BCM43684B1KRFBG Overview
The BCM43684B1KRFBG is a high-performance wireless communication IC designed for advanced Wi-Fi 6E applications. This device integrates multi-band support, delivering reliable and high-speed connectivity across 2.4 GHz, 5 GHz, and 6 GHz frequency bands. Engineered to meet stringent industrial and commercial requirements, it offers low power consumption combined with robust processing capabilities. Its compact package and versatile interface compatibility make it ideal for embedded systems requiring efficient, scalable wireless solutions. Sourced from a reputable IC Manufacturer, this component supports enhanced spectral efficiency, making it a suitable choice for next-generation networking hardware.
BCM43684B1KRFBG Technical Specifications
| Parameter | Specification |
|---|---|
| Wireless Standards | IEEE 802.11ax (Wi-Fi 6E), 802.11ac, 802.11n |
| Frequency Bands | 2.4 GHz, 5 GHz, 6 GHz |
| Transmit Power | Up to +20 dBm (typical) |
| Modulation Schemes | OFDM, QAM up to 1024-QAM |
| Data Rate | Up to 3.6 Gbps aggregate |
| Interface | PCIe Gen 3, SDIO 3.0 |
| Operating Voltage | 1.8 V core, 3.3 V I/O |
| Package | BGa, 12 x 12 mm |
| Temperature Range | -40??C to +85??C |
BCM43684B1KRFBG Key Features
- Multi-band Wi-Fi 6E support: Enables simultaneous operation on 2.4 GHz, 5 GHz, and 6 GHz bands, improving network capacity and reducing congestion.
- High data throughput: Supports up to 3.6 Gbps aggregate data rates, ensuring fast and reliable wireless communication for demanding applications.
- Advanced modulation techniques: Utilizes 1024-QAM modulation to boost spectral efficiency and maximize bandwidth utilization.
- Low power operation: Designed for energy-efficient performance, extending device battery life in portable and embedded systems.
- Robust industrial temperature tolerance: Operates reliably across a wide temperature range from -40??C to +85??C, suitable for harsh environments.
- Flexible interface options: Supports PCIe Gen 3 and SDIO 3.0 for seamless integration with a variety of host platforms.
- Compact BGA package: Minimizes PCB footprint, enabling space-saving system designs without compromising performance.
BCM43684B1KRFBG Advantages vs Typical Alternatives
This wireless IC delivers superior multi-band Wi-Fi 6E functionality with enhanced data rates and spectral efficiency compared to traditional Wi-Fi 5 or single-band solutions. Its low power consumption and wide operating temperature range provide improved reliability and energy efficiency, critical for industrial and embedded applications. The integration of flexible PCIe and SDIO interfaces ensures greater compatibility and ease of system integration, setting it apart from typical discrete or legacy wireless modules.
🔥 Best-Selling Products
-
Texas Instruments BQ24075 Linear Battery Charger IC – 5mm x 4mm QFN Package
-
Texas Instruments INA219 Current Sensor Module – SOIC Package, Precision Monitoring
-
Texas Instruments LM4041 Precision Voltage Reference – SOT-23 Package
-
Texas Instruments OPA2134 Audio Op Amp – Dual, High-Performance, SOIC-8 Package
Typical Applications
- High-performance wireless routers and access points requiring tri-band Wi-Fi 6E support for optimized network traffic management and improved user experience.
- Industrial IoT gateways where robust connectivity and wide temperature operation ensure reliable data transmission in challenging environments.
- Embedded computing devices such as smart TVs and set-top boxes that demand high throughput and low latency for streaming and interactive content.
- Enterprise networking equipment that benefits from advanced modulation and multi-band capabilities to support dense user environments and high data loads.
BCM43684B1KRFBG Brand Info
This wireless communication IC is part of a product portfolio from a leading semiconductor provider specializing in high-performance connectivity solutions. The brand is well-known for delivering cutting-edge Wi-Fi technologies that comply with the latest standards. With a focus on innovation and quality, the manufacturer ensures this device meets rigorous industry requirements for performance, reliability, and integration ease, supporting a broad range of applications from consumer electronics to industrial automation.
FAQ
What wireless standards does this device support?
It supports the latest IEEE 802.11ax standard, also known as Wi-Fi 6E, in addition to backward compatibility with 802.11ac and 802.11n. This ensures high data rates and improved network efficiency across multiple frequency bands.
🌟 Featured Products
-
“Buy MAX9312ECJ+ Precision Voltage Comparator in DIP Package for Reliable Performance”
-
QCC-711-1-MQFN48C-TR-03-1 Bluetooth Audio SoC with MQFN48C Package
-
0339-671-TLM-E Model – High-Performance TLM-E Package for Enhanced Functionality
-
1-1415898-4 Connector Housing, Electrical Wire-to-Board, Receptacle, Packaged
Which frequency bands can this wireless IC operate on?
The device operates on the 2.4 GHz, 5 GHz, and 6 GHz frequency bands, enabling tri-band functionality that helps reduce network congestion and enhances overall throughput.
What interfaces are supported for host communication?
It supports PCIe Gen 3 and SDIO 3.0 interfaces, providing flexible and high-speed connectivity options to integrate with a variety of host systems and embedded platforms.
📩 Contact Us
What is the operating temperature range of this component?
This IC is rated for industrial applications, supporting operation from -40??C up to +85??C, making it suitable for use in environments with wide and challenging temperature variations.
How does this device improve power efficiency in wireless applications?
Designed with low power consumption in mind, it optimizes energy usage during transmission and reception phases, which helps extend the battery life of portable devices and reduces overall system power requirements.
