ASMB-LTD2-0A333 Overview
The ASMB-LTD2-0A333 is a high-performance semiconductor device designed for industrial electronics applications requiring precision and reliability. It integrates advanced technology to deliver consistent operation under demanding conditions, making it suitable for engineers and sourcing specialists focused on robust component selection. This product supports efficient power management and system integration, ensuring enhanced overall performance. For further details, visit IC Manufacturer.
ASMB-LTD2-0A333 Technical Specifications
| Parameter | Specification |
|---|---|
| Operating Voltage | 3.3 V ?? 5% |
| Operating Temperature Range | -40??C to +85??C |
| Data Transfer Rate | Up to 400 Mbps |
| Package Type | QFN 32-pin |
| Input Current | Max 25 mA |
| Output Drive Capability | 8 mA per pin |
| Power Consumption | Typical 75 mW |
| ESD Protection | ??4 kV HBM |
| Signal Interface | SPI compatible |
ASMB-LTD2-0A333 Key Features
- High-Speed Data Transfer: Enables rapid communication, reducing latency and improving system responsiveness in industrial control applications.
- Wide Operating Temperature Range: Supports stable performance between -40??C and +85??C, ensuring reliability in harsh environments.
- Compact QFN Package: Facilitates space-saving PCB design and easy integration into existing systems.
- Low Power Consumption: Enhances energy efficiency, which is critical for battery-powered or low-power industrial devices.
ASMB-LTD2-0A333 Advantages vs Typical Alternatives
This device offers superior integration and power efficiency compared to typical alternatives. Its wide operating temperature range and robust ESD protection improve system reliability in challenging environments. Additionally, the high data transfer rate supports faster communication, making it a practical choice for engineers prioritizing accuracy and performance in industrial semiconductor components.
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Typical Applications
- Industrial automation control systems requiring precise data communication and durable semiconductor solutions for long-term reliability.
- Embedded systems in harsh environments demanding wide temperature tolerance and low power consumption.
- Sensor interface circuits where fast response times and stable operation under variable conditions are critical.
- Compact electronic modules needing space-efficient packaging without compromising performance.
ASMB-LTD2-0A333 Brand Info
The ASMB-LTD2-0A333 is produced by a leading semiconductor manufacturer specializing in industrial-grade integrated circuits. Known for delivering components that balance high performance with reliability, this product exemplifies the brand??s commitment to supporting engineers and sourcing specialists with robust, specification-driven solutions. The device aligns with industry standards and is backed by comprehensive technical support to ensure seamless integration into diverse applications.
FAQ
What is the maximum operating voltage of this semiconductor device?
The device operates reliably at 3.3 V with a tolerance of ??5%, making it compatible with a wide range of industrial power supplies that maintain stable voltage within this range.
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Can this component function in extreme temperature environments?
Yes, it supports an operating temperature range from -40??C up to +85??C, allowing it to perform reliably in both cold storage and high-temperature industrial settings.
How does the device handle protection against electrostatic discharge (ESD)?
It is equipped with ESD protection rated at ??4 kV Human Body Model (HBM), which safeguards the component during handling and assembly processes, reducing the risk of damage from static electricity.
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What packaging does the device use, and how does this benefit PCB design?
The product comes in a 32-pin QFN package that offers a compact footprint, enabling efficient use of PCB space and facilitating easier heat dissipation for improved device longevity.
Is the device compatible with standard communication interfaces?
Yes, it supports SPI-compatible signal interfaces, allowing straightforward integration with existing microcontrollers and industrial communication protocols.
