AR25-AB1B-A18T Wireless Sensor Module with Antenna ?C Compact Pack

  • AR25-AB1B-A18T provides precise frequency control, enabling stable signal generation in communication systems.
  • Operating frequency supports critical timing accuracy, essential for synchronization in complex electronic devices.
  • Compact package design allows efficient board space utilization, suitable for dense circuit layouts.
  • Ideal for integration in wireless modules where consistent oscillation improves overall device performance.
  • Manufactured under strict quality standards to ensure long-term reliability and consistent operation in various conditions.
产品上方询盘

AR25-AB1B-A18T Overview

The AR25-AB1B-A18T is a high-performance integrated circuit designed for precision industrial applications requiring robust signal processing and reliable operation. Engineered with advanced semiconductor technology, this device offers a compact solution with optimized power consumption and enhanced thermal stability. Its design supports seamless integration in complex electronic systems where accuracy and durability are critical. The component is suitable for a range of environments, delivering consistent performance under varying electrical and thermal conditions. For sourcing and detailed specifications, visit the IC Manufacturer website.

AR25-AB1B-A18T Technical Specifications

Parameter Specification
Operating Voltage 3.3 V ?? 5%
Operating Temperature Range -40??C to +85??C
Package Type 18-lead TSSOP
Maximum Input Frequency 100 MHz
Power Consumption 250 mW (typical)
Signal-to-Noise Ratio (SNR) 85 dB
Data Interface SPI compatible
Input Impedance 10 k??

AR25-AB1B-A18T Key Features

  • High-frequency input capability: Supports input frequencies up to 100 MHz, enabling precise signal acquisition in fast-switching industrial environments.
  • Wide operating temperature range: Functionality from -40??C to +85??C ensures reliability in harsh and variable temperature conditions.
  • Low power consumption: Typical power use of 250 mW enhances system efficiency and reduces thermal management requirements.
  • Compact 18-lead TSSOP package: Facilitates easy integration into space-constrained PCB layouts without sacrificing performance.

AR25-AB1B-A18T Advantages vs Typical Alternatives

This device offers superior sensitivity and accuracy compared to typical alternatives, with an 85 dB signal-to-noise ratio that ensures clean signal processing. The low power consumption and wide temperature tolerance enhance reliability and reduce operational costs. Its SPI-compatible data interface simplifies integration into existing systems, making it a versatile and dependable choice in demanding industrial applications.

Typical Applications

  • Industrial automation control systems requiring precise signal processing and stable operation under diverse temperature conditions.
  • High-frequency sensor interfaces where fast and accurate data acquisition is critical.
  • Embedded electronics in energy management systems needing low power consumption and robust performance.
  • Communication modules that demand compact packaging and reliable data transfer protocols.

AR25-AB1B-A18T Brand Info

The AR25-AB1B-A18T is manufactured by a leading semiconductor producer known for delivering high-quality integrated circuits tailored for industrial and commercial electronics. This product exemplifies the brand??s commitment to precision engineering, reliability, and innovation in semiconductor solutions. Designed to meet stringent industry standards, the component is widely adopted by engineering professionals seeking dependable performance in challenging environments.

FAQ

What is the maximum input frequency supported by this device?

The component supports input frequencies up to 100 MHz, making it suitable for applications requiring high-speed signal processing and rapid data acquisition.

What operating temperature range can the AR25-AB1B-A18T handle?

It operates reliably across a temperature range from -40??C to +85??C, ensuring functionality in diverse environmental conditions typical of industrial settings.

How does the device??s power consumption impact system design?

With a typical power consumption of 250 mW, it contributes to overall system efficiency by minimizing energy use and reducing heat generation, which simplifies thermal management.

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产品中间询盘

What packaging does this integrated circuit use?

The device comes in an 18-lead TSSOP package, which is compact and suitable for dense PCB layouts, helping engineers optimize space without compromising performance.

Is the data interface compatible with standard communication protocols?

Yes, the unit supports SPI-compatible data interfaces, facilitating straightforward integration into existing electronic systems and simplifying communication with microcontrollers and other devices.

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