BCM88375CB0KFSBG Overview
The BCM88375CB0KFSBG is a high-performance semiconductor device designed for advanced industrial and communications applications. Engineered to deliver optimized signal processing and efficient power management, it supports complex system integration with reliable performance. This component is tailored for environments demanding precision, robustness, and seamless interoperability. Its compact footprint and comprehensive functionality make it ideal for engineers seeking to enhance system capabilities without compromising on size or energy efficiency. For sourcing and design professionals, the BCM88375CB0KFSBG represents a dependable solution backed by IC Manufacturer expertise and quality assurance.
BCM88375CB0KFSBG Technical Specifications
| Parameter | Specification |
|---|---|
| Package Type | FBGA (Fine-pitch Ball Grid Array) |
| Number of Pins | 624 |
| Core Voltage | 1.0 V |
| I/O Voltage | 1.8 V – 3.3 V |
| Operating Temperature Range | -40??C to +85??C |
| Power Supply Current | Typical 1.2 A |
| Data Rate | Up to 10 Gbps per lane |
| Signal Integrity Features | Integrated equalization and error correction |
| Compliance Standards | IEEE 802.3, PCIe Gen3 |
| Junction Temperature | Up to 125??C |
BCM88375CB0KFSBG Key Features
- High-speed data transmission: Enables up to 10 Gbps per lane, facilitating rapid communication for data-intensive industrial and networking systems.
- Integrated signal equalization: Enhances signal integrity by minimizing distortion and noise, crucial for maintaining accuracy in high-frequency environments.
- Robust thermal management: Supports operation up to 125??C junction temperature, ensuring reliability under harsh industrial conditions.
- Wide voltage range support: Operates between 1.8 V and 3.3 V I/O voltages, providing design flexibility for various power domains.
- Compact FBGA package: Enables high pin count and dense integration while maintaining a small footprint for space-sensitive applications.
- Standards compliance: Supports IEEE 802.3 and PCIe Gen3 protocols, ensuring compatibility and ease of integration in existing systems.
BCM88375CB0KFSBG Advantages vs Typical Alternatives
This device offers superior signal integrity and thermal tolerance compared to typical alternatives, which often struggle with high-frequency noise and heat dissipation. Its broad voltage compatibility and advanced error correction provide engineers with enhanced design flexibility and system reliability. Moreover, its fine-pitch FBGA package allows for higher pin density, reducing board space and lowering integration complexity.
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Typical Applications
- High-speed networking equipment: Ideal for switches and routers requiring reliable 10 Gbps data lanes with low latency and error rates, supporting critical communication infrastructure.
- Telecommunication base stations: Facilitates efficient data processing and signal management in cellular and wireless communication systems.
- Data center servers: Enhances throughput and maintains signal integrity in environments with dense electronic assemblies and demanding thermal conditions.
- Industrial automation controllers: Supports robust communication protocols and withstands harsh temperature ranges in factory floor control systems.
BCM88375CB0KFSBG Brand Info
Produced by a leading IC manufacturer specializing in semiconductor solutions for industrial and communication markets, this product benefits from rigorous quality control and advanced engineering design. The brand is recognized for delivering high-reliability components tailored to meet stringent industry standards. The BCM88375CB0KFSBG continues this tradition, offering a blend of performance, integration ease, and durability that aligns with modern system requirements.
FAQ
What package type does this component use, and why is it important?
The device employs a Fine-pitch Ball Grid Array (FBGA) package, which allows for a high pin count within a compact footprint. This package type improves electrical performance and thermal dissipation, making it suitable for high-density circuit designs and applications requiring efficient heat management.
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What temperature range is supported for reliable operation?
The component supports an operating temperature range from -40??C to +85??C, with a maximum junction temperature of 125??C. This wide range ensures stable performance in both typical and harsh industrial environments.
How does the BCM88375CB0KFSBG maintain signal integrity at high data rates?
It incorporates integrated equalization and error correction features that reduce signal distortion and noise. These technologies help maintain data accuracy and reduce bit error rates even at data rates up to 10 Gbps per lane.
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Is this device compatible with common communication standards?
Yes, the device complies with IEEE 802.3 and PCIe Gen3 standards, facilitating seamless integration into existing networking and computing systems that rely on these protocols for data transmission.
What voltage levels does the device support for core and I/O operations?
The core voltage operates at 1.0 V, while the input/output voltage range spans from 1.8 V to 3.3 V. This flexibility supports various system power architectures and allows easy interfacing with different logic levels.
