BCM43694B1KRFBG Wi-Fi 6E Transceiver Module – RFQFN Package

BCM43694B1KRFBG Overview

The BCM43694B1KRFBG is an advanced wireless communication module designed for high-performance networking applications. This integrated circuit supports dual-band Wi-Fi 6 (802.11ax) technology, offering enhanced throughput and improved network efficiency. Featuring multi-user MIMO capabilities and optimized power consumption, it caters to demanding environments requiring reliable, high-speed connectivity. Compact and designed for seamless integration, this device suits a wide range of industrial and consumer electronics where robust wireless performance is essential. For detailed product sourcing and technical support, visit IC Manufacturer.

BCM43694B1KRFBG Technical Specifications

BCM43694B1KRFBG Key Features

• Dual-Band Wi-Fi 6 Support: Enables simultaneous operation on 2.4 GHz and 5 GHz bands, providing greater network flexibility and higher data rates.
• Advanced MU-MIMO Technology: Supports 4×4 multi-user MIMO, allowing multiple devices to communicate simultaneously, enhancing network capacity and reducing latency.
• High Modulation Efficiency: Incorporates 1024-QAM for improved spectral efficiency, delivering faster throughput without additional bandwidth consumption.
• Optimized Power Consumption: Designed to minimize energy use during operation, this IC extends device battery life and reduces thermal management needs.
• Robust Interface Compatibility: Supports SDIO 3.0 and PCIe 2.0 interfaces, facilitating easy integration with a variety of host processors and platforms.
• Wide Operating Temperature Range: Ensures reliable performance in harsh industrial and outdoor environments from -40??C to +85??C.
• Compact BGA Package: The 88-pin ball grid array package reduces PCB footprint and improves signal integrity for complex system designs.

BCM43694B1KRFBG Advantages vs Typical Alternatives

This module advances beyond typical wireless ICs by combining dual-band Wi-Fi 6 capabilities with 4×4 MU-MIMO support, leading to superior network throughput and multi-device handling. Its high receive sensitivity and 1024-QAM modulation enhance data accuracy and speed, while optimized power consumption ensures energy efficiency. The device??s wide temperature tolerance and compact packaging provide greater reliability and easier integration compared to many standard alternatives, making it well-suited for demanding industrial and consumer wireless applications.

Typical Applications

• High-performance routers and access points requiring advanced Wi-Fi 6 functionality for residential and enterprise networking.
• Industrial IoT devices needing robust wireless connectivity in challenging temperature conditions.
• Smart home gateways and multimedia streaming devices demanding low latency and high throughput.
• Embedded systems in automotive or portable electronics that benefit from compact wireless modules with efficient power consumption.

BCM43694B1KRFBG Brand Info

This wireless communication IC is part of a product family renowned for delivering cutting-edge semiconductor solutions tailored to the networking industry. The device combines advanced RF engineering with system-level integration expertise to provide reliable, high-speed connectivity. It is supported by comprehensive documentation and technical resources, ensuring designers and engineers can efficiently incorporate it into a variety of wireless solutions, maintaining the brand??s commitment to performance, quality, and innovation in semiconductor technology.

FAQ

What wireless standards does this device support?

The device supports IEEE 802.11ax, commonly known as Wi-Fi 6, providing enhanced throughput and efficiency compared to previous Wi-Fi generations. It operates on both 2.4 GHz and 5 GHz frequency bands, ensuring broad compatibility with modern wireless networks.

How does the multi-user MIMO feature benefit system performance?

Multi-user MIMO allows simultaneous data transmission to multiple devices, improving overall network capacity and reducing congestion. This results in lower latency and better performance, especially in environments with many connected clients.

What interfaces are available for integrating this component?

This module supports SDIO 3.0 and PCIe 2.0 interfaces, enabling flexible connectivity options with a wide range of host processors and embedded platforms. These interfaces facilitate high-speed data transfer and ease of integration.

Is the device suitable for industrial temperature environments?

Yes, it operates reliably across a temperature range from -40??C to +85??C, making it suitable for industrial applications where temperature extremes are common. This ensures stable wireless communication in harsh conditions.

What packaging does the device use, and how does it aid in system design?

The component comes in an 88-pin ball grid array (BGA) package, which helps reduce the printed circuit board footprint and improves signal integrity. This compact form factor supports high-density designs and simplifies system-level integration.