BCM43520IMLG Overview
The BCM43520IMLG is a highly integrated wireless connectivity solution designed for embedded industrial and consumer applications. This compact module combines dual-band Wi-Fi and Bluetooth functionality, offering robust performance in a single package. Its integration supports reliable communication protocols suitable for IoT devices, smart home systems, and portable electronics. Optimized for low power consumption and compact footprint, the module simplifies system design while maintaining high throughput. Engineers and sourcing specialists will appreciate its compatibility with diverse platforms and straightforward integration, reinforcing its role as a versatile wireless connectivity component. For detailed product information, visit IC Manufacturer.
BCM43520IMLG Technical Specifications
| Parameter | Specification |
|---|---|
| Wireless Standards | IEEE 802.11a/b/g/n/ac, Bluetooth 5.0 |
| Frequency Bands | 2.4 GHz and 5 GHz dual-band support |
| Wi-Fi Data Rates | Up to 433 Mbps (802.11ac) |
| Bluetooth Profiles | Classic and Low Energy (LE) support |
| Interface Type | SDIO 3.0 for Wi-Fi, UART for Bluetooth |
| Operating Voltage | 3.3 V typical |
| Package Dimensions | 13.0 mm x 13.0 mm x 1.8 mm |
| Operating Temperature Range | -40??C to +85??C |
BCM43520IMLG Key Features
- Integrated Dual-Band Wi-Fi and Bluetooth: Enables simultaneous wireless connectivity, reducing the need for multiple modules and enhancing design simplicity.
- High Data Throughput: Supports 802.11ac standard with data rates up to 433 Mbps, ensuring fast and reliable wireless communication for demanding applications.
- Low Power Consumption: Designed to optimize energy efficiency, prolonging battery life in portable and IoT devices.
- Compact Form Factor: Small package size suits space-constrained environments, facilitating integration into compact electronics.
- Wide Operating Temperature Range: Suitable for industrial applications requiring reliable performance under harsh environmental conditions.
- Flexible Interface Support: SDIO 3.0 and UART interfaces simplify connection to host processors, promoting straightforward system integration.
- Enhanced Bluetooth 5.0 Support: Provides improved range, speed, and coexistence with Wi-Fi, supporting diverse wireless applications.
BCM43520IMLG Advantages vs Typical Alternatives
This wireless module offers superior integration by combining dual-band Wi-Fi and Bluetooth 5.0 in a single compact package, which reduces board space and simplifies design complexity. Its low power profile and wide temperature tolerance enhance reliability in industrial and consumer applications. Compared to typical alternatives, it delivers higher throughput and better coexistence performance, ensuring robust wireless connectivity in challenging environments.
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Typical Applications
- Industrial IoT Gateways and Controllers: Provides reliable dual-band wireless communication and Bluetooth connectivity for sensor networks and automation systems.
- Smart Home Devices: Enables seamless integration of Wi-Fi and Bluetooth for smart speakers, lighting control, and home security systems.
- Portable Consumer Electronics: Supports high-speed wireless data transfer and low-power operation in handheld devices and wearables.
- Embedded Wireless Modules: Suitable for OEMs requiring a compact, integrated connectivity solution for various embedded applications.
BCM43520IMLG Brand Info
The BCM43520IMLG is part of a family of wireless connectivity solutions developed by a leading semiconductor manufacturer known for innovation in communication technologies. This product exemplifies the brand??s commitment to delivering high-performance, integrated modules that meet the demanding needs of industrial and consumer markets. Designed with a focus on reliability, efficiency, and ease of integration, it continues the tradition of quality and advanced wireless solutions from this trusted supplier.
FAQ
What wireless standards does the BCM43520IMLG support?
The module supports IEEE 802.11a/b/g/n/ac Wi-Fi standards alongside Bluetooth 5.0, enabling dual-band wireless connectivity across 2.4 GHz and 5 GHz frequencies. This ensures compatibility with contemporary wireless networks and devices.
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How does the BCM43520IMLG manage power consumption?
Designed with energy efficiency in mind, the module incorporates low-power modes and optimized hardware to reduce power draw during active and idle states. This makes it suitable for battery-operated devices requiring extended operational life.
What interfaces are available to connect the module to a host processor?
The module utilizes an SDIO 3.0 interface for Wi-Fi communication and a UART interface for Bluetooth. These industry-standard interfaces facilitate straightforward integration with various microcontrollers and processors.
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Can the module operate in harsh industrial environments?
Yes, it is rated for operation across a wide temperature range from -40??C to +85??C, making it reliable for industrial applications exposed to varying environmental conditions.
What are the physical dimensions of the BCM43520IMLG?
The compact module measures 13.0 mm by 13.0 mm with a height of 1.8 mm, allowing integration into space-constrained designs without compromising performance or functionality.
