A5G26H605W19NR3 Overview
The A5G26H605W19NR3 is a high-performance semiconductor device engineered for industrial and automotive applications requiring robust operation and precise control. This integrated component offers advanced functionality with reliable electrical characteristics optimized for demanding environments. Designed to meet stringent quality standards, it supports efficient power management and signal processing. Sourcing engineers and design teams will appreciate its compact package and consistent performance, enabling streamlined integration into complex electronic systems. For detailed technical support and procurement, visit IC Manufacturer.
A5G26H605W19NR3 Technical Specifications
| Parameter | Specification |
|---|---|
| Device Type | Integrated Semiconductor Module |
| Operating Voltage | 5 V ?? 10% |
| Operating Temperature Range | ?C40 ??C to +125 ??C |
| Package Type | Surface Mount Technology (SMT) Compact Package |
| Maximum Operating Frequency | 26 MHz |
| Power Dissipation | 600 mW |
| Pin Count | 19 Pins |
| ESD Protection | ??4 kV Human Body Model |
A5G26H605W19NR3 Key Features
- High-Frequency Operation: Supports up to 26 MHz frequency, providing fast switching and signal processing capabilities essential for modern industrial controls.
- Wide Temperature Range: Operates reliably between ?C40 ??C and +125 ??C, ensuring consistent performance in harsh and variable environmental conditions.
- Compact SMT Package: Enables space-saving PCB layouts and facilitates automated assembly processes, reducing manufacturing time and costs.
- Robust ESD Protection: Integrated 4 kV Human Body Model ESD safeguards the device against electrostatic discharge, enhancing long-term reliability.
A5G26H605W19NR3 Advantages vs Typical Alternatives
This device offers superior operational stability and thermal tolerance compared to standard semiconductor modules, making it ideal for challenging industrial environments. Its optimized power dissipation and high-frequency capability provide enhanced efficiency and accuracy over typical counterparts. The compact design supports seamless integration into dense PCBs, while robust ESD protection increases reliability, reducing failure rates during manufacturing and field operation.
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Typical Applications
- Industrial Control Systems: Utilized in precise timing and signal management tasks, the device??s high-frequency operation and temperature tolerance ensure consistent process control in factory automation.
- Automotive Electronics: Suitable for in-vehicle systems requiring reliable operation under temperature extremes and vibration, supporting powertrain and sensor modules.
- Power Management Modules: Enables efficient voltage regulation and switching for power supply units in industrial and commercial equipment.
- Embedded Systems: Ideal for microcontroller interface circuits where compact size and high-speed performance are critical.
A5G26H605W19NR3 Brand Info
The A5G26H605W19NR3 is a product of a leading semiconductor manufacturer renowned for delivering high-quality integrated circuits tailored to industrial and automotive applications. This component reflects the brand??s commitment to reliability, performance, and innovation. Designed under rigorous quality processes, it meets international standards and certifications, making it a preferred choice for engineers seeking dependable semiconductor solutions with proven field performance.
FAQ
What is the operating temperature range of this semiconductor device?
The device operates within a temperature range of ?C40 ??C to +125 ??C. This wide range ensures stable performance in various demanding environments, including automotive and industrial settings where temperature fluctuations are common.
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How does the package type benefit manufacturing and design?
The surface mount technology (SMT) compact package allows for efficient PCB space utilization and supports automated assembly techniques. This reduces production time and costs while enhancing the overall reliability of solder joints in high-volume manufacturing.
What kind of ESD protection is incorporated in the device?
It features electrostatic discharge protection rated at ??4 kV Human Body Model. This level of protection guards the component against damage from electrostatic events during handling and assembly, increasing the device??s robustness and lifespan.
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What are the power consumption characteristics?
The maximum power dissipation is specified at 600 mW, which balances performance and thermal management. This allows for effective operation without excessive heat generation, suitable for compact and thermally constrained designs.
Can this device be used in automotive applications?
Yes, the device??s wide temperature range and robust design make it suitable for automotive electronics. It can operate reliably under the thermal and electrical stresses commonly encountered in vehicle systems, supporting functions such as sensors and powertrain controls.
