BGS13S2N9E6327XTSA1 RF Switch Module, SP3T, 2.3V, TSLGA-16 Package

BGS13S2N9E6327XTSA1 Overview

The BGS13S2N9E6327XTSA1 is a high-performance integrated circuit designed for advanced RF switching applications. With its robust switching capabilities and compact footprint, this device is ideal for engineers seeking efficient signal routing in wireless and telecommunications systems. Its SP3T (single pole triple throw) configuration offers flexible signal path selection, supporting enhanced system designs where space and performance are critical. Designed for ease of integration, this component delivers reliable operation and supports demanding industrial requirements. For further information or to source this component, visit IC Manufacturer.

BGS13S2N9E6327XTSA1 Technical Specifications

BGS13S2N9E6327XTSA1 Key Features

• SP3T RF Switch: Enables seamless routing between three different RF signal paths, providing maximum flexibility in circuit design and reducing external component count.
• Low Insertion Loss: With typical figures of 0.4 dB at 2.7 GHz, this device ensures minimal signal degradation, crucial for maintaining high signal integrity in RF systems.
• High Isolation: Achieves typically 30 dB isolation at 2.7 GHz, which helps prevent cross-talk and interference among signal paths, supporting reliable operation in multi-band environments.
• Compact Package: Supplied in a space-saving TSLP-9-1 package (1.1 x 1.5 mm), making it ideal for applications with stringent PCB space constraints.
• Wide Frequency Range: Operates efficiently up to 6 GHz, catering to a broad spectrum of wireless standards including GSM, WCDMA, and LTE.
• Robust ESD Protection: Offers 2 kV human body model protection, enhancing reliability and robustness during handling and integration.
• Low Operating Voltage: Supports a voltage range from 1.65 V to 2.05 V, enabling compatibility with modern low-power systems.

BGS13S2N9E6327XTSA1 Advantages vs Typical Alternatives

Compared to standard RF switches, this SP3T device stands out with its low insertion loss, high isolation metrics, and robust ESD protection. The compact TSLP-9-1 package simplifies PCB layout for space-limited designs. Its wide frequency range and efficient power requirements provide engineers with superior integration flexibility and reliability, making it a strong choice for demanding RF applications.

Typical Applications

• Mobile Communication Devices: The switch??s low insertion loss and high isolation are critical for smartphones and tablets, ensuring efficient signal routing among multiple antennas and frequency bands, thereby supporting seamless multi-standard connectivity.
• Wireless Infrastructure: Ideal for use in base stations and small cells, where reliable RF path selection and compact footprint are required to meet high-density installation needs.
• M2M and IoT Modules: Supports efficient RF switching in machine-to-machine communication devices and IoT sensors, improving signal quality while minimizing power consumption.
• Test and Measurement Equipment: Used in RF test setups to select between various signal sources or measurement paths, benefiting from the device??s high reliability and frequency range.

BGS13S2N9E6327XTSA1 Brand Info

This product is part of a well-established portfolio of RF switch solutions tailored for high-performance wireless and telecommunications systems. The BGS13S2N9E6327XTSA1 is engineered to meet the demanding standards of contemporary RF design, combining low power operation, robust ESD protection, and a miniaturized package. Its manufacturer is recognized for delivering high-quality, reliable components widely adopted in industrial and consumer electronics sectors.

FAQ

What type of applications benefit most from using this RF switch?

The device is highly suitable for mobile devices, wireless infrastructure, IoT modules, and RF test equipment. Its combination of low insertion loss, high isolation, and compact size makes it ideal for designs where high performance and board space efficiency are top priorities.

What package does this device use, and why is it important?

It comes in a TSLP-9-1 (1.1 x 1.5 mm) package, which is extremely compact. This is important for engineers designing space-constrained applications like smartphones, wearables, or small IoT modules, where PCB real estate is at a premium.

How does the insertion loss at high frequencies impact system performance?

Low insertion loss (0.4 dB at 2.7 GHz) means that the switch introduces minimal signal attenuation, preserving RF signal strength and quality. This is especially critical for high-frequency applications to maintain overall system efficiency and performance.

What level of ESD protection is provided, and how does it help?

The device provides 2 kV human body model ESD protection, reducing the risk of damage during assembly and handling. This enhances the reliability and longevity of the final product, especially in environments prone to electrostatic discharge.

Is the device suitable for multi-band wireless designs?

Yes, its frequency range up to 6 GHz and SP3T configuration make it suitable for multi-band designs, allowing a single switch to route signals across GSM, WCDMA, and LTE bands, thereby simplifying design complexity and improving integration.