HSMC-C197 High-Speed Data Converter Module ?C Compact Plug-and-Play Package

HSMC-C197 Overview

The HSMC-C197 is a high-performance semiconductor component designed for industrial applications requiring precise control and robust operation. Engineered with advanced technology, it delivers reliable performance in demanding environments, ensuring consistent output and ease of integration. This device from IC-fabrikant combines efficiency and durability to meet the needs of engineers and sourcing specialists focused on quality and long-term stability. Its compact design and well-defined specifications make it a preferred choice for system developers aiming for optimized power management and signal processing.

HSMC-C197 Technical Specifications

Parameter	Specificatie
Bedrijfsspanning	3,3 V tot 5 V
Maximum Operating Temperature	+85??C
Minimum Operating Temperature	-40??C
Type verpakking	QFN 32-pins
Bedrijfsfrequentie	Up to 150 MHz
Stroomverbruik	Typical 250 mW
Input/Output Interface	SPI, I2C
Signal Gain	Up to 40 dB
ESD Protection Level	??4 kV HBM

HSMC-C197 Key Features

• High-frequency operation: Supports clock speeds up to 150 MHz, enabling fast data processing for real-time industrial control systems.
• Wide operating voltage range: Compatible with 3.3 V to 5 V supplies, allowing flexible integration into various power architectures.
• Robust temperature tolerance: Operates reliably from -40??C to +85??C, ensuring stable performance in harsh environmental conditions.
• Integrated SPI and I2C interfaces: Facilitates versatile communication options, simplifying system design and reducing external component count.
• Laag energieverbruik: Typical power draw of 250 mW supports energy-efficient operation, critical for embedded industrial devices.
• Compact 32-pin QFN package: Enables high-density PCB layouts, optimizing space in complex industrial modules.
• Enhanced ESD protection: ??4 kV human body model rating guards against electrostatic discharge, improving device longevity.

HSMC-C197 Advantages vs Typical Alternatives

This device offers a superior combination of high operating frequency, broad temperature range, and low power consumption compared to typical alternatives. Its flexible voltage compatibility and integrated communication interfaces reduce the need for additional components, enhancing system reliability and simplifying design. The robust ESD protection and compact packaging further differentiate it, making it ideal for demanding industrial environments where accuracy, durability, and integration efficiency are critical.

Typische toepassingen

• Industrial automation control units requiring precise signal amplification and fast communication interfaces, ensuring reliable operation under variable temperature conditions.
• Embedded sensor systems needing low power consumption and robust environmental tolerance for long-term field deployment.
• Power management modules where efficient voltage operation and minimal heat generation are essential for system stability.
• Communication equipment that benefits from integrated SPI and I2C interfaces for streamlined data exchange and control.

HSMC-C197 Brand Info

Manufactured by a leading semiconductor provider, this product exemplifies cutting-edge technology combined with industrial-grade reliability. It is part of a series engineered specifically to meet the rigorous demands of modern industrial and embedded system applications. The brand focuses on delivering components that balance performance, durability, and ease of integration, supporting engineers and system designers in achieving optimal results with minimal redesign effort.

FAQ

What is the typical operating temperature range for this device?

The device is designed to operate reliably within a temperature range of -40??C to +85??C, making it suitable for harsh industrial environments where temperature fluctuations are common.

Which communication protocols does the device support?

It supports both SPI and I2C communication interfaces, providing flexibility in system design and enabling seamless integration with a wide range of microcontrollers and processors.

What packaging options are available for this component?

The product comes in a compact 32-pin QFN package, which allows for high-density PCB implementation and efficient heat dissipation in constrained spaces.

How does the power consumption of this device compare to similar models?

With a typical power consumption of 250 mW, it offers an energy-efficient solution that helps extend the overall lifetime of battery-powered or energy-sensitive industrial applications.

What level of ESD protection is provided?

The device features ??4 kV Human Body Model (HBM) ESD protection, enhancing its robustness against electrostatic discharge events commonly encountered during handling and operation.