A5M35TG040-TCT1 Overview
The A5M35TG040-TCT1 is a high-performance semiconductor memory component designed for industrial and embedded applications requiring fast, reliable data storage. Featuring a 4 Mbit capacity with advanced timing and power management characteristics, it offers a balance of speed and energy efficiency suitable for a wide range of electronic systems. This memory device supports multiple operating voltages and is optimized for seamless integration into complex circuits. Engineered with robust architecture, the A5M35TG040-TCT1 ensures stable operation under varying environmental conditions, making it an ideal choice for demanding industrial environments. For more detailed specifications and sourcing, visit IC Manufacturer.
A5M35TG040-TCT1 Technical Specifications
| Parameter | Specification |
|---|---|
| Memory Density | 4 Mbit |
| Organization | 512K x 8 bits |
| Operating Voltage Range | 2.7 V to 3.6 V |
| Access Time (Max) | 70 ns |
| Data Retention | 10 years (minimum) |
| Endurance | 100,000 write/erase cycles |
| Package Type | TSSOP-8 (Thin Shrink Small Outline Package) |
| Operating Temperature Range | -40??C to +85??C |
| Standby Current | 5 ??A (typical) |
| Interface | SPI (Serial Peripheral Interface) |
A5M35TG040-TCT1 Key Features
- High-Speed SPI Interface: Enables fast serial communication, reducing latency and improving system responsiveness for time-critical applications.
- Low Power Consumption: Standby current as low as 5 ??A minimizes energy usage, which is essential for battery-powered and energy-sensitive devices.
- Robust Data Retention and Endurance: Guarantees data integrity for over 10 years and supports up to 100,000 write/erase cycles, ensuring long-term reliability in harsh environments.
- Wide Operating Temperature Range: Designed to function reliably from -40??C to +85??C, suitable for industrial-grade applications exposed to temperature extremes.
- Compact TSSOP-8 Package: Facilitates easy PCB integration with a small footprint, optimizing board space without sacrificing performance.
- 3.3 V Power Supply Compatibility: Supports standard industrial power rails, enhancing system design flexibility.
- Fast Access Time: 70 ns maximum access time supports quick read/write cycles, improving overall system throughput.
A5M35TG040-TCT1 Advantages vs Typical Alternatives
This memory device offers superior endurance and data retention compared to typical alternatives, enhancing reliability in industrial and embedded systems. Its low power consumption and fast SPI interface provide a balance of efficiency and performance, reducing operational costs while maintaining system responsiveness. The wide operating temperature range and compact packaging improve integration flexibility and durability in challenging environments, making it a preferred choice for engineers seeking robust memory solutions.
🔥 Best-Selling Products

Texas Instruments BQ24075 Linear Battery Charger IC – 5mm x 4mm QFN Package

Texas Instruments INA219 Current Sensor Module – SOIC Package, Precision Monitoring

Texas Instruments LM4041 Precision Voltage Reference – SOT-23 Package

Texas Instruments OPA2134 Audio Op Amp – Dual, High-Performance, SOIC-8 Package
Typical Applications
- Industrial control systems requiring reliable non-volatile memory for configuration data and firmware storage, where operating conditions demand robust temperature tolerance and endurance.
- Embedded systems in automotive electronics needing fast, low-power memory for sensor data logging and system calibration.
- Consumer electronics that benefit from compact and efficient memory storage to reduce PCB size and extend battery life.
- Communication devices that require stable and quick non-volatile memory for protocol and parameter storage in demanding operational environments.
A5M35TG040-TCT1 Brand Info
The A5M35TG040-TCT1 is produced by a leading semiconductor manufacturer specializing in industrial-grade memory components. Designed with a focus on quality, reliability, and integration ease, this product aligns with industry standards for embedded non-volatile memory. The brand emphasizes stringent testing and process control to deliver consistent performance, making it a trusted choice for engineers and sourcing specialists in the electronics market. This component reflects the company??s commitment to supporting advanced industrial applications with dependable semiconductor technologies.
FAQ
What types of memory technology does this device use?
This component utilizes serial SPI-based non-volatile memory technology with EEPROM architecture, allowing for reliable data retention and multiple write/erase cycles suited to embedded applications.
🌟 Featured Products

“Buy MAX9312ECJ+ Precision Voltage Comparator in DIP Package for Reliable Performance”

QCC-711-1-MQFN48C-TR-03-1 Bluetooth Audio SoC with MQFN48C Package

0339-671-TLM-E Model – High-Performance TLM-E Package for Enhanced Functionality

1-1415898-4 Connector Housing, Electrical Wire-to-Board, Receptacle, Packaged
Can this device operate in harsh temperature environments?
Yes, it is rated for an operating temperature range from -40??C to +85??C, making it suitable for industrial environments where temperature extremes are common.
How does the SPI interface benefit system design?
The SPI interface allows for high-speed serial communication with minimal pin count, simplifying board layout and improving data transfer efficiency compared to parallel interfaces.
📩 Contact Us
What are the endurance specifications for write and erase cycles?
The memory supports up to 100,000 write/erase cycles, providing long-term durability and reliability for applications requiring frequent data updates.
Is the packaging suitable for space-constrained designs?
Yes, the Thin Shrink Small Outline Package (TSSOP-8) offers a compact footprint that facilitates integration into designs where PCB space is limited without compromising thermal or electrical performance.





