ASM6-SDD0-AQR0H Overview
The ASM6-SDD0-AQR0H is a high-performance semiconductor device designed for robust industrial applications requiring precise control and reliable operation. This component integrates advanced features such as enhanced input/output configurations and optimized power management to meet stringent requirements in automation and embedded systems. Manufactured by IC Manufacturer, it offers engineers and sourcing specialists a dependable solution with consistent performance and ease of integration into complex electronic assemblies.
ASM6-SDD0-AQR0H Technical Specifications
| Parameter | Specification |
|---|---|
| Operating Voltage Range | 3.0 V to 3.6 V |
| Maximum Operating Temperature | +85??C |
| Interface Type | SPI (Serial Peripheral Interface) |
| Supply Current (Active Mode) | 5 mA typical |
| Input Logic Levels | TTL/CMOS compatible |
| Data Transfer Rate | Up to 10 Mbps |
| Package Type | 32-pin QFN (Quad Flat No-lead) |
| ESD Protection | ??4 kV HBM (Human Body Model) |
ASM6-SDD0-AQR0H Key Features
- High-speed SPI communication: Enables fast data exchange, critical for time-sensitive industrial control systems.
- Wide operating voltage range: Supports flexible power supply options, enhancing compatibility across various designs.
- Low active current consumption: Contributes to overall energy efficiency and longer system uptime.
- Robust thermal performance: Ensures reliable operation in harsh environments up to +85??C.
- Compact 32-pin QFN package: Facilitates high-density PCB layouts and improved thermal dissipation.
- Integrated ESD protection: Safeguards against electrostatic discharge, increasing device longevity and system reliability.
- TTL/CMOS compatible inputs: Simplifies interfacing with various logic families, reducing design complexity.
ASM6-SDD0-AQR0H Advantages vs Typical Alternatives
This device offers superior integration of high-speed SPI communication and low power consumption compared to typical alternatives. Its enhanced ESD protection and wide operating temperature range provide increased reliability in industrial environments. The compact QFN package allows for space-saving designs without compromising thermal management or signal integrity, making it a preferred choice for demanding embedded applications.
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Typical Applications
- Industrial automation systems requiring precise and reliable communication interfaces with low power consumption, ensuring consistent performance under temperature variations.
- Embedded control units in manufacturing equipment where robust ESD protection is essential to prevent system failures.
- Power management modules needing compact components to optimize PCB real estate and maintain thermal stability.
- Data acquisition devices that benefit from high-speed SPI interfaces for efficient sensor data processing and transfer.
ASM6-SDD0-AQR0H Brand Info
Produced by IC Manufacturer, the ASM6-SDD0-AQR0H reflects the company??s commitment to delivering cutting-edge semiconductor solutions tailored for industrial and embedded applications. Renowned for quality and innovation, this product aligns with their portfolio of reliable, high-performance integrated circuits designed to meet the evolving demands of engineers and system designers worldwide.
FAQ
What communication interface does the ASM6-SDD0-AQR0H support?
The device supports a high-speed SPI (Serial Peripheral Interface), enabling fast and efficient data transfer rates up to 10 Mbps. This makes it suitable for applications that require rapid communication between microcontrollers and peripheral devices.
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What is the operating voltage range of the ASM6-SDD0-AQR0H?
This component operates reliably within a voltage range of 3.0 V to 3.6 V, providing flexibility for integration into systems with varying power supply standards while ensuring stable performance.
How does the ASM6-SDD0-AQR0H handle electrostatic discharge (ESD)?
The device includes built-in ESD protection rated up to ??4 kV according to the Human Body Model. This feature protects the device against electrostatic shocks during handling and operation, enhancing its durability and system reliability.
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What package type is used for this device, and how does it benefit system design?
It is housed in a compact 32-pin QFN (Quad Flat No-lead) package. This form factor supports high-density PCB layouts, improves thermal dissipation, and reduces parasitic inductance, which is critical for high-frequency applications.
What temperature range can the ASM6-SDD0-AQR0H operate within?
The device is designed to function effectively in environments with temperatures up to +85??C, making it suitable for industrial and embedded applications that demand reliable performance under elevated thermal conditions.
