BA885E6327HTSA1 EMI Filter, 6A, SMD, SMD-2422 Package ÿ Infineon Model

  • Provides a specific electronic function that supports efficient circuit performance in various systems.
  • Offers compatibility with standard surface-mount assembly, streamlining manufacturing and repair processes.
  • Compact package design enables board-space savings, making it suitable for dense or portable device layouts.
  • Ideal for use in embedded control applications, helping optimize device operation and system integration.
  • The BA885E6327HTSA1 is designed for consistent operation, contributing to overall system reliability.
SKU: BA885E6327HTSA1 Category: Brand:
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产品上方询盘

BA885E6327HTSA1 Overview

The BA885E6327HTSA1 is a high-performance integrated circuit designed for demanding industrial and commercial applications. With a robust set of electrical and environmental characteristics, this device is engineered for reliability in harsh operating environments. Its advanced features and compact SOT-23-6 package make it an ideal choice for space-constrained designs where efficiency and stable performance are critical. Thanks to its lead-free, RoHS-compliant construction and tape-and-reel packaging, the component supports streamlined manufacturing and environmentally responsible assembly processes. For more details, visit IC Manufacturer.

BA885E6327HTSA1 Technical Specifications

Parameter Value
Manufacturer Part Number BA885E6327HTSA1
Package / Case SOT-23-6
Mounting Type Surface Mount
Packaging Tape & Reel (TR)
RoHS Status Lead Free / RoHS Compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Standard Package Quantity 3000

BA885E6327HTSA1 Key Features

  • Compact SOT-23-6 package enables high-density circuit designs, minimizing board space requirements while maintaining optimal electrical performance.
  • Surface mount configuration facilitates automated assembly processes, reducing labor costs and increasing production throughput for manufacturers.
  • RoHS-compliant and lead-free materials support environmentally friendly design and compliance with global regulatory standards.
  • Supplied on tape and reel for compatibility with high-speed pick-and-place machines, streamlining the manufacturing workflow.

BA885E6327HTSA1 Advantages vs Typical Alternatives

This device offers a significant edge over comparable alternatives by combining a compact SOT-23-6 form factor with RoHS compliance and bulk packaging for efficient assembly. Its lead-free design ensures alignment with the latest environmental directives, while the surface mount package supports robust reliability in automated processes. These related function words highlight its suitability for modern, volume-driven production environments.

Typical Applications

  • Industrial control systems: Ideal for integration into programmable logic controllers and automation modules, where reliable, compact components are required for long-term operation.
  • Consumer electronics: Suitable for use in space-constrained consumer devices, supporting efficient circuit layouts and streamlined assembly.
  • Automotive electronics: Can be utilized in non-safety critical automotive modules that demand surface-mount, RoHS-compliant solutions.
  • Communication equipment: Fits into networking devices where board space and assembly efficiency are important considerations.

BA885E6327HTSA1 Brand Info

The BA885E6327HTSA1 is supplied by a recognized leader in semiconductor innovation, ensuring access to high-quality, application-optimized IC solutions. This component stands out for its robust compliance with global standards, reliable packaging, and compatibility with modern automated assembly lines. Designed with the needs of OEMs and contract manufacturers in mind, it delivers dependable performance across a wide range of industrial and commercial sectors.

FAQ

What is the packaging format for the BA885E6327HTSA1, and why is it important?

This component is supplied in tape and reel packaging, which is specifically designed for compatibility with automated pick-and-place machines. This format streamlines the assembly process, reduces handling errors, and supports high-volume manufacturing environments.

How does the surface mount configuration benefit manufacturing processes?

The surface mount SOT-23-6 package allows for direct placement onto printed circuit boards using automated equipment. This increases throughput, minimizes manual intervention, and enhances the overall reliability of the assembled product due to consistent soldering quality.

Is this device compliant with environmental regulations?

Yes, it is lead-free and fully RoHS compliant. This ensures that products incorporating this device meet strict international environmental standards, making it suitable for global markets and eco-conscious applications.

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产品中间询盘

What volume constraints apply when sourcing this component?

The standard package quantity is 3000 units per reel, which is optimal for medium to large-scale manufacturing runs. This bulk packaging format helps reduce procurement overhead and supports efficient inventory management for OEMs and contract manufacturers.

Where can I find additional technical documentation or sourcing support?

For further technical information, datasheets, or supply chain support, you can consult the official product page via authorized distributors or visit the manufacturer??s official website. Technical support and additional purchasing resources are readily available to assist engineering and sourcing professionals.

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