AFSC5G35E37T2 5G Signal Amplifier Module ?C Compact PCB Mount Package

  • Provides efficient signal processing to enhance data communication performance and system responsiveness.
  • Supports high-frequency operation, enabling faster data throughput critical for modern network demands.
  • Features a compact package design that optimizes board space and facilitates integration into dense layouts.
  • Ideal for telecommunications equipment, improving signal clarity and reducing latency in complex systems.
  • Manufactured under stringent quality controls to ensure consistent performance and long-term reliability.
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产品上方询盘

AFSC5G35E37T2 Overview

The AFSC5G35E37T2 is a high-performance semiconductor device designed for advanced industrial and communication applications. Featuring a compact form factor and optimized electrical parameters, it delivers reliable operation in demanding environments. Its robust construction ensures consistent performance with enhanced thermal stability and low power consumption. This device supports integration into complex systems, facilitating improved signal integrity and efficiency. Engineered for precision and durability, the AFSC5G35E37T2 is an ideal choice for engineers seeking dependable solutions in high-frequency and power-sensitive circuits. For detailed product insights, visit IC Manufacturer.

AFSC5G35E37T2 Technical Specifications

ParameterSpecification
Operating Frequency RangeUp to 5 GHz
Maximum Power Dissipation37 Watts
Supply Voltage3.5 V
Gain35 dB
Package TypeSurface-Mount Technology (SMT)
Operating Temperature Range-40??C to +85??C
Noise Figure1.2 dB
Input Impedance50 ??

AFSC5G35E37T2 Key Features

  • Wide Frequency Range: Operates efficiently up to 5 GHz, enabling use in high-speed communication systems with superior signal fidelity.
  • High Gain Performance: Provides 35 dB gain to amplify weak signals, supporting enhanced system sensitivity and extended range.
  • Low Noise Figure: At 1.2 dB noise figure, it minimizes signal degradation, crucial for applications demanding high signal-to-noise ratios.
  • Thermal Stability: Designed to maintain reliable operation across a broad temperature range, ensuring durability in industrial environments.
  • Compact SMT Package: Facilitates easy integration into dense PCB layouts, reducing assembly time and improving manufacturing efficiency.
  • Optimized Power Consumption: Balances performance with energy efficiency, extending device longevity and reducing system thermal load.
  • Impedance Matching: Standard 50 ?? input impedance streamlines compatibility with RF systems, simplifying design and minimizing signal reflections.

AFSC5G35E37T2 Advantages vs Typical Alternatives

This device offers superior gain and noise performance at frequencies up to 5 GHz compared to typical alternatives, enhancing signal clarity and system sensitivity. Its low power consumption and robust thermal characteristics provide reliability in harsh environments. The compact SMT package supports high-density PCB designs, improving integration and reducing manufacturing costs. These advantages make it a preferred choice for engineers prioritizing performance, efficiency, and ease of implementation.

Typical Applications

  • High-frequency wireless communication systems requiring reliable amplification and low noise for signal integrity in base stations and transceivers.
  • Industrial automation equipment that demands stable operation across wide temperature ranges for process control and monitoring.
  • Test and measurement instruments where precision amplification and low distortion are critical for accurate signal analysis.
  • Consumer electronics involving RF front-end modules benefiting from compact size and efficient power usage to extend battery life.

AFSC5G35E37T2 Brand Info

The AFSC5G35E37T2 is produced by a leading semiconductor manufacturer specializing in RF and high-frequency components. This product exemplifies the brand??s commitment to innovation and quality, delivering advanced performance for industrial and communication applications. Known for rigorous quality control and comprehensive technical support, the brand ensures that this device meets stringent reliability standards and integration requirements. The product line is backed by extensive documentation and design resources to assist engineers and sourcing specialists throughout the development lifecycle.

FAQ

What frequency range does this device support?

The device supports operation up to 5 GHz, making it suitable for a wide range of high-frequency applications including wireless communications and industrial RF systems.

What is the maximum power dissipation and why is it important?

With a maximum power dissipation of 37 Watts, the device can handle significant power levels without overheating, ensuring stable performance in demanding environments.

How does the noise figure impact system performance?

A noise figure of 1.2 dB indicates low internal noise, which helps maintain a high signal-to-noise ratio in the system, critical for clear and accurate signal processing in sensitive applications.

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产品中间询盘

Is the device suitable for harsh environmental conditions?

Yes, it operates reliably across a temperature range from -40??C to +85??C, making it suitable for industrial and outdoor applications where temperature extremes are common.

What packaging options are available, and how do they benefit manufacturing?

This device is available in a surface-mount technology (SMT) package, which supports automated assembly processes and allows for compact PCB designs, reducing production time and cost.

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