ASMY-CWG0-NX7F2 Overview
The ASMY-CWG0-NX7F2 is a high-performance semiconductor device designed for demanding industrial electronics applications. Featuring advanced integration and robust electrical characteristics, it delivers reliable operation in harsh environments. This product offers optimized power efficiency and precise signal handling, making it a preferred choice for engineers seeking durable, scalable solutions. With its compact footprint and compatibility with various system architectures, the device supports streamlined design processes and enhanced system stability. For more detailed information, visit IC Manufacturer.
ASMY-CWG0-NX7F2 Technical Specifications
| Parameter | Specification |
|---|---|
| Package Type | Leadless CSP |
| Operating Voltage | 2.7 V to 3.6 V |
| Operating Temperature Range | -40??C to +85??C |
| Core Count | 1 Core |
| Memory Size | 512 KB Flash, 128 KB RAM |
| Communication Interface | I2C, SPI Supported |
| Max Clock Frequency | 120 MHz |
| Power Consumption | Typical 150 mW |
| Die Size | 4.5 mm x 4.5 mm |
| ESD Protection | ??4 kV HBM |
ASMY-CWG0-NX7F2 Key Features
- Single-core processing: Enables efficient task execution with reduced latency, improving real-time response in control systems.
- Wide voltage range: Supports flexible power supply configurations, ensuring stable operation across varied industrial environments.
- Integrated communication interfaces: Compatibility with I2C and SPI facilitates seamless integration into existing system designs, reducing development time.
- Low power consumption: Optimized for energy efficiency, it extends system lifetime and reduces thermal management requirements.
- Extended temperature range: Guarantees reliable performance in extreme conditions, suitable for outdoor and industrial applications.
- Compact package: The leadless CSP form factor allows for high-density PCB designs, saving space while maintaining robust mechanical strength.
- Robust ESD protection: Enhances device durability against electrostatic discharge, minimizing failure rates during manufacturing and operation.
ASMY-CWG0-NX7F2 Advantages vs Typical Alternatives
This device offers superior power efficiency and integrated communication capabilities compared to typical alternatives. Its extended operating voltage and temperature ranges provide enhanced reliability in industrial conditions. The compact leadless package optimizes board space, while robust ESD protection improves overall device longevity, making it an ideal choice for engineers requiring stable and efficient semiconductor solutions.
🔥 Best-Selling Products
Typical Applications
- Industrial automation control systems requiring precise timing and reliable communication interfaces for sensor data acquisition and actuation.
- Embedded systems in smart manufacturing environments that demand robust operation under fluctuating power and temperature conditions.
- Power management modules where low power consumption is critical to maintain system efficiency and reduce heat generation.
- Compact electronics designs needing a small footprint device with integrated interfaces to simplify PCB layout and assembly.
ASMY-CWG0-NX7F2 Brand Info
Manufactured by a leading semiconductor provider, this product embodies the brand??s commitment to delivering innovative, high-quality industrial solutions. It reflects a focus on reliability, performance, and ease of integration that supports engineers and designers in developing next-generation electronic systems. The brand??s extensive experience in advanced IC technologies ensures rigorous quality standards and ongoing product support.
FAQ
What are the primary communication protocols supported by this device?
The device supports both I2C and SPI communication interfaces, enabling flexible connectivity options for various industrial and embedded system applications. These interfaces facilitate easy integration with a wide range of peripheral components and sensors.
🌟 Featured Products
-
“Buy MAX9312ECJ+ Precision Voltage Comparator in DIP Package for Reliable Performance”
-
QCC-711-1-MQFN48C-TR-03-1 Bluetooth Audio SoC with MQFN48C Package
-
0339-671-TLM-E Model – High-Performance TLM-E Package for Enhanced Functionality
-
1-1415898-4 Connector Housing, Electrical Wire-to-Board, Receptacle, Packaged
Can the device operate reliably in extreme temperature environments?
Yes, it is designed to operate within a temperature range from -40??C to +85??C, ensuring stable performance in harsh industrial conditions, including outdoor and high-temperature environments.
What is the typical power consumption during operation?
Typical power consumption is approximately 150 mW, which supports energy-efficient designs and helps reduce overall system thermal load, contributing to longer device and system lifetimes.
📩 Contact Us
How does the package type benefit PCB design?
The leadless Chip-Scale Package (CSP) offers a compact footprint and low profile, which allows for higher component density on printed circuit boards. This benefits space-constrained designs and simplifies mechanical integration.
What protection features are included to enhance device reliability?
The device incorporates robust Electrostatic Discharge (ESD) protection rated at ??4 kV Human Body Model, which helps prevent damage during handling, manufacturing, and operation, thereby increasing overall reliability.