ASMB-KTF0-0A306 Overview
The ASMB-KTF0-0A306 is a precision semiconductor module designed for industrial electronics applications requiring high reliability and performance. Engineered with advanced fabrication techniques, this component delivers consistent operational stability across a broad temperature range. It integrates seamlessly into complex systems, offering optimal electrical characteristics that enhance overall system efficiency. Its robust design ensures longevity in demanding environments, making it ideal for engineers and sourcing specialists aiming for dependable semiconductor components. For detailed specifications and support, visit IC Manufacturer.
ASMB-KTF0-0A306 Technical Specifications
| Parameter | Specification |
|---|---|
| Package Type | Surface mount module |
| Operating Voltage | 12 V DC nominal |
| Operating Temperature Range | -40??C to +85??C |
| Maximum Power Dissipation | 1.5 W |
| Input Signal Type | Analog voltage input |
| Output Type | Digital switching output |
| Response Time | Less than 10 ??s |
| Package Dimensions | 25 mm ?? 18 mm ?? 7 mm |
ASMB-KTF0-0A306 Key Features
- High-speed response: The module??s response time under 10 microseconds enables rapid signal processing, critical for time-sensitive industrial control systems.
- Wide operating temperature range: Maintaining performance from -40??C to +85??C ensures reliable operation in harsh industrial environments.
- Compact surface mount design: Facilitates space-saving PCB layouts and simplifies assembly, reducing manufacturing complexity and costs.
- Low power dissipation: Consuming only 1.5 W at maximum load contributes to energy efficiency and lowers thermal management requirements.
ASMB-KTF0-0A306 Advantages vs Typical Alternatives
This module offers superior integration and reliability compared to conventional discrete solutions. Its fast response time and broad temperature tolerance provide enhanced accuracy and stability, especially in demanding industrial settings. The compact design reduces board space while maintaining low power consumption, making it a preferred choice over bulkier or less efficient alternatives.
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Typical Applications
- Industrial automation control systems where precise timing and robust performance under temperature extremes are essential for process optimization.
- Signal conditioning modules requiring fast analog-to-digital conversion and reliable switching outputs.
- Embedded electronics in manufacturing equipment that demand compact, efficient semiconductor components.
- Power management subsystems in industrial devices needing stable voltage operation and minimal thermal dissipation.
ASMB-KTF0-0A306 Brand Info
The ASMB-KTF0-0A306 comes from a leading semiconductor manufacturer known for delivering high-quality, industrial-grade components. This product exemplifies the brand??s commitment to innovation, durability, and performance in semiconductor technology. Designed to meet rigorous industry standards, it supports engineers and sourcing professionals in developing reliable and efficient electronic systems.
FAQ
What is the maximum operating temperature for this semiconductor module?
The module supports continuous operation up to 85??C, ensuring stable performance in elevated temperature conditions typical of industrial environments.
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Can this device be used in low-temperature applications?
Yes, it maintains reliable functionality down to -40??C, making it suitable for use in cold climates or refrigerated industrial systems.
What type of output signal does the ASMB-KTF0-0A306 provide?
It features a digital switching output, enabling straightforward interfacing with control logic or digital processing units in complex electronic systems.
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How does the compact design impact integration in PCB layouts?
The surface mount package measures 25 mm by 18 mm by 7 mm, allowing efficient use of PCB real estate, which simplifies system design and reduces manufacturing costs.
What are the power dissipation characteristics of this device?
The maximum power dissipation is 1.5 watts, which helps minimize heat generation and reduces the need for extensive thermal management components in the system.
