BCM88359CUBGT WiFi/Bluetooth Combo Chip, Wireless Transceiver, BGA Package

  • Delivers wireless communication capabilities, enabling seamless data transfer in connected devices.
  • Supports advanced networking protocols for faster and more reliable wireless performance.
  • Compact package design allows for efficient use of board space in space-constrained applications.
  • Ideal for integration into smartphones and IoT devices, enhancing connectivity without increasing device size.
  • Designed to maintain stable operation under typical electronic usage conditions for consistent reliability.
SKU: BCM88359CUBGT Category: Brand:
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产品上方询盘

BCM88359CUBGT Overview

The BCM88359CUBGT is a highly integrated communication IC designed for demanding industrial and commercial electronic systems. Engineered to provide robust performance in wireless connectivity applications, this device combines multiple functions into a compact, efficient form factor. With advanced packaging and proven reliability, it supports next-generation system designs requiring high data throughput and secure connectivity. The BCM88359CUBGT is well-suited for integration into smart devices, gateways, and industrial controllers. For technical sourcing and application support, visit IC Manufacturer.

BCM88359CUBGT Technical Specifications

Attribute Value
Device Type Communication IC
Mounting Type Surface Mount
Package / Case WLBGA-88
Number of Pins 88
Operating Temperature Range -30??C to +85??C
RoHS Status RoHS Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN 5A992C
Lead Finish Solder Balls

BCM88359CUBGT Key Features

  • Highly integrated design: Combines multiple communication functions in a single WLBGA-88 package, reducing PCB footprint and simplifying system integration.
  • Surface mount package: Enables streamlined automated assembly and high-density board designs for industrial and commercial electronics.
  • Wide operating temperature range: Rated from -30??C to +85??C, supporting reliable operation in varied and demanding environments.
  • RoHS compliant construction: Ensures environmental compliance and supports global manufacturing standards.
  • MSL 3 rating: Moisture sensitivity level 3 (168 hours) allows for flexible handling and storage before reflow soldering, promoting process reliability.

BCM88359CUBGT Advantages vs Typical Alternatives

This device stands out with its high level of integration and robust package design, which minimizes board space while maintaining performance and compliance. The WLBGA-88 package and surface-mount capability streamline assembly and boost reliability compared to discrete or less integrated solutions. Its broad temperature range and RoHS compliance further distinguish it for demanding industrial applications, offering efficiency and ease of implementation with related function words such as reliability, compliance, and integration.

Typical Applications

  • Industrial wireless modules: Used in factory automation and process control, this device enables secure and high-speed communication for smart sensors and controllers. Its wide temperature range helps maintain stable performance in harsh environments.
  • IoT gateways: Integrated into smart gateways for connecting diverse IoT endpoints, the device supports reliable data aggregation and wireless connectivity in commercial and industrial deployments.
  • Consumer electronics: Suitable for use in connected home devices, wearables, and mobile computing, providing compact wireless communication capability.
  • Embedded systems: Well-suited for embedded platforms requiring seamless integration of wireless communication functions within a limited PCB area.

BCM88359CUBGT Brand Info

BCM88359CUBGT is part of a portfolio of high-performance communication ICs recognized for their robust design and manufacturing quality. This product reflects a commitment to integrating advanced wireless technologies with a focus on reliability, process compatibility, and ease of system integration. Its WLBGA-88 form factor and RoHS-compliant construction make it a trusted choice for designers seeking compact yet powerful connectivity solutions in industrial, commercial, and consumer applications.

FAQ

What packaging does the BCM88359CUBGT use?

This device is offered in a WLBGA-88 surface-mount package, which supports high-density layouts and automated manufacturing processes. The packaging facilitates integration into modern, space-constrained system designs.

Is the BCM88359CUBGT suitable for industrial temperature ranges?

Yes, the operational temperature range of -30??C to +85??C ensures stable, reliable function in both standard and demanding industrial environments. This rating makes it appropriate for a wide range of industrial and commercial applications.

What are the handling and storage requirements for this component?

The device carries a Moisture Sensitivity Level (MSL) of 3, allowing for up to 168 hours of floor life after removal from moisture barrier bags. Appropriate handling procedures are recommended to maintain solderability and device reliability.

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产品中间询盘

Is the BCM88359CUBGT compliant with environmental regulations?

Yes, it is RoHS compliant, meaning it conforms to global restrictions on hazardous substances. This helps manufacturers meet regulatory standards for environmental safety and market access worldwide.

How does the integration benefit system designers?

Combining multiple communication functions into a single IC reduces component count, simplifies PCB layout, and enhances reliability. This high level of integration is especially valuable in compact and complex designs, streamlining both development and production.

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