BGS14MA11E6327XTSA1 RF Switch, SP4T, E6327-2 Package ÿ Infineon Semiconductor

  • Provides pressure sensing capabilities, enabling accurate measurement and monitoring for industrial or consumer systems.
  • Operates with a digital output, simplifying integration with microcontrollers and reducing signal processing complexity.
  • Features a compact SMT package, helping designers save board space in dense electronic assemblies.
  • Suitable for HVAC systems, where it can help automate airflow or pressure-based control processes.
  • Manufactured with quality standards to support consistent performance over extended operational lifetimes.
SKU: BGS14MA11E6327XTSA1 Category: Brand:
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产品上方询盘

BGS14MA11E6327XTSA1 Overview

The BGS14MA11E6327XTSA1 is a high-performance RF switch developed for demanding wireless applications, offering reliable signal routing within compact system designs. With its advanced CMOS technology and optimized pin configuration, this component is engineered for low insertion loss and high linearity, making it suitable for multi-band RF systems. Its robust design ensures consistent operation in various environments, supporting high-frequency switching tasks with minimal power consumption. Whether integrated into communication modules or test equipment, this device delivers efficiency and flexibility for engineers. Discover more at IC Manufacturer.

BGS14MA11E6327XTSA1 Technical Specifications

Attribute Value
Category RF Switch ICs
Switch Type SP4T (Single Pole, Four Throw)
Technology CMOS
Number of Channels 1 Channel
Package / Case TSLP-16-4
Mounting Type Surface Mount
Operating Frequency Multi-band (specific bands supported by IC design)
Lead Free Status Lead Free / RoHS Compliant

BGS14MA11E6327XTSA1 Key Features

  • High isolation and low insertion loss, ensuring optimal signal integrity in RF switching applications.
  • Single-pole four-throw (SP4T) configuration allows designers to route multiple RF paths, enhancing system flexibility and space savings.
  • Based on CMOS process technology, delivering low power consumption and high integration for portable and battery-powered devices.
  • Surface mount TSLP-16-4 package supports streamlined assembly and reliable PCB integration.

BGS14MA11E6327XTSA1 Advantages vs Typical Alternatives

Compared to standard RF switches, this device delivers superior integration due to its CMOS process, enabling reduced board space and lower power draw. Its SP4T configuration enhances versatility, while low insertion loss and high isolation improve overall RF performance. The surface mount package further simplifies manufacturing, making it a preferred choice for modern wireless system designs.

Typical Applications

  • Cellular handsets and wireless communication modules, where efficient RF path selection is essential for multi-band and multi-mode operation. The device??s low insertion loss and high isolation help maximize signal clarity and minimize interference.
  • RF front-end modules in IoT devices, supporting seamless connectivity and optimal performance across various frequency bands.
  • Test and measurement equipment, facilitating reliable signal routing and fast switching in compact instrument designs.
  • Consumer electronics requiring integrated RF switching, such as tablets, wearables, or wireless routers, benefitting from low power and miniaturized footprint.

BGS14MA11E6327XTSA1 Brand Info

The BGS14MA11E6327XTSA1 is manufactured by a leading supplier of RF semiconductor components, recognized for delivering advanced switching solutions tailored to wireless and communication markets. This product exemplifies the brand??s commitment to innovation in RF integration, offering engineers a robust and efficient solution for multi-band signal routing. Its combination of CMOS technology, compact packaging, and application versatility positions it as a trusted choice for next-generation wireless designs.

FAQ

What type of RF switch configuration does the BGS14MA11E6327XTSA1 use?

This device utilizes a single-pole, four-throw (SP4T) configuration, allowing it to connect one input to any of four outputs. This flexibility is ideal for applications requiring multiple RF signal paths in a compact design.

How does the CMOS technology benefit this RF switch IC?

The use of CMOS process technology results in lower power consumption and higher integration, which is especially important for portable or battery-powered devices. It also supports compact packaging and reliable, consistent performance in various environments.

What are the main advantages of the TSLP-16-4 package?

The TSLP-16-4 surface mount package offers a small footprint, which helps save PCB space in dense designs. Its design supports automated assembly processes, improving manufacturing efficiency and enabling high-volume production.

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产品中间询盘

Is the BGS14MA11E6327XTSA1 compliant with environmental standards?

Yes, this device is lead-free and RoHS compliant, making it suitable for environmentally conscious designs and ensuring compatibility with global regulatory requirements for hazardous substances.

What types of applications are best suited for this RF switch IC?

This component is ideal for wireless communication modules, mobile devices, RF front-ends in IoT products, and compact test equipment. Its flexibility, low power operation, and reliable switching capabilities support a wide range of RF routing needs.

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