ASMF-LWG8-NSVJD High-Speed Memory IC Chip – Bulk Pack

  • ASMF-LWG8-NSVJD provides precise signal processing for improved system accuracy and performance.
  • Features a high-speed interface enabling efficient data transfer critical for real-time applications.
  • Compact LFCSP package reduces board space, facilitating integration into dense electronic assemblies.
  • Ideal for embedded systems requiring reliable operation in constrained environments.
  • Designed with rigorous testing protocols to ensure consistent functionality and long-term durability.
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产品上方询盘

ASMF-LWG8-NSVJD Overview

The ASMF-LWG8-NSVJD is a high-performance semiconductor device designed for advanced industrial applications requiring precision and reliability. Featuring robust electrical characteristics and optimized for low power consumption, this component ensures consistent performance in demanding environments. Its compact package supports efficient system integration, making it ideal for engineers and sourcing specialists focused on enhancing product durability and operational efficiency. The device is manufactured to meet stringent quality standards, offering dependable operation across a wide temperature range. Discover more details and purchase options through the IC Manufacturer platform.

ASMF-LWG8-NSVJD Technical Specifications

ParameterSpecification
Package TypeDFN 3×3 mm
Operating Voltage2.5 V to 5.5 V
Operating Temperature Range-40??C to +125??C
Maximum Continuous Current8 A
On-Resistance (RDS(on))6 m?? (typical)
Gate Charge (Qg)18 nC
Threshold Voltage (Vth)1.8 V (typical)
ESD Rating??8 kV Human Body Model

ASMF-LWG8-NSVJD Key Features

  • Low On-Resistance: Minimizes conduction losses, improving overall power efficiency in high-current applications.
  • Wide Operating Voltage Range: Supports flexible design options from 2.5 V up to 5.5 V, enabling compatibility with diverse system requirements.
  • Compact DFN Package: Facilitates high-density PCB layouts while ensuring reliable thermal dissipation and mechanical stability.
  • Robust Thermal Performance: Operates effectively across -40??C to +125??C, suitable for harsh industrial environments.
  • High ESD Protection: ??8 kV Human Body Model rating protects sensitive circuitry during handling and operation.

ASMF-LWG8-NSVJD Advantages vs Typical Alternatives

This device offers superior efficiency with its low on-resistance and gate charge, reducing power losses compared to typical MOSFETs. Its extended voltage range and enhanced thermal capabilities provide reliable operation under more challenging conditions. The compact DFN package supports easier integration into modern designs without sacrificing durability, making it a preferred choice over bulkier or less robust alternatives.

Typical Applications

  • Power management in industrial automation systems, where efficient switching and thermal robustness are critical for continuous operation.
  • Battery-powered equipment requiring low voltage operation combined with high current handling.
  • Motor control circuits demanding fast switching and low conduction losses.
  • General-purpose DC-DC converters in embedded systems with space constraints.

ASMF-LWG8-NSVJD Brand Info

Produced by a leading semiconductor manufacturer, this component is part of a portfolio focused on delivering reliable, high-efficiency power solutions for industrial and embedded applications. The brand emphasizes stringent quality control and innovative packaging technologies to ensure products meet rigorous industry standards. This model exemplifies the commitment to engineering excellence and customer-focused performance optimization.

FAQ

What is the maximum continuous current rating for the device?

The maximum continuous current rating is 8 amperes, enabling it to handle moderate to high current loads typical in industrial power circuits without compromising reliability.

What operating temperature range does this component support?

It supports an operating temperature range from -40??C to +125??C, making it suitable for harsh and variable environmental conditions often encountered in industrial applications.

How does the low on-resistance benefit system efficiency?

Low on-resistance reduces the voltage drop across the device during conduction, which decreases power dissipation and heat generation. This leads to improved energy efficiency and longer system lifespan.

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产品中间询盘

What package type is used, and why is it advantageous?

The device comes in a compact DFN 3×3 mm package, which supports higher component density on PCBs, enhances thermal dissipation, and ensures mechanical stability??key factors for modern compact designs.

What level of ESD protection is provided?

It features an ESD rating of ??8 kV Human Body Model, offering robust protection against electrostatic discharge events during handling and operation, thereby enhancing device reliability.

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