BCM43431KMLG Overview
The BCM43431KMLG is a highly integrated single-chip solution designed to deliver reliable 802.11b/g/n Wi-Fi connectivity combined with Bluetooth 4.0 functionality. This compact module supports low power consumption and high data throughput, making it ideal for space-constrained applications requiring robust wireless communication. The device integrates a complete Wi-Fi and Bluetooth baseband, radio, and power amplifier, reducing external component count and simplifying system design. Provided by a leading IC Manufacturer, it targets embedded systems requiring efficient, dual-mode wireless performance with proven interoperability and compliance to relevant standards.
BCM43431KMLG Technical Specifications
| Parameter | Specification |
|---|---|
| Wireless Standards Supported | 802.11b/g/n (2.4 GHz), Bluetooth 4.0 BR/EDR/LE |
| Operating Frequency | 2.4 GHz ISM Band |
| Transmit Power | Up to +18 dBm (typical) |
| Receiver Sensitivity | -90 dBm (typical for 802.11b) |
| Power Supply Voltage | 3.3 V nominal |
| Package Type | Surface-mount LGA package |
| Interface | SDIO 3.0 for Wi-Fi, UART for Bluetooth |
| Operating Temperature Range | -40??C to +85??C |
| Dimensions | 10 mm x 10 mm x 1.2 mm (typical) |
BCM43431KMLG Key Features
- Dual-mode Wi-Fi and Bluetooth integration: Enables simultaneous wireless communication on both protocols, reducing BOM and board space requirements.
- High transmit power and sensitivity: Supports stable connections and extended range, crucial for industrial and embedded applications demanding reliable wireless links.
- Low power consumption design: Optimizes battery life in portable and IoT devices by efficiently managing power during active and standby modes.
- Compact LGA package: Facilitates easy surface mounting, enabling integration into space-constrained designs without compromising performance.
- Comprehensive interface support: Includes SDIO 3.0 and UART interfaces, providing flexible connectivity options for host processors and system architectures.
BCM43431KMLG Advantages vs Typical Alternatives
This device offers a highly integrated wireless solution combining Wi-Fi and Bluetooth on a single chip, reducing overall system complexity and cost compared to discrete modules. Its superior sensitivity and transmit power enhance communication reliability, while the low power consumption supports extended operation in battery-powered environments. The compact package and versatile interfaces further distinguish it from typical alternatives, providing ease of integration and robust performance in industrial and embedded applications.
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Typical Applications
- Embedded wireless modules for IoT devices, enabling seamless Wi-Fi and Bluetooth connectivity in compact form factors for smart home and industrial automation systems.
- Portable handheld devices requiring reliable dual-mode wireless communication with minimized power consumption and board space.
- Consumer electronics integrating wireless networking capabilities such as streaming media devices and wireless printers.
- Industrial control systems needing robust, low-latency wireless communication over 2.4 GHz bands in harsh environments.
BCM43431KMLG Brand Info
This wireless combo solution is offered by a top-tier semiconductor manufacturer renowned for delivering high-performance connectivity ICs. The product family is designed to meet stringent industrial standards and supports a wide range of wireless protocols on a single-chip platform. Known for its high integration level, reliability, and power efficiency, this IC aligns with the manufacturer??s commitment to enabling advanced wireless functionality in compact embedded and IoT applications worldwide.
FAQ
What wireless standards does this module support?
The device supports IEEE 802.11b/g/n Wi-Fi standards operating in the 2.4 GHz ISM band, along with Bluetooth 4.0 including Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) modes. This dual-mode capability ensures broad compatibility with common wireless networks and Bluetooth peripherals.
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What are the power supply requirements for this device?
The module operates typically at a 3.3 V supply voltage. It is designed to optimize power consumption during both active data transmission and low-power standby modes, making it suitable for battery-operated and energy-sensitive applications.
How does the device interface with host systems?
For Wi-Fi functionality, it uses an SDIO 3.0 interface, which provides high-speed data transfer and ease of integration with embedded processors. The Bluetooth component communicates via a UART interface, allowing flexible connection to a wide variety of microcontrollers and host platforms.
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What is the operating temperature range of this wireless IC?
The device supports an extended operating temperature range from -40??C to +85??C, enabling deployment in demanding industrial environments and outdoor applications where temperature extremes are common.
How does the compact packaging benefit system designers?
The surface-mount LGA package measures approximately 10 mm by 10 mm with a low profile, helping engineers save PCB real estate. This compact form factor simplifies mechanical design and allows integration into small or space-constrained products without sacrificing wireless performance.
