RF pathways. Its small TSNP-10 package supports high-density layouts, while built-in ESD protection and a wide operating frequency range deliver enhanced reliability and application flexibility. These related function words demonstrate its suitability for next-generation wireless designs.
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Typical Applications
- Mobile communication devices: Utilized in smartphones and tablets for antenna path switching, enabling seamless frequency band selection and improved wireless connectivity in compact form factors.
- Wireless infrastructure equipment: Integrated into base station modules for RF signal routing, supporting efficient network coverage and interference management.
- IoT and M2M modules: Supports connectivity and signal selection in Internet of Things devices, optimizing wireless performance in smart sensors and gateways.
- Consumer electronics: Suitable for embedded wireless modules in laptops, portable media devices, and wearables, ensuring versatile RF switching within limited PCB space.
BGS15AN16E6327XTSA1 Brand Info
This component is part of a leading-edge RF switch product portfolio focused on high integration and performance for advanced wireless systems. The BGS15AN16E6327XTSA1 is engineered for applications requiring precise RF signal control, compact packaging, and robust ESD protection. It is recognized for its reliability and suitability in both consumer and industrial-grade electronics, supporting the growing demands of modern wireless connectivity ecosystems.
FAQ
What type of RF switch is the BGS15AN16E6327XTSA1?
This device is a Single Pole Double Throw (SPDT) RF switch, which enables switching between two RF signal paths with a single control input. It is commonly used for antenna switching and signal routing in wireless systems.
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What is the maximum frequency supported?
The switch operates effectively up to 6 GHz, making it suitable for a wide range of wireless communication protocols, including those used in mobile devices, IoT, and wireless infrastructure.
How does the package size benefit my design?
The compact TSNP-10 package allows for high-density PCB layouts, helping engineers save board space in portable or miniaturized applications without compromising RF performance or reliability.
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Is it compatible with standard control voltages?
Yes, this device is compatible with 1.8 V logic levels, making it easy to interface with modern digital controllers and minimizing the need for voltage level-shifting components in your design.
What protection features are included?
The BGS15AN16E6327XTSA1 includes integrated ESD protection, enhancing device robustness and safeguarding sensitive RF circuitry during assembly and field operation, which is critical for reliable product performance.





