BCM43242KFFBGT Overview
The BCM43242KFFBGT is a highly integrated wireless communication chipset designed for advanced connectivity solutions. It combines multiple wireless standards into a single compact package, optimizing performance for embedded applications. This device supports simultaneous dual-band operation, offering robust Wi-Fi connectivity alongside Bluetooth functionality. Its integration reduces system complexity, improving reliability and lowering overall solution cost. Engineers and sourcing specialists benefit from its proven multi-protocol support and compatibility with industry-standard interfaces. For more detailed information and technical support, visit IC Manufacturer.
BCM43242KFFBGT Technical Specifications
| Parameter | Specification |
|---|---|
| Wireless Standards Supported | 802.11a/b/g/n (2.4 GHz & 5 GHz), Bluetooth 4.0 |
| Operating Frequency | 2.4 GHz and 5 GHz bands |
| Transmit Power | Up to 20 dBm (typical) |
| Receiver Sensitivity | -90 dBm (typical for 802.11n) |
| Interface Support | SDIO 3.0, PCM, UART |
| Power Supply Voltage | 3.3 V (typical) |
| Package Type | FBGA (Fine-pitch Ball Grid Array) |
| Operating Temperature Range | -40??C to +85??C |
| Dimensions | 7 mm x 7 mm (approximate) |
BCM43242KFFBGT Key Features
- Multi-mode Wireless Connectivity: Supports concurrent Wi-Fi and Bluetooth operation, enabling seamless data transfer and device pairing in embedded systems.
- Dual-Band Operation: Operates in both 2.4 GHz and 5 GHz bands, providing enhanced network flexibility and reduced interference for stable connections.
- Low Power Consumption: Designed with power efficiency in mind, it extends battery life in portable and IoT applications without compromising performance.
- Compact FBGA Packaging: Its small footprint simplifies integration into space-constrained designs while maintaining thermal performance.
BCM43242KFFBGT Advantages vs Typical Alternatives
This device offers superior integration by combining Wi-Fi and Bluetooth in a single module, reducing component count and PCB complexity. Its dual-band capability enhances wireless reliability and throughput compared to single-band alternatives. Additionally, the chipset??s low power profile and robust receiver sensitivity improve system efficiency and communication accuracy, making it a preferred choice for embedded wireless applications demanding compactness and performance.
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Typical Applications
- Embedded wireless modules in industrial IoT devices requiring reliable dual-band Wi-Fi and Bluetooth connectivity for sensor data transmission and control.
- Consumer electronics such as smart home hubs and wearables needing compact, low-power wireless communication solutions.
- Portable medical devices where stable wireless links and power efficiency are critical for patient monitoring and data transfer.
- Automotive infotainment systems integrating Bluetooth and Wi-Fi for enhanced connectivity and multimedia streaming.
BCM43242KFFBGT Brand Info
This chipset is part of a widely recognized portfolio from a leading semiconductor manufacturer specializing in wireless communication solutions. Known for reliability and advanced integration, the product is engineered to meet stringent industrial and consumer standards. Its design supports robust firmware and driver ecosystems, facilitating rapid development cycles and deployment in diverse markets. The brand??s commitment to innovation ensures continuous support and compatibility with evolving wireless protocols.
FAQ
What wireless standards does this chipset support?
The device supports multiple wireless standards including IEEE 802.11a/b/g/n for Wi-Fi across both 2.4 GHz and 5 GHz frequency bands, and Bluetooth 4.0. This combination enables versatile connectivity options for various applications.
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How does the dual-band operation benefit system design?
Dual-band functionality allows the chipset to operate on both 2.4 GHz and 5 GHz frequencies, which reduces interference and congestion in crowded wireless environments. This results in improved reliability and higher data throughput for connected devices.
What interfaces are available for integrating this device into a system?
The chipset supports multiple industry-standard interfaces including SDIO 3.0 for data communication, PCM for audio data, and UART for debugging or control signals. These interfaces provide flexibility in system integration and compatibility with various host processors.
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What are the power requirements and consumption characteristics?
It operates typically at a 3.3 V power supply and is designed with low power consumption in mind to extend battery life in portable and embedded applications. Efficient power management helps maintain system stability and reduces thermal stress.
Is this device suitable for harsh industrial environments?
Yes, the operating temperature range from -40??C to +85??C ensures reliable performance in demanding industrial conditions. Its robust packaging and design support stable operation in environments with temperature fluctuations and potential mechanical stresses.
