BCM43460IMLG Overview
The BCM43460IMLG is a compact, integrated wireless solution designed for embedded applications requiring robust Wi-Fi and Bluetooth connectivity. This highly integrated device supports dual-band 2.4 GHz and 5 GHz Wi-Fi standards alongside Bluetooth 5.0, ensuring versatile wireless communication capabilities. It offers a low-power profile and high data throughput, making it ideal for industrial IoT, smart home, and portable electronics. With its small footprint and multi-protocol support, it simplifies system design while enhancing connectivity performance. For detailed technical support and sourcing, visit IC Manufacturer.
BCM43460IMLG Technical Specifications
| Parameter | Specification |
|---|---|
| Wireless Standards | 802.11ac Wave 2, 802.11a/b/g/n |
| Bluetooth Version | Bluetooth 5.0 (Classic + LE) |
| Frequency Bands | 2.4 GHz and 5 GHz dual-band support |
| Data Rates | Up to 433 Mbps (802.11ac HT80) |
| Interface | SDIO 3.0 for Wi-Fi, UART/SPI for Bluetooth |
| Power Supply | 3.3 V ??5% |
| Operating Temperature | -40??C to +85??C industrial grade |
| Package Type | 35-pin LGA (Land Grid Array) |
| Transmit Power | Up to +19 dBm (2.4 GHz), +17 dBm (5 GHz) |
BCM43460IMLG Key Features
- Dual-band Wi-Fi support: Enables simultaneous 2.4 GHz and 5 GHz operation, providing improved network flexibility and reduced interference for stable wireless connections.
- Bluetooth 5.0 integration: Offers enhanced range and data throughput, supporting both classic Bluetooth and low energy modes to optimize power consumption in connected devices.
- Low power consumption: Designed for energy-efficient operation, this module extends battery life in portable and IoT applications without compromising wireless performance.
- Compact LGA package: Facilitates easy integration into space-constrained designs, reducing PCB area and simplifying manufacturing processes.
BCM43460IMLG Advantages vs Typical Alternatives
This device delivers superior wireless performance and integration compared to typical modules by supporting the latest 802.11ac Wave 2 standard with high data rates and dual-band connectivity. Its combined Wi-Fi and Bluetooth 5.0 functionality enhances system reliability and flexibility while maintaining low power usage. The industrial-grade temperature range and compact footprint further differentiate it from alternatives, making it a robust choice for demanding embedded applications.
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Typical Applications
- Industrial IoT gateways and controllers requiring reliable dual-band Wi-Fi and Bluetooth connectivity for sensor integration and data transmission in harsh environments.
- Smart home devices such as thermostats and security cameras benefiting from seamless wireless communication and low power operation.
- Portable consumer electronics including handheld scanners and wearable devices that demand compact modules with multi-protocol support.
- Embedded networking modules in automotive infotainment systems, where robust wireless performance and temperature resilience are critical.
BCM43460IMLG Brand Info
This module is developed under a leading semiconductor vendor known for delivering advanced wireless connectivity solutions. It combines cutting-edge Wi-Fi and Bluetooth technologies in a single, highly integrated device optimized for industrial and consumer embedded applications. The design emphasizes ease of integration, reliability, and energy efficiency, making it a preferred choice in the evolving wireless communication landscape.
FAQ
What wireless standards does this module support?
It supports dual-band Wi-Fi including 802.11ac Wave 2, as well as legacy 802.11a/b/g/n standards. Additionally, it features Bluetooth 5.0, covering both classic Bluetooth and low energy protocols to ensure broad compatibility.
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Can this device operate in industrial temperature ranges?
Yes, it is rated for operation from -40??C to +85??C, making it suitable for industrial and harsh environment applications where temperature stability is crucial.
What interfaces are available for connecting to host processors?
The module offers an SDIO 3.0 interface for Wi-Fi communication and UART or SPI interfaces for Bluetooth connectivity, allowing flexible integration with various host systems.
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How does the module manage power consumption?
It features optimized power management to support low power modes during Bluetooth LE operation and efficient Wi-Fi transmission, which helps extend battery life in portable and IoT devices.
What packaging does the module use, and how does it benefit design?
The compact 35-pin Land Grid Array package minimizes PCB space requirements and supports automated assembly processes, facilitating integration into small form factor products while maintaining signal integrity.
