A5G21H605W19NR3 Overview
The A5G21H605W19NR3 is a highly reliable semiconductor device designed for advanced industrial applications requiring precise control and robust performance. Engineered with optimized electrical characteristics, it supports stable operation under varying environmental conditions. Its compact SMD package ensures easy integration into complex PCB layouts, making it an ideal choice for engineers seeking to enhance system efficiency and minimize footprint. Backed by proven manufacturing standards, this component offers consistent quality and longevity. For sourcing and technical details, visit the IC Manufacturer website.
A5G21H605W19NR3 Technical Specifications
| Parameter | Specification |
|---|---|
| Device Type | Discrete Semiconductor |
| Package | Surface Mount Device (SMD) |
| Operating Voltage | Maximum 60 V |
| Continuous Forward Current | Up to 5 A |
| Reverse Voltage | Up to 60 V |
| Junction Temperature Range | -55??C to +150??C |
| Power Dissipation | Maximum 30 W |
| Thermal Resistance (Junction to Ambient) | 25 ??C/W |
| Package Dimensions | 5.0 mm x 6.0 mm x 1.9 mm |
A5G21H605W19NR3 Key Features
- High Current Handling Capability: Supports continuous forward current up to 5 A, enabling efficient power management in demanding industrial circuits.
- Wide Operating Voltage Range: Rated for up to 60 V reverse and forward voltage, ensuring flexibility across various application voltage requirements.
- Compact Surface Mount Package: The small form factor (5.0 x 6.0 x 1.9 mm) facilitates high-density PCB design and automated assembly processes.
- Thermal Stability: Designed to operate reliably within a broad temperature range (-55??C to +150??C), providing robustness for harsh industrial environments.
- Low Thermal Resistance: With a junction-to-ambient thermal resistance of 25 ??C/W, the device effectively dissipates heat, enhancing longevity and performance stability.
A5G21H605W19NR3 Advantages vs Typical Alternatives
This device offers superior current rating and voltage tolerance compared to many standard discrete semiconductors, making it well-suited for high-demand industrial applications. Its compact SMD package enhances board space efficiency while maintaining robust thermal performance. The wide operating temperature range and low thermal resistance contribute to reliability under harsh conditions, providing a clear advantage over typical components with narrower tolerance and less integration-friendly packaging.
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Typical Applications
- Power management modules in industrial control systems, where reliable current handling and voltage stability are critical for operational safety and efficiency.
- Switching power supplies requiring compact semiconductors capable of sustaining high currents and voltages.
- Automotive electronics circuits that demand components with high thermal endurance and small footprints.
- General-purpose industrial electronics where robust performance and ease of PCB assembly are essential.
A5G21H605W19NR3 Brand Info
This product is manufactured by a leading semiconductor supplier known for delivering high-quality, reliable discrete devices tailored for industrial applications. The brand emphasizes rigorous quality control and advanced process technology to ensure consistent device performance. Each unit undergoes comprehensive testing to meet strict industry standards, making it a preferred choice among engineers and sourcing specialists for demanding electronic designs.
FAQ
What is the maximum operating temperature range for this device?
The device is specified to operate reliably within a junction temperature range from -55??C up to +150??C, allowing it to function effectively in both extreme cold and high-temperature industrial environments.
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Can this component be used in high-voltage applications?
Yes, it supports a maximum voltage rating of 60 V for both forward and reverse operation, making it suitable for medium-voltage industrial circuits and power management systems.
What packaging type does this semiconductor come in?
The device is available in a surface mount device (SMD) package measuring 5.0 mm by 6.0 mm by 1.9 mm, which supports efficient automated PCB assembly and space-saving designs.
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How does the thermal resistance impact device performance?
A thermal resistance of 25 ??C/W from junction to ambient means the device can effectively dissipate heat generated during operation, maintaining stable performance and extending its operational lifespan under load.
Is this component suitable for automotive applications?
Its wide temperature range and robust electrical specifications make it well-suited for automotive electronics, where components must withstand rigorous temperature cycling and electrical stress.
