BCM4360KMLGT Overview
The BCM4360KMLGT is a high-performance wireless connectivity solution designed for advanced networking applications. Featuring robust integration and efficient power management, it supports simultaneous dual-band operation, enabling reliable and high-speed data transfer in complex wireless environments. This device offers enhanced modulation techniques and improved receiver sensitivity for superior signal quality. Ideal for engineers and sourcing specialists seeking a versatile semiconductor component, it ensures seamless integration in industrial and consumer electronics. For detailed product sourcing and technical assistance, visit IC Manufacturer.
BCM4360KMLGT Technical Specifications
| Parameter | Specification |
|---|---|
| Operating Frequency | 2.4 GHz / 5 GHz Dual-Band |
| Modulation | 802.11ac Wave 2, 256-QAM |
| Maximum Data Rate | Up to 1.3 Gbps |
| Transmit Power | Up to 20 dBm |
| Receiver Sensitivity | -92 dBm @ 54 Mbps |
| Power Supply Voltage | 3.3 V DC |
| Package Type | QFN, 88 pins |
| Operating Temperature Range | -40??C to +85??C |
| Interface | SDIO 3.0, PCIe |
BCM4360KMLGT Key Features
- Dual-Band Support: Enables simultaneous operation on 2.4 GHz and 5 GHz bands, enhancing network capacity and reducing interference for more stable wireless communication.
- High Data Throughput: Supports 802.11ac Wave 2 technology with 256-QAM modulation, delivering up to 1.3 Gbps data rates to meet demanding bandwidth requirements.
- Enhanced Power Efficiency: Optimized power management reduces energy consumption during operation, extending device runtime and lowering thermal impact in embedded systems.
- Improved Receiver Sensitivity: Achieves -92 dBm sensitivity at 54 Mbps, ensuring reliable connectivity in environments with weak signals or high noise levels.
BCM4360KMLGT Advantages vs Typical Alternatives
This device offers superior integration by combining dual-band capabilities and high data throughput in a compact package. Its advanced modulation and receiver sensitivity provide more reliable connections and higher accuracy in signal reception compared to typical alternatives. Additionally, efficient power management supports longer operational life and system stability, making it a preferred choice for industrial and consumer wireless applications.
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Typical Applications
- Wireless access points and routers requiring high-speed, dual-band connectivity with stable performance in dense network environments.
- Embedded wireless modules in industrial IoT devices where reliable long-range communication is critical.
- Consumer electronics such as smart TVs and streaming devices that demand high data rates and minimal latency.
- Network interface cards (NICs) in laptops or desktops aiming to provide seamless Wi-Fi 5 connectivity.
BCM4360KMLGT Brand Info
The BCM4360KMLGT is a product from a leading semiconductor manufacturer specializing in wireless communication solutions. Known for delivering cutting-edge ICs that combine performance, reliability, and integration ease, this product line supports the latest Wi-Fi standards to meet evolving industry requirements. It is engineered with rigorous quality controls and designed for straightforward implementation in diverse applications, reflecting the brand??s commitment to innovation and customer support.
FAQ
What wireless standards does the BCM4360KMLGT support?
This component supports the IEEE 802.11ac standard, also known as Wi-Fi 5, with Wave 2 capabilities. It enables multi-user MIMO and 256-QAM modulation to provide enhanced throughput and efficiency compared to earlier Wi-Fi generations.
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Can this device operate in both 2.4 GHz and 5 GHz frequency bands simultaneously?
Yes, it is designed for dual-band operation, allowing simultaneous use of 2.4 GHz and 5 GHz frequencies. This helps optimize bandwidth and reduce interference, especially in environments with multiple wireless devices.
What are the power requirements for integrating this wireless chip?
The BCM4360KMLGT operates at a supply voltage of 3.3 volts DC. It features optimized power management techniques to minimize energy consumption during active and idle states, supporting efficient system design.
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What package type does this chip come in, and how does it affect integration?
The device is packaged in an 88-pin QFN (Quad Flat No-lead) form factor. This compact and low-profile package facilitates high-density PCB layouts and supports reliable thermal performance, aiding easier integration into compact devices.
Is the BCM4360KMLGT suitable for industrial temperature ranges?
Yes, it supports an operating temperature range from -40??C to +85??C, making it suitable for various industrial and outdoor wireless applications where temperature extremes are a concern.






