AFSC5G37E38T2 Overview
The AFSC5G37E38T2 is a high-performance semiconductor device designed for advanced industrial and communication applications. Engineered with precision, it offers reliable operation across a wide temperature range and integrates cutting-edge technology to ensure optimal signal integrity and power efficiency. Its robust architecture supports high-frequency operation, making it ideal for next-generation 5G infrastructure and high-speed data transmission systems. Sourcing specialists and design engineers benefit from its compact package and consistent quality, which facilitate streamlined integration and reduce development cycles. For detailed technical support and procurement options, visit IC Manufacturer.
AFSC5G37E38T2 Technical Specifications
| Parameter | Specification |
|---|---|
| Operating Frequency Range | 3.3 GHz to 3.7 GHz |
| Supply Voltage | 3.3 V ?? 10% |
| Output Power | 38 dBm (typical) |
| Package Type | Surface Mount (SMD) |
| Operating Temperature Range | -40??C to +85??C |
| Current Consumption | 150 mA (typical) |
| Impedance | 50 ?? |
| Gain | 15 dB (typical) |
AFSC5G37E38T2 Key Features
- Wide Frequency Bandwidth: Supports operation from 3.3 GHz to 3.7 GHz, enabling compatibility with various 5G and advanced communication bands for versatile deployment.
- High Output Power: Delivers a typical output power of 38 dBm, ensuring strong signal transmission and improved network coverage in demanding environments.
- Low Current Consumption: Optimized for energy efficiency with a typical current draw of 150 mA, reducing power costs and thermal management challenges.
- Robust Thermal Range: Reliable performance from -40??C to +85??C allows stable operation in harsh industrial and outdoor settings.
AFSC5G37E38T2 Advantages vs Typical Alternatives
The device offers superior integration of high-frequency capability and power efficiency compared to typical alternatives. Its wide operating temperature range and compact surface-mount package provide enhanced reliability and ease of assembly. This combination of high gain, strong output power, and low current consumption delivers a balanced solution for engineers seeking performance without compromising energy efficiency or thermal management.
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Typical Applications
- 5G Wireless Infrastructure: Ideal for base stations and repeaters requiring high-frequency amplification and stable output power to support next-generation mobile networks.
- High-Speed Data Transmission: Suitable for RF front-end modules in communication equipment needing precise signal amplification in the 3.3?C3.7 GHz band.
- Industrial IoT Devices: Enables reliable wireless connectivity in sensor networks and control systems operating under varying environmental conditions.
- Military and Aerospace Communication Systems: Provides robust signal performance and temperature tolerance essential for mission-critical RF applications.
AFSC5G37E38T2 Brand Info
This product is manufactured by a leading semiconductor company specializing in RF and microwave components tailored for industrial and communication sectors. The brand is recognized for its commitment to quality, innovation, and extensive technical support. The AFSC5G37E38T2 exemplifies the company??s dedication to delivering reliable, high-performance solutions that meet the rigorous demands of modern wireless communication and industrial automation markets.
FAQ
What is the typical operating frequency range of this device?
The device operates typically between 3.3 GHz and 3.7 GHz, making it suitable for various 5G and advanced communication frequency bands. This range ensures compatibility with emerging wireless technologies.
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Can this component operate in harsh environmental conditions?
Yes, it is designed to function reliably within a temperature range of -40??C to +85??C, enabling stable performance in both industrial and outdoor applications exposed to extreme temperatures.
What is the power consumption of the device?
The typical current consumption is approximately 150 mA at a 3.3 V supply voltage, which contributes to its efficient energy use and reduces the thermal footprint in system designs.
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How does the output power compare to similar devices?
With a typical output power of 38 dBm, this device offers strong signal amplification, which is generally higher than many standard alternatives in the same frequency band, enhancing communication range and quality.
What packaging type is used and how does it affect integration?
The component comes in a surface-mount device (SMD) package, facilitating easy automated assembly and compact PCB layout. This packaging supports high-volume manufacturing and simplifies integration into complex RF modules.
