BCM43692A1KFFBG Overview
The BCM43692A1KFFBG is a high-performance wireless communication module designed for advanced connectivity solutions. Engineered to support multi-band Wi-Fi and Bluetooth integration, it delivers robust data throughput and low latency for demanding industrial and consumer applications. Its compact footprint and optimized power consumption make it well-suited for embedded systems requiring reliable wireless connectivity. This device integrates seamlessly with modern hardware platforms, ensuring efficient signal processing and enhanced network stability. For more information, visit IC Manufacturer.
BCM43692A1KFFBG Technical Specifications
| Parameter | Specification |
|---|---|
| Wireless Standards Supported | 802.11ax (Wi-Fi 6), Bluetooth 5.0 |
| Frequency Bands | 2.4 GHz and 5 GHz dual-band support |
| Data Rate | Up to 2.4 Gbps (aggregate throughput) |
| Modulation Techniques | OFDM, 1024-QAM |
| Interface Type | PCIe Gen2, SDIO 3.0 |
| Power Supply Voltage | 3.3 V typical |
| Transmit Power | Up to 20 dBm (typical) |
| Operating Temperature Range | -40??C to +85??C |
| Package Type | Surface-mount, 12 mm ?? 12 mm module |
BCM43692A1KFFBG Key Features
- Dual-band Wi-Fi 6 support: Enables high-speed data transmission with improved network efficiency, ideal for dense wireless environments.
- Integrated Bluetooth 5.0: Facilitates seamless short-range wireless communication, enhancing device interoperability and user experience.
- Low power consumption: Designed to optimize energy use, which extends battery life in portable and embedded applications.
- High transmit power: Provides reliable signal strength and extended range for stable connectivity in challenging RF environments.
- Compact module size: Simplifies integration into space-constrained electronic designs without compromising performance.
BCM43692A1KFFBG Advantages vs Typical Alternatives
This wireless communication module offers superior sensitivity and higher data rates compared to conventional Wi-Fi/Bluetooth solutions. Its advanced integration reduces system complexity and power consumption, ensuring more reliable and efficient wireless connectivity. The dual-band capability combined with Bluetooth 5.0 support offers versatile use cases with enhanced throughput and range, making it a preferred choice for modern industrial and consumer electronics designs.
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Typical Applications
- Embedded wireless networking in IoT devices, providing high-speed internet connectivity and low-latency communication in compact form factors.
- Consumer electronics such as smart TVs and set-top boxes requiring stable dual-band Wi-Fi and Bluetooth connectivity for media streaming and device pairing.
- Industrial automation systems where reliable wireless communication is critical for remote monitoring and control.
- Portable computing devices including tablets and laptops, benefiting from efficient power management and high throughput wireless interfaces.
BCM43692A1KFFBG Brand Info
This module is developed by a leading semiconductor manufacturer known for delivering cutting-edge wireless connectivity solutions. The product line emphasizes high integration, reliability, and performance, targeting industrial-grade and consumer electronics markets. Its design reflects the brand??s commitment to supporting next-generation wireless standards with robust hardware optimized for diverse applications.
FAQ
What wireless standards does this module support?
The module supports the latest Wi-Fi 6 standard (802.11ax) along with Bluetooth 5.0. This combination ensures high-speed wireless data transfer and improved energy efficiency for both Wi-Fi and Bluetooth communications.
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What interfaces are available for integration?
It offers PCIe Gen2 and SDIO 3.0 interfaces, providing flexibility for system designers to integrate the module into various hardware platforms, including embedded systems and consumer devices.
What is the operating temperature range for reliable performance?
The device operates reliably across a wide temperature range from -40??C to +85??C, making it suitable for harsh industrial environments as well as consumer applications requiring thermal resilience.
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How does the module manage power consumption?
Power efficiency is achieved through optimized circuit design and low-power modes, enabling extended battery life in portable applications while maintaining robust wireless performance when active.
Is the module suitable for compact electronic designs?
Yes, its surface-mount package measures 12 mm by 12 mm, allowing easy integration into space-constrained designs without sacrificing wireless connectivity capabilities.
