BCM6750A2KFEBG Overview
The BCM6750A2KFEBG is a high-performance semiconductor device designed for advanced signal processing applications. Featuring a robust architecture optimized for efficient data throughput and low power consumption, this product delivers reliable operation under demanding industrial conditions. Engineers and sourcing specialists will find this component ideal for integration in communication and multimedia systems requiring precision and scalability. Manufactured by a leading IC Manufacturer, the device balances performance and integration, supporting complex system designs while minimizing board space and thermal impact.
BCM6750A2KFEBG Technical Specifications
| Parameter | Specification |
|---|---|
| Core Architecture | Multi-core DSP processor |
| Operating Voltage | 1.1 V to 1.3 V |
| Maximum Clock Frequency | 1.2 GHz |
| Process Technology | 28 nm CMOS |
| Memory | 512 KB embedded SRAM |
| Package Type | FBGA 12 x 12 mm |
| Power Consumption | Typical 0.9 W at max frequency |
| Operating Temperature Range | -40??C to +85??C |
BCM6750A2KFEBG Key Features
- Multi-core DSP architecture: Enables parallel processing for enhanced throughput, reducing latency in real-time signal applications.
- Low voltage operation: Supports power-efficient designs, extending device lifetime and lowering thermal dissipation in embedded systems.
- Integrated SRAM: On-chip memory reduces external memory dependency, improving system integration and minimizing board footprint.
- Advanced 28 nm CMOS process: Provides a balance of performance and power efficiency, ensuring reliable operation in industrial environments.
BCM6750A2KFEBG Advantages vs Typical Alternatives
This device stands out with its combination of multi-core processing power and low energy consumption, delivering superior performance without compromising efficiency. Its embedded SRAM integration reduces external memory needs, simplifying system design and enhancing reliability compared to conventional solutions. The advanced process technology also contributes to reduced thermal output and improved longevity, making it a preferred choice for demanding industrial applications.
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Typical Applications
- High-speed digital signal processing in telecommunications infrastructure, enabling efficient data handling and enhanced network performance with low power consumption.
- Multimedia processing in consumer electronics, delivering smooth audio and video decoding with minimal latency and power use.
- Industrial automation systems requiring precise real-time signal analysis and control for improved operational accuracy.
- Embedded systems in automotive electronics, supporting reliable communication and sensor data processing within strict temperature and power constraints.
BCM6750A2KFEBG Brand Info
Produced by a recognized leader in semiconductor manufacturing, this product reflects the brand??s commitment to delivering cutting-edge integrated circuits tailored for high-performance applications. The BCM6750A2KFEBG exemplifies the company??s expertise in advanced process technologies and system-level integration, supporting engineers in creating efficient, scalable solutions across multiple industries. Backed by stringent quality control and global support, the device ensures dependable operation in complex electronic designs.
FAQ
What is the core architecture of this device?
The device features a multi-core digital signal processor (DSP) architecture designed to handle parallel processing tasks efficiently. This structure improves throughput and reduces latency, making it suitable for real-time signal processing applications.
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What voltage range does the BCM6750A2KFEBG operate within?
It operates within a voltage range of 1.1 V to 1.3 V, allowing for low power consumption while maintaining optimal performance. This flexibility supports energy-efficient designs in embedded and industrial systems.
What type of package does the BCM6750A2KFEBG use?
This model comes in a Fine-pitch Ball Grid Array (FBGA) package measuring 12 x 12 mm, which provides a compact footprint and excellent thermal dissipation for integration into space-constrained applications.
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What is the typical power consumption at maximum frequency?
At its maximum clock frequency of 1.2 GHz, the device typically consumes around 0.9 watts, balancing high processing capability with power efficiency to reduce heat generation and extend system operation time.
Which temperature ranges can the device reliably operate within?
The device supports an operating temperature range from -40??C to +85??C, making it suitable for a wide variety of industrial and automotive environments that demand robust thermal tolerance.
