BGS12P2L6E6327XTSA1 RF Switch, Dual SPDT, LGA Package ÿ Infineon Model

  • Functions as a power management IC, enabling efficient voltage regulation for sensitive electronic circuits.
  • Features a 12-pin package that allows for streamlined integration and simplified PCB layout in compact designs.
  • Compact package footprint reduces board space requirements, supporting miniaturized and portable device applications.
  • Ideal for embedded systems where consistent power delivery is essential for stable device operation.
  • Manufactured to rigorous standards, ensuring dependable long-term performance in demanding electronic environments.
SKU: BGS12P2L6E6327XTSA1 Category: Brand:
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产品上方询盘

BGS12P2L6E6327XTSA1 Overview

The BGS12P2L6E6327XTSA1 is a high-performance RF switch designed for demanding wireless communication applications. Engineered in a compact 6-pin TSLP package, this device enables precise signal routing with minimal insertion loss and high isolation, making it ideal for modern RF front-ends. Its robust design supports reliable operation across a broad frequency range, providing flexibility for integration into cellular, wireless infrastructure, and signal switching modules. With its advanced characteristics and proven quality, this component is a preferred choice for engineers seeking efficient signal management. For more information, visit IC Manufacturer.

BGS12P2L6E6327XTSA1 Technical Specifications

Parameter Value
Product Category RF Switch ICs
Configuration SPDT (Single Pole Double Throw)
Package/Case TSLP-6
Mounting Style Surface Mount
Number of Switches 1
Number of Pins 6
RF Type General Purpose
Operating Frequency Supported (see datasheet for details)
Lead Free Status RoHS Compliant

BGS12P2L6E6327XTSA1 Key Features

  • SPDT configuration: Enables flexible signal routing between two outputs, optimizing RF path selection for improved system performance.
  • Miniature TSLP-6 package: Saves valuable PCB space, allowing for higher component density and more compact designs.
  • Surface-mount capability: Streamlines automated assembly and ensures robust integration into high-volume manufacturing processes.
  • RoHS compliance: Meets global environmental standards for hazardous substances, supporting sustainable product development.

BGS12P2L6E6327XTSA1 Advantages vs Typical Alternatives

Compared to standard RF switches, this device offers superior integration and a space-saving form factor, thanks to its compact TSLP-6 package. Its SPDT configuration allows efficient signal routing with high reliability, making it well-suited for modern wireless systems. RoHS compliance ensures safe, sustainable integration into global designs, while surface-mount compatibility reduces assembly complexity and cost.

Typical Applications

  • Mobile communication devices: The device is ideal for use in smartphones and tablets, where compact, reliable RF switching is essential for antenna selection and signal path management.
  • Wireless infrastructure equipment: Used in base stations and repeaters, ensuring efficient signal routing and minimizing losses in critical RF paths.
  • Test and measurement systems: Supports precise signal switching in RF test setups, contributing to accurate test results and flexible measurement configurations.
  • Consumer electronics: Suitable for integration into devices requiring compact, dependable RF switches, such as wireless routers and IoT modules.

BGS12P2L6E6327XTSA1 Brand Info

This product represents a commitment to quality and innovation in RF signal management. The BGS12P2L6E6327XTSA1 is designed to address the miniaturization and performance needs of modern electronics, leveraging advanced semiconductor technology. Its robust packaging, reliability, and compliance with environmental standards make it a trusted solution for engineers and product designers worldwide.

FAQ

What is the key benefit of using a SPDT RF switch like the BGS12P2L6E6327XTSA1?

The SPDT (Single Pole Double Throw) configuration enables the selection between two signal paths with a single control, which is valuable for antenna selection, signal routing, and redundancy in communication systems. This enhances flexibility and reliability in RF designs.

How does the miniature TSLP-6 package benefit PCB design?

The compact TSLP-6 package minimizes the footprint on the PCB, allowing more components to fit in a limited space. This is especially important in mobile devices and other applications where board space is at a premium.

Is the device suitable for automated assembly processes?

Yes, its surface-mount design is optimized for automated pick-and-place assembly, ensuring efficient handling during high-volume production and reducing the risk of manual errors during manufacturing.

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产品中间询盘

What environmental compliance does this device meet?

This component is RoHS compliant, which means it does not contain hazardous substances above specified limits. This compliance supports eco-friendly product development and global market access.

In which types of products is the BGS12P2L6E6327XTSA1 typically used?

It is commonly found in mobile devices, wireless infrastructure, test and measurement equipment, and consumer electronics where efficient and reliable RF signal switching is required. Its versatility supports a wide range of RF applications.

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