BCM88335L2CUBGT Overview
The BCM88335L2CUBGT is a versatile, highly-integrated IC designed for robust wireless connectivity and advanced network communication applications. Featuring a compact form factor and optimized for low power consumption, this device is ideal for engineers seeking streamlined solutions for embedded and industrial systems. With its reliable performance, broad compatibility, and efficient integration capabilities, the BCM88335L2CUBGT enables designers to simplify development cycles and accelerate time-to-market. For more details and sourcing, visit IC Manufacturer.
BCM88335L2CUBGT Technical Specifications
| Parameter | Value |
|---|---|
| Part Number | BCM88335L2CUBGT |
| Component Category | Integrated Circuit |
| Package Type | UBGA-195 |
| Mounting Style | Surface Mount |
| Number of Pins | 195 |
| Operating Temperature Range | -40??C to +85??C |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Application Segment | Wireless Communication |
BCM88335L2CUBGT Key Features
- Integrated wireless communication capability, offering seamless connectivity and reducing the need for external RF components.
- Surface mount UBGA-195 package improves board space efficiency, critical for compact and high-density designs.
- Wide operating temperature range from -40??C to +85??C ensures reliable operation in demanding industrial environments.
- RoHS compliance and lead-free construction support environmentally responsible manufacturing and global regulatory requirements.
BCM88335L2CUBGT Advantages vs Typical Alternatives
Compared to typical wireless ICs and network controllers, this device offers superior integration and a minimized footprint with its UBGA-195 package. The extended temperature range and RoHS compliance deliver enhanced reliability and regulatory ease, making it a preferred choice for long-life, mission-critical applications and environmentally conscious designs.
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Typical Applications
- Industrial wireless networking: The device is well-suited for integration into industrial automation and monitoring systems that require robust, reliable wireless connectivity under challenging conditions.
- Embedded communication modules: Common in IoT nodes and smart devices, this IC enables efficient, compact wireless communication integration.
- Consumer electronics: Suitable for products demanding low power wireless data exchange within compact enclosures.
- Automotive telematics: The broad thermal tolerance and integration make it a practical choice for in-vehicle connectivity solutions.
BCM88335L2CUBGT Brand Info
This product is part of a high-reliability IC family recognized for enabling advanced wireless communication in embedded systems. The BCM88335L2CUBGT is engineered to meet the rigorous demands of industrial and commercial deployments, providing a dependable, cost-effective platform for OEMs and system integrators seeking robust performance and streamlined board-level integration.
FAQ
What package type is used for the BCM88335L2CUBGT, and why is it beneficial?
The BCM88335L2CUBGT utilizes a UBGA-195 surface mount package. This compact packaging format enhances board space efficiency and allows for high-density component placement, which is especially valuable in space-constrained designs.
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Is this IC suitable for use in harsh environments?
Yes, with an operating temperature range of -40??C to +85??C, the device is designed to perform reliably in demanding and varying environmental conditions typical of industrial and automotive applications.
Does the BCM88335L2CUBGT comply with environmental standards?
Absolutely. The device is RoHS compliant and lead-free, supporting environmentally responsible manufacturing practices and facilitating global market access for finished products using this IC.
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What are typical applications for this device?
It is commonly found in industrial wireless networks, embedded communication modules for IoT, consumer electronic devices, and automotive telematics systems, where reliable wireless connectivity and compact integration are required.
How does this IC compare to similar alternatives in terms of integration?
Thanks to its highly integrated design and UBGA-195 package, the device minimizes the need for external components and reduces overall board footprint, simplifying layout and supporting faster, more cost-effective product development.
