BCM43236BKML1GT Overview
The BCM43236BKML1GT is a high-performance wireless communication module designed for advanced industrial and consumer electronics applications. It integrates multiple functions into a single compact package, enabling efficient Wi-Fi connectivity with enhanced power management. This device supports robust data transfer rates and provides reliable network performance, making it ideal for embedded systems requiring seamless wireless capability. Its compact form factor and optimized power consumption suit demanding environments where space and energy efficiency are critical. For more detailed technical support and procurement, visit IC Manufacturer.
BCM43236BKML1GT Technical Specifications
| Parameter | Specification |
|---|---|
| Operating Frequency | 2.4 GHz ISM Band |
| Wireless Standard | IEEE 802.11b/g/n |
| Modulation | BPSK, QPSK, CCK, OFDM |
| Transmit Power | Up to +18 dBm |
| Receive Sensitivity | -91 dBm at 11 Mbps |
| Power Supply Voltage | 3.3 V ?? 0.3 V |
| Package | QFN 48-pin, 7×7 mm |
| Operating Temperature | -40??C to +85??C |
| Interface | SDIO 2.0, UART, PCM |
BCM43236BKML1GT Key Features
- Integrated Wi-Fi Connectivity: Supports IEEE 802.11b/g/n standards, delivering high-speed wireless data transmission suitable for various embedded applications.
- Advanced Power Management: Incorporates low-power modes that reduce energy consumption during idle periods, extending battery life in portable devices.
- Robust RF Performance: High transmit power paired with excellent receive sensitivity ensures stable connections even in challenging environments.
- Compact QFN Package: The small 7×7 mm footprint facilitates easy integration into space-constrained designs without compromising performance.
BCM43236BKML1GT Advantages vs Typical Alternatives
This device offers superior integration by combining wireless capabilities and power management in a compact module. Its enhanced receive sensitivity and transmit power provide better range and reliability compared to typical solutions. Additionally, the support for multiple interfaces such as SDIO and UART simplifies system integration and reduces overall design complexity.
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Typical Applications
- Embedded wireless modules for IoT devices requiring reliable 2.4 GHz Wi-Fi connectivity and low power consumption in industrial or consumer environments.
- Smart home appliances that demand seamless network access for remote control and monitoring capabilities.
- Portable instrumentation where compact size and efficient wireless communication are critical.
- Wireless-enabled handheld devices that benefit from robust data throughput and extended battery life.
BCM43236BKML1GT Brand Info
The BCM43236BKML1GT is part of a well-established portfolio of wireless communication products offered by a leading semiconductor manufacturer. Known for delivering high-quality integrated circuits, this brand focuses on combining innovation with reliability to support a wide range of industrial and commercial applications. The module??s design reflects the company??s commitment to providing scalable and efficient wireless solutions tailored to meet modern connectivity demands.
FAQ
What wireless standards does this module support?
The module supports IEEE 802.11b, 802.11g, and 802.11n standards, enabling compatibility with a broad range of Wi-Fi networks commonly used in both consumer and industrial applications.
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What interfaces are available for system integration?
It offers multiple interfaces including SDIO 2.0 for high-speed data transfer, UART for serial communication, and PCM for audio data, providing flexibility in connecting to various host processors.
What is the operating temperature range of this device?
The module is designed to operate reliably in environments ranging from -40??C to +85??C, making it suitable for harsh industrial conditions as well as consumer electronics.
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How does the power management feature benefit system designers?
Integrated low-power modes help reduce energy consumption during periods of inactivity, which is essential for battery-powered devices, thus extending operational life without sacrificing connectivity.
What is the physical footprint of the module?
The compact QFN package measures 7×7 millimeters with 48 pins, allowing engineers to incorporate the module into size-constrained designs while maintaining ease of assembly.
