AM2432BSFFHIALXR Microcontroller in SFF Package

AM2432BSFFHIALXR Overview

This AM2432BSFFHIALXR part is a high-reliability industrial semiconductor device that the datasheet lists with integrated processing and I/O capabilities optimized for embedded control systems. The sheet highlights industrial temperature support, a compact surface-mount package, and multiple interfaces for sensors and networks. Sourcing teams will appreciate the clear ordering code and package marking. For purchasing and technical reference, see IC Manufacturer.

AM2432BSFFHIALXR Technical Specifications

AM2432BSFFHIALXR Key Features

• Dual-core processing delivers higher deterministic control throughput for real-time tasks compared with single-core alternatives.
• Industrial temperature rating supports reliable operation across a wide ambient range, which matters for factory and field deployments.
• Rich peripheral set including Ethernet, CAN, UART, SPI and I2C enables direct integration with sensors, actuators, and networked controllers.
• Compact surface-mount package reduces board area while enabling higher I/O density and automated assembly for medium- to high-volume production.

Typical Applications

• Industrial motor control systems that require deterministic processing and multiple serial interfaces for sensors and feedback loop integration.
• Automation controllers in manufacturing lines where robust temperature range and network connectivity (Ethernet/CAN) ensure reliable communication.
• Embedded gateway devices that bridge field buses to Ethernet, using on-chip interfaces to reduce BOM count and lower latency.
• Remote monitoring modules where compact packaging and mixed I/O support data acquisition, local preprocessing, and secure transmission.

AM2432BSFFHIALXR Advantages vs Typical Alternatives

The sheet shows this device combines dual processing cores and a broad interface set in a compact surface-mount package, offering greater integration than many single-core microcontrollers. With industrial temperature grading and standard rail voltages, it provides stronger environmental robustness and easier board-level power design. These attributes lower system BOM and improve deployment reliability compared with discrete multi-chip solutions.

AM2432BSFFHIALXR Brand Info

The part is listed under a global semiconductor supplier known for embedded processors and industrial-grade components. The brand emphasizes long-term supply, technical documentation, and ecosystem support tailored to industrial customers and OEMs seeking certified, production-ready devices.

FAQ

What package does this part use?

The datasheet specifies a compact surface-mount BGA-style package intended for automated PCB assembly. Package details include ball-grid terminations and board footprint recommendations for reliable solder joints.

What temperature range is supported?

According to the sheet, the device supports an industrial operating range from -40 ??C up to +85 ??C, making it suitable for many factory and outdoor embedded installations.

Which communication interfaces are available?

The sheet documents multiple on-chip serial interfaces including Ethernet, CAN, UART, SPI and I2C, enabling flexible connectivity to sensors, networks, and field devices without external bridge chips.

How many cores does the processor include?

The technical sheet lists a dual-core configuration. This allows parallel handling of real-time control and auxiliary tasks, improving throughput versus a single-core device.

Is the device compliant with RoHS?

Yes. The datasheet indicates the part is designed for surface-mount production and is RoHS-compliant, supporting modern environmental and safety requirements for manufacturing.