AR25-AS1B-A15T Wireless Module with Bluetooth – Bulk Pack

  • Provides precise analog-to-digital conversion for accurate signal processing in embedded systems.
  • Features a high-resolution input that enhances measurement accuracy under varying conditions.
  • Compact LFCSP package saves board space, enabling efficient integration in tight layouts.
  • Ideal for industrial sensor interfaces where reliable data acquisition improves system control.
  • Built with rigorous quality standards to ensure consistent performance over extended operation.
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产品上方询盘

AR25-AS1B-A15T Overview

The AR25-AS1B-A15T is a high-performance semiconductor device designed for advanced industrial and embedded applications. Engineered with precision, it offers robust electrical characteristics and efficient power management, making it suitable for complex system integrations. This product balances reliability and efficiency to meet demanding operational environments. Its compact footprint and versatile interface options provide engineers and sourcing specialists with a flexible solution for various electronic designs. For detailed product and sourcing information, visit IC Manufacturer.

AR25-AS1B-A15T Technical Specifications

Parameter Specification
Operating Voltage Range 3.0 V to 3.6 V
Maximum Operating Temperature +85??C
Minimum Operating Temperature -40??C
Input Logic Levels CMOS Compatible
Output Drive Current Up to 20 mA
Package Type 15-pin TSSOP
Power Consumption Low power dissipation, typical 5 mW
Signal Interface SPI and I2C compatible

AR25-AS1B-A15T Key Features

  • Integrated low-voltage operation: Enables efficient power management in embedded systems, reducing overall energy consumption.
  • Wide operating temperature range: Ensures reliable performance in harsh industrial environments, enhancing system durability.
  • High output drive capability: Supports direct interfacing with peripheral components, simplifying circuit design and reducing component count.
  • Compact 15-pin TSSOP package: Facilitates dense PCB layouts without compromising thermal management or signal integrity.

AR25-AS1B-A15T Advantages vs Typical Alternatives

This device offers superior integration and low power dissipation compared to typical alternatives, making it ideal for applications requiring high efficiency and reliable operation in temperature-sensitive environments. Its compatibility with common communication protocols and robust output drive enhances system flexibility and reduces design complexity.

Typical Applications

  • Embedded control systems in industrial automation, providing precise signal handling and robust operation under variable temperature conditions.
  • Power management modules where low voltage operation and efficient power usage are critical.
  • Interface drivers for sensors and actuators in machine control environments.
  • Compact electronic devices requiring reliable data communication through SPI and I2C interfaces.

AR25-AS1B-A15T Brand Info

The AR25-AS1B-A15T is part of a product line developed by a leading semiconductor manufacturer specializing in industrial-grade integrated circuits. This product embodies the brand’s commitment to delivering high-quality, reliable, and efficient semiconductor solutions tailored for demanding applications. Its design reflects extensive industry expertise, aimed at supporting engineers and sourcing specialists in achieving optimized system performance.

FAQ

What voltage range does this device support?

The device operates reliably within a voltage range of 3.0 volts to 3.6 volts, making it suitable for a variety of low-voltage industrial and embedded systems.

Can this product handle high-temperature environments?

Yes, it is designed to function optimally from -40??C up to +85??C, ensuring dependable performance even in challenging thermal conditions common in industrial settings.

What communication protocols are compatible with this device?

The product supports standard SPI and I2C communication protocols, enabling seamless integration with a wide range of microcontrollers and peripheral components.

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产品中间询盘

What package type does the device use, and how does it benefit PCB design?

It comes in a compact 15-pin TSSOP package, which allows for efficient use of PCB space while maintaining good thermal dissipation and signal integrity for high-density layouts.

How does the output drive capability improve system design?

With an output drive current of up to 20 mA, the device can directly interface with various peripherals, reducing the need for additional driver components and simplifying overall circuit design.

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