BAR6306E6327HTSA1 Overview
The BAR6306E6327HTSA1 is a high-performance Schottky diode array designed for general-purpose signal routing, switching, and rectification tasks in industrial and consumer electronics. Its compact SOT-23-6 package supports space-saving PCB layouts, while the low forward voltage drop and fast switching characteristics make it ideal for modern circuit protection and signal conditioning. Engineered for robust performance and reliable operation, this component is well-suited for applications demanding efficiency and integration. For further details, visit IC Manufacturer.
BAR6306E6327HTSA1 Technical Specifications
| Parameter | Value |
|---|---|
| Product Type | Schottky Diode Array |
| Configuration | 6 elements in array |
| Package / Case | SOT-23-6 |
| Mounting Style | Surface Mount (SMD/SMT) |
| Reverse Voltage (VR) | 35 V |
| Forward Current (IF) | 100 mA |
| Forward Voltage (VF) | 0.9 V (typical) |
| Operating Temperature Range | -55??C to +150??C |
| Reverse Current (IR) | 2 ??A (maximum) |
BAR6306E6327HTSA1 Key Features
- Low forward voltage drop minimizes power losses, which increases overall circuit efficiency and reduces heat generation.
- Fast switching speed supports high-frequency applications, ensuring precise signal routing for digital and analog designs.
- Compact SOT-23-6 package optimizes board space, making it suitable for densely populated layouts and modern miniaturized electronics.
- Robust operating temperature range from -55??C to +150??C, providing reliable operation in industrial and automotive environments.
BAR6306E6327HTSA1 Advantages vs Typical Alternatives
Compared to conventional diodes, this Schottky array offers lower forward voltage and faster switching performance, enabling reduced power consumption and improved signal fidelity. Its integrated multi-diode configuration and compact footprint streamline PCB design, supporting enhanced reliability and efficient assembly for high-density applications.
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Typical Applications
- High-speed signal clamping and ESD protection in digital circuits, where a fast, low-leakage diode array is essential for preserving signal integrity and safeguarding sensitive components.
- Rectification in low-voltage power supplies, taking advantage of the low forward voltage and fast response time to maximize efficiency and minimize losses.
- Logic level shifting in mixed-signal systems, where precise voltage control and minimal power dissipation are critical for reliable operation.
- Switching and isolation in analog and RF circuits, leveraging the low capacitance and high-speed characteristics to ensure minimal signal distortion.
BAR6306E6327HTSA1 Brand Info
The BAR6306E6327HTSA1 is produced by a recognized semiconductor manufacturer renowned for its reliable and innovative discrete components. This Schottky diode array is engineered to meet the demanding requirements of industrial, automotive, and high-performance consumer electronics. With a focus on quality and integration, the device reflects the brand??s commitment to enabling efficient, robust, and cost-effective electronic designs.
FAQ
What makes the BAR6306E6327HTSA1 suitable for high-density PCB layouts?
Its SOT-23-6 surface-mount package is highly compact, allowing designers to save valuable board space. This facilitates integration in modern electronics where miniaturization and high component density are priorities.
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Can this Schottky array handle temperature extremes in industrial environments?
Yes, the device is designed to operate reliably within a wide temperature range of -55??C to +150??C, making it well-suited for harsh industrial and automotive settings where temperature stability is crucial.
How does the low forward voltage benefit my application?
The low forward voltage drop (typically 0.9 V) reduces conduction losses, improving energy efficiency and minimizing heat generation in power-sensitive and high-frequency circuits.
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Is the BAR6306E6327HTSA1 appropriate for ESD protection?
Absolutely. Its fast switching characteristics and low leakage current make it an effective choice for clamping voltage spikes and protecting sensitive logic or analog signals from electrostatic discharge events.
What mounting method is recommended for this component?
It is designed for surface-mount technology (SMD/SMT), supporting automated assembly processes and ensuring stable, low-profile installation on printed circuit boards for both prototyping and mass production.





