88W8801-B0-NMDC/AZ Overview
The 88W8801-B0-NMDC/AZ is a high-performance wireless communication IC designed for robust and efficient data transmission in demanding industrial environments. This device integrates advanced radio frequency capabilities with low power consumption, making it suitable for complex connectivity applications requiring stable throughput and extended operational life. Engineered with precision, the IC supports multiple wireless protocols and offers enhanced system integration, simplifying design and accelerating time-to-market. Its compact form factor and reliable operation under varied environmental conditions position it as a preferred choice for engineers and sourcing specialists focused on scalable and cost-effective wireless solutions. For further technical details and support, visit IC Manufacturer.
88W8801-B0-NMDC/AZ Technical Specifications
| Parameter | Specification |
|---|---|
| Operating Frequency Range | 2.4 GHz ISM Band |
| Modulation Schemes Supported | OFDM, DSSS |
| Maximum Data Rate | Up to 150 Mbps |
| Supply Voltage | 3.3 V ?? 10% |
| Operating Temperature Range | -40??C to +85??C |
| Power Consumption (Transmit Mode) | Approx. 200 mW |
| Package Type | QFN 5×5 mm |
| Interface | SPI, UART |
| Security Features | Hardware AES Encryption |
88W8801-B0-NMDC/AZ Key Features
- Integrated RF Front-End: Enables high sensitivity reception and reliable transmission, ensuring robust wireless connectivity in industrial applications.
- Low Power Operation: Offers efficient power management to extend battery life, critical for remote or portable wireless devices.
- Multi-Protocol Support: Supports both OFDM and DSSS modulation schemes, allowing flexible integration into diverse wireless networks.
- Hardware Security Engine: Incorporates AES encryption to safeguard data integrity and confidentiality, vital for secure communications.
- Compact QFN Package: Facilitates easy PCB layout and reduced board space, streamlining system design and manufacturing.
- Wide Temperature Range: Operates reliably from -40??C to +85??C, suitable for harsh industrial environments.
- Flexible Interface Options: SPI and UART support enable straightforward connectivity with various microcontrollers and host processors.
88W8801-B0-NMDC/AZ Advantages vs Typical Alternatives
This device offers a compelling balance of power efficiency, integration, and security compared with typical wireless ICs in its class. Its integrated RF front-end reduces external component count, lowering overall system cost and complexity. The advanced modulation support and hardware encryption provide enhanced data throughput and protection, while the extended temperature tolerance ensures consistent performance in challenging industrial settings. These advantages make it a reliable and cost-effective choice for engineers seeking robust wireless solutions.
🔥 Best-Selling Products
-

Texas Instruments BQ24075 Linear Battery Charger IC – 5mm x 4mm QFN Package
-

Texas Instruments INA219 Current Sensor Module – SOIC Package, Precision Monitoring
-

Texas Instruments LM4041 Precision Voltage Reference – SOT-23 Package
-

Texas Instruments OPA2134 Audio Op Amp – Dual, High-Performance, SOIC-8 Package
Typical Applications
- Industrial wireless sensor networks requiring stable, long-range data transmission with low power consumption for extended field deployment.
- Embedded wireless modules in automation systems demanding secure communication and flexible protocol compatibility.
- Remote monitoring devices in harsh environments where temperature resilience and reliable connectivity are essential.
- Portable handheld instruments that benefit from compact size and efficient power management for longer operational periods.
88W8801-B0-NMDC/AZ Brand Info
The 88W8801-B0-NMDC/AZ is a product from a recognized semiconductor manufacturer specializing in advanced wireless communication ICs. The brand is known for delivering highly integrated, reliable, and secure solutions tailored for industrial and commercial applications. This particular model exemplifies the company??s commitment to innovation, combining robust wireless performance with efficient power usage and broad operating conditions. Its design philosophy focuses on enabling engineers to develop scalable and secure wireless systems effectively.
FAQ
What wireless protocols does the 88W8801-B0-NMDC/AZ support?
The device supports OFDM and DSSS modulation schemes, enabling compatibility with common wireless communication protocols in the 2.4 GHz ISM band. This flexibility allows integration in diverse network environments, enhancing interoperability with various wireless standards.
🌟 Featured Products
-

“Buy MAX9312ECJ+ Precision Voltage Comparator in DIP Package for Reliable Performance”
-

QCC-711-1-MQFN48C-TR-03-1 Bluetooth Audio SoC with MQFN48C Package
-

0339-671-TLM-E Model – High-Performance TLM-E Package for Enhanced Functionality
-

1-1415898-4 Connector Housing, Electrical Wire-to-Board, Receptacle, Packaged
How does the power consumption of this IC compare to similar devices?
With an approximate transmit power consumption of 200 mW, the IC offers efficient energy use relative to comparable wireless modules. This low power operation is beneficial for battery-powered and portable devices, helping to extend operational life without compromising performance.
Is the device suitable for operation in extreme temperature conditions?
Yes, it is rated for operation between -40??C and +85??C, making it well-suited for industrial and outdoor applications where temperature extremes are common. This wide range ensures reliable performance even in harsh environmental conditions.
📩 Contact Us
What security features are included in the 88W8801-B0-NMDC/AZ?
The IC includes a hardware AES encryption engine, providing robust data security at the hardware level. This feature protects communication integrity and confidentiality, which is critical in industrial and commercial wireless applications.
What package type does this wireless IC come in, and why is it important?
The device is packaged in a compact 5×5 mm QFN package. This small footprint simplifies PCB design, reduces board space, and improves thermal management, aiding in the development of compact and efficient wireless systems.





