88W8987-A2-NYEE/AK Wi-Fi 6E 2×2 MIMO Module – Embedded Package

  • This device provides advanced wireless connectivity, enabling efficient data transmission in embedded systems.
  • Featuring a high-speed interface, it ensures rapid communication essential for real-time applications.
  • The compact LFCSP package minimizes board space, supporting designs with strict size constraints.
  • Ideal for IoT devices, it enhances network performance while maintaining low power consumption.
  • Manufactured with stringent quality controls, it delivers consistent operation in demanding environments.
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产品上方询盘

88W8987-A2-NYEE/AK Overview

The 88W8987-A2-NYEE/AK is a highly integrated wireless connectivity solution designed for advanced industrial and consumer applications. This semiconductor device offers robust support for dual-band Wi-Fi and Bluetooth functionalities, delivering reliable communication performance with low power consumption. Its compact form factor and comprehensive feature set make it ideal for embedding in complex systems requiring seamless wireless interoperability. Engineers and sourcing specialists benefit from its proven stability and compliance with industry standards, ensuring rapid development cycles and dependable end-product operation. For more detailed product and support information, visit the IC Manufacturer.

88W8987-A2-NYEE/AK Technical Specifications

Parameter Specification
Wireless Standards IEEE 802.11a/b/g/n/ac, Bluetooth 5.0
Frequency Bands 2.4 GHz and 5 GHz dual-band support
Transmit Power Up to +20 dBm
Receive Sensitivity -95 dBm (typical)
Interface Support SDIO 3.0, USB 2.0
Operating Voltage 3.3 V ?? 10%
Package Type QFN, 48-pin
Operating Temperature -40??C to +85??C

88W8987-A2-NYEE/AK Key Features

  • Dual-band Wi-Fi and Bluetooth Integration: Enables simultaneous connectivity over 2.4 GHz and 5 GHz bands, improving network flexibility and reducing interference.
  • High Sensitivity Receiver: Supports excellent receive sensitivity down to -95 dBm, ensuring reliable data communication in challenging RF environments.
  • Low Power Consumption: Designed to optimize energy use, extending battery life in portable and embedded devices without compromising performance.
  • Flexible Interface Options: Incorporates both SDIO 3.0 and USB 2.0 interfaces, facilitating easy integration with a wide range of host processors.
  • Robust Industrial Temperature Range: Operates reliably from -40??C to +85??C, suitable for harsh industrial environments and outdoor applications.
  • Compact QFN Package: The 48-pin QFN packaging supports high-density PCB layouts, reducing overall system footprint.

88W8987-A2-NYEE/AK Advantages vs Typical Alternatives

This device provides superior wireless performance with dual-band support and enhanced receive sensitivity compared to typical single-band modules. Its low power design and broad industrial temperature range ensure greater reliability and extended operational lifetimes in demanding applications. The flexible interface options and compact packaging simplify system integration, making it a preferred choice over less versatile or bulkier alternatives.

Typical Applications

  • Industrial automation systems requiring robust wireless communication in harsh environments benefit from the dual-band connectivity and wide temperature tolerance.
  • Embedded IoT devices leveraging low power consumption for extended battery operation in remote or mobile scenarios.
  • Consumer electronics such as smart home hubs and wireless peripherals that demand integrated Wi-Fi and Bluetooth functionality.
  • Network gateways and access points where reliable dual-band performance and compact size are critical.

88W8987-A2-NYEE/AK Brand Info

Manufactured by a leading semiconductor company, this device exemplifies advanced wireless connectivity solutions tailored for industrial and consumer markets. The product line is renowned for combining high integration, compliance with wireless standards, and robust performance. This model reflects the manufacturer??s commitment to quality, offering engineers and designers a dependable component that accelerates development timelines and enhances end-product capabilities.

FAQ

What wireless standards does this device support?

The unit supports multiple wireless standards including IEEE 802.11a/b/g/n/ac for Wi-Fi and Bluetooth 5.0, enabling versatile and high-speed connectivity across numerous applications.

What interfaces are available for host communication?

It provides both SDIO 3.0 and USB 2.0 interfaces, allowing designers to select the most suitable communication protocol based on system requirements and compatibility with host processors.

Can this device operate in extreme temperature conditions?

Yes, it is rated to operate reliably between -40??C and +85??C, making it suitable for industrial and outdoor environments where temperature extremes are common.

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产品中间询盘

How does the low power consumption benefit device design?

The optimized power management reduces energy usage, which is critical for battery-powered and portable products, extending operational time without sacrificing wireless performance.

What package type is used and why is it advantageous?

The product is housed in a 48-pin QFN package, offering a compact footprint for space-constrained designs and facilitating efficient thermal dissipation and surface mounting on PCBs.

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