AR35-L80S-PB01 High-Precision Sensor Module | Single Unit Package

  • This device processes signals efficiently, enabling precise control in embedded systems or automation projects.
  • Its high-speed operation supports demanding tasks, ensuring responsive performance in real-time applications.
  • The compact LFCSP package minimizes board space, allowing integration into size-constrained designs.
  • Ideal for industrial monitoring where stable data acquisition enhances system accuracy and operational safety.
  • Built with stringent quality standards to ensure long-term reliability under varied environmental conditions.
产品上方询盘

AR35-L80S-PB01 Overview

The AR35-L80S-PB01 is a precision semiconductor device designed for high-performance industrial applications. Engineered to deliver reliable operation under demanding conditions, it combines robust electrical characteristics with efficient power management. This component supports advanced system integration, enabling engineers to optimize overall device functionality while maintaining stringent quality standards. Suitable for a variety of industrial electronics, the AR35-L80S-PB01 ensures consistent performance, making it an ideal choice for sourcing specialists and design engineers seeking durable and effective semiconductor solutions. For further details, visit IC Manufacturer.

AR35-L80S-PB01 Technical Specifications

Parameter Specification
Operating Voltage 3.3 V ??5%
Current Consumption Max 80 mA
Operating Temperature Range -40??C to +85??C
Package Type Surface Mount Device (SMD)
Pin Count 8 pins
Input Signal Frequency Up to 50 MHz
Power Dissipation Max 0.5 W
Response Time Typical 10 ns

AR35-L80S-PB01 Key Features

  • High-Speed Signal Processing: Supports input frequencies up to 50 MHz, enabling rapid data handling for real-time industrial control systems.
  • Wide Operating Temperature: Functions reliably from -40??C to +85??C, ensuring stable performance in harsh environmental conditions.
  • Low Power Consumption: Max current of 80 mA minimizes energy usage, enhancing system efficiency and prolonging device lifespan.
  • Compact Surface Mount Package: Enables space-saving PCB designs and simplifies assembly processes for high-density industrial electronics.

AR35-L80S-PB01 Advantages vs Typical Alternatives

This device offers a superior balance of low power consumption and high-frequency operation compared to typical alternatives. Its robust temperature range and fast response time improve system reliability and accuracy, making it an excellent choice for engineers prioritizing performance and integration. The compact package further supports advanced PCB layouts, providing a competitive edge in industrial semiconductor solutions.

Typical Applications

  • Industrial automation systems requiring precise timing and control signal processing under variable environmental conditions.
  • Embedded control modules in manufacturing equipment for enhanced reliability and energy-efficient operation.
  • Power management circuits where low power dissipation and fast response are critical for system stability.
  • Signal conditioning in sensor interfaces, supporting high-frequency inputs with minimal latency.

AR35-L80S-PB01 Brand Info

The AR35-L80S-PB01 is part of a comprehensive semiconductor portfolio by a leading IC Manufacturer known for precision and quality. This product embodies the company??s commitment to delivering reliable, high-performance components that meet stringent industrial standards. Designed with the latest fabrication technology, the device ensures consistent operation, making it a preferred choice for engineers and sourcing specialists focused on durable and efficient semiconductor products.

FAQ

What is the maximum operating voltage for this device?

The maximum recommended operating voltage for this component is 3.3 V with a tolerance of ??5%, ensuring stable electrical performance within this range.

Can this device operate in extreme temperature environments?

Yes, it supports a wide operating temperature range from -40??C up to +85??C, making it suitable for harsh industrial environments and outdoor applications.

What type of package does this semiconductor use?

The device is housed in a compact Surface Mount Device (SMD) package, which facilitates easy integration into modern printed circuit boards with space constraints.

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产品中间询盘

How does the current consumption affect system design?

With a maximum current consumption of 80 mA, the device helps reduce overall power requirements, which benefits thermal management and increases energy efficiency in system designs.

Is the device suitable for high-frequency signal processing?

Yes, it supports input signal frequencies up to 50 MHz with a typical response time of 10 ns, making it well-suited for high-speed industrial signal processing applications.

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