BGS110MN20E6327XTSA1 Overview
The BGS110MN20E6327XTSA1 is a specialized RF single-pole, single-throw (SPST) switch that delivers precise signal routing for RF front-end circuits. Designed for integration into compact wireless applications, this device offers reliable low-power switching performance suited for demanding industrial and communication systems. Its small footprint and robust electrical characteristics enable efficient signal management in space-constrained designs, ensuring high performance and flexibility for engineers. For more detailed sourcing and manufacturer information, visit IC Manufacturer.
BGS110MN20E6327XTSA1 Technical Specifications
| Attribute | Value |
|---|---|
| Function | RF Switch, SPST (Single Pole Single Throw) |
| Switch Circuit | Single |
| Operating Frequency | Up to 6 GHz |
| On-State Resistance | Low (typical for RF switching) |
| Voltage Supply Range | Low voltage support (specific range per datasheet) |
| Package Type | Ultra-compact, 6-pin wafer-level package (WLP) |
| Mounting Style | Surface Mount Technology (SMT) |
| Operating Temperature | Standard industrial range (consult datasheet for limits) |
| Lead Free Status | RoHS Compliant |
BGS110MN20E6327XTSA1 Key Features
- Highly compact 6-pin wafer-level package enables maximum board space savings, allowing integration in miniature wireless modules and IoT devices.
- Operates efficiently up to 6 GHz, supporting a broad range of RF communication protocols and ensuring compatibility with modern wireless standards.
- Low on-state resistance minimizes insertion loss, which is critical for maintaining signal integrity in sensitive RF circuits.
- Surface mount design streamlines automated assembly processes and supports high-volume manufacturing requirements.
BGS110MN20E6327XTSA1 Advantages vs Typical Alternatives
This RF switch stands out due to its combination of low insertion loss, high-frequency support, and ultra-compact package. Compared to traditional mechanical or larger IC switches, it offers superior integration for dense layouts, increased reliability with fewer mechanical parts, and power efficiency critical for battery-powered designs. Its surface mount configuration further reduces production complexity and enhances system scalability.
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Typical Applications
- RF front-end modules in wireless communication devices, where space-saving and low-loss signal routing are crucial for optimal performance and miniaturization.
- IoT sensor nodes and smart devices that require efficient RF switching within compact enclosures and operate across multiple frequency bands.
- Industrial automation equipment leveraging wireless connectivity for real-time data transfer, benefiting from reliable RF signal management.
- Consumer electronics such as smartphones, wearables, and tablets, requiring efficient RF path selection with minimal power consumption.
BGS110MN20E6327XTSA1 Brand Info
The BGS110MN20E6327XTSA1 is manufactured by a leading supplier in advanced RF and semiconductor technologies. This product exemplifies the brand??s commitment to delivering compact, high-performance RF switching solutions tailored for modern wireless and industrial markets. Its application-focused design ensures seamless integration into next-generation electronics, offering engineers confidence in long-term supply and support.
FAQ
What type of RF switch configuration does this device offer?
This component provides a single-pole, single-throw (SPST) configuration, ideal for straightforward on/off signal routing in RF circuits. Its design supports efficient switching with minimal signal degradation across a wide frequency range, making it suitable for diverse high-frequency applications.
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In which frequency range can this device be reliably operated?
The switch is engineered to function effectively up to 6 GHz, covering most major wireless communication standards and protocols. This frequency capability allows it to be used in both legacy and emerging RF systems requiring broad-bandwidth performance.
How does the package type benefit design engineers?
The ultra-compact, 6-pin wafer-level package (WLP) significantly reduces PCB footprint, optimizing space in miniaturized devices. This small form factor also simplifies PCB layout and enables higher component densities, which are essential in modern portable and IoT products.
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What mounting method is supported and how does it affect production?
This device is intended for surface mount technology (SMT), which is widely used in automated PCB assembly lines. SMT compatibility improves manufacturing speed, ensures consistent quality, and is well-suited for high-volume electronic production environments.
Is the product compliant with environmental standards?
Yes, this RF switch is RoHS compliant, indicating it is lead-free and meets stringent environmental and safety regulations. This compliance ensures compatibility with global markets and aligns with green electronics initiatives.
