AM2434BSDFHIALVR Microcontroller IC – Tape & Reel

  • High-performance MCU cores accelerate control loops, improving responsiveness, deterministic behavior.
  • Integrated peripherals reduce external components, lowering cost and design complexity.
  • Compact package minimizes board space, enabling smaller enclosures and cooling.
  • Industrial motor control: AM2434BSDFHIALVR stabilizes loops, reduces tuning time significantly.
  • Automotive-grade testing and qualification ensure reliability under harsh operating conditions.
SKU: AM2434BSDFHIALVR Category: Brand:
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产品上方询盘

AM2434BSDFHIALVR Overview

The AM2434BSDFHIALVR is a semiconductor component specified by its full ordering code and packaging options. The part is presented as a factory-marked device for surface-mount assembly with industry-grade handling and shipping options suitable for high-volume manufacturing. Datasheet details describe package type, mounting style, temperature class, and tape-and-reel logistics. For sourcing, documentation, and authorized channel distribution visit IC Manufacturer.

AM2434BSDFHIALVR Technical Specifications

Attribute Value
Full part number AM2434BSDFHIALVR
Package type BGA (ball grid array)
Mounting style Surface Mount Device (SMD)
Packaging option Tape and Reel (LVR suffix)
Temperature range Industrial-class (specified on sheet)
RoHS status Lead-free / RoHS compliant
Ordering suffix details Manufacturing lot, traceability and packaging code
Description on sheet Manufacturer-specific product identifier and package information

AM2434BSDFHIALVR Key Features

  • Full ordering code provides precise traceability for procurement and inventory control.
  • BGA package enables higher ball count in a smaller footprint, improving board density and thermal performance.
  • Tape-and-reel shipping supports automated pick-and-place and high-volume surface mount assembly.
  • Industrial-grade designation aligns the device with higher temperature and reliability requirements for production use.

Typical Applications

  • Automated production environments where exact ordering codes and tape-and-reel packaging reduce procurement errors and speed assembly line throughput.
  • High-density printed circuit board designs that benefit from BGA packaging to maximize component count while maintaining thermal dissipation.
  • Industrial control and embedded systems that require parts specified for industrial temperature ratings and documented traceability for lifecycle management.
  • Sourcing and supply-chain operations that depend on precise part numbering, RoHS compliance, and packaging codes for compliance and warranty tracking.

AM2434BSDFHIALVR Advantages vs Typical Alternatives

The AM2434BSDFHIALVR ordering code consolidates device identity, package, and shipping options into a single, unambiguous part number. Compared with generic or truncated listings, this full code reduces sourcing risk and ensures the selected unit matches board-level and assembly requirements. The BGA package offers more interconnect density versus comparable QFN or LQFP options, while tape-and-reel packaging and industrial-class designation simplify high-volume manufacturing and long-term reliability planning.

AM2434BSDFHIALVR Brand Info

The AM2434BSDFHIALVR originates from Texas Instruments, a global semiconductor manufacturer known for industrial-grade mixed-signal and embedded processing products. TI provides global distribution, detailed ordering guides, and packaging traceability for large-scale production customers.

FAQ

What does the suffix LVR mean?

The datasheet lists suffixes such as LVR to indicate packaging and shipment method; in this case the suffix denotes tape-and-reel packaging and specific shipping format for automated SMT assembly.

Is the device RoHS compliant?

The product sheet specifies lead-free and RoHS compliance status, confirming the device meets common environmental regulations for lead and hazardous substance limits in commercial and industrial assemblies.

Which package type is used?

The technical sheet shows a ball grid array family package for this ordering code, which delivers higher interconnect density and favorable thermal characteristics for board-level design.

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产品中间询盘

Is this part rated for industrial temperatures?

The ordering code and documentation on the sheet indicate an industrial-grade temperature class appropriate for extended operating ranges commonly required in factory and embedded applications.

How should purchasing verify authenticity?

Buyers should cross-reference the full part number, packaging code, and manufacturer markings with the official product sheet and authorized distributor records to ensure authenticity and correct logistics handling.

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