CYW20738A2KML3G Overview
The CYW20738A2KML3G is a Bluetooth communication integrated circuit designed for robust wireless connectivity in industrial and consumer electronics. This device delivers reliable performance in demanding environments, making it ideal for applications requiring Bluetooth Low Energy (BLE) support and efficient power management. With its compact 40-VFQFN package, it enables streamlined PCB layouts and is well-suited for space-constrained designs. Trusted by engineers for high-quality wireless communication, this solution ensures seamless integration into a variety of IoT and embedded platforms. For more details, visit IC-fabrikant.
CYW20738A2KML3G Technical Specifications
| Parameter | Waarde |
|---|---|
| Type apparaat | Bluetooth IC |
| Protocol | Bluetooth Low Energy (BLE) |
| Pakket | 40-VFQFN Exposed Pad |
| Mounting Type | Surface Mount |
| Bedrijfstemperatuurbereik | -40 tot 85°C |
| Number of Pins | 40 |
| RoHS Status | RoHS Compliant |
| Lifecycle Status | Active |
CYW20738A2KML3G Key Features
- Integrated Bluetooth Low Energy support delivers robust wireless communication, enabling easy connectivity for IoT and embedded applications.
- Compact 40-pin VFQFN package streamlines PCB design and allows for high-density component placement, saving valuable board space.
- Wide operating temperature range from -40??C to 85??C ensures reliable performance in industrial and harsh environments.
- Surface mount configuration facilitates automated assembly processes, improving manufacturing efficiency and consistency.
CYW20738A2KML3G Advantages vs Typical Alternatives
The CYW20738A2KML3G stands out due to its combination of Bluetooth Low Energy support, a compact 40-pin VFQFN package, and wide operating temperature range. These attributes provide superior integration and reliability compared to many alternatives, enabling robust wireless communication and efficient board layouts. The RoHS compliance further ensures suitability for environmentally conscious projects.
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Typische toepassingen
- Wireless sensor nodes: The device??s BLE capability makes it ideal for low-power, short-range communication in industrial sensor networks and smart building systems. It enables devices to efficiently transmit data wirelessly to gateways or controllers.
- Consumer electronics: Suitable for integration into smart home devices, fitness trackers, and personal healthcare equipment that require seamless Bluetooth communication and compact form factors.
- Asset tracking and monitoring: Its robust performance and surface mount package support secure and reliable connectivity in asset management tags and tracking devices.
- Industrial automation: Used in control panels, process monitoring, and wireless machine-to-machine communication where operating in wide temperature ranges is essential.
CYW20738A2KML3G Brand Info
This Bluetooth integrated circuit is part of a reputable product lineup known for innovation in wireless connectivity. The CYW20738A2KML3G exemplifies the brand??s commitment to quality and technological advancement, offering dependable BLE performance in a compact and efficient package. Its ongoing active lifecycle status and RoHS compliance reflect the manufacturer??s dedication to supporting both current and future design requirements in industrial and commercial markets.
FAQ
What is the primary wireless protocol supported by this device?
The CYW20738A2KML3G supports Bluetooth Low Energy (BLE), making it ideal for low-power, short-range wireless communication in a variety of embedded and IoT applications.
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What is the recommended operating temperature range for reliable use?
The device is designed to operate reliably across a temperature range of -40??C to 85??C, supporting both industrial and commercial environments with varying thermal conditions.
Does the CYW20738A2KML3G comply with environmental standards?
Yes, this component is RoHS compliant, ensuring it adheres to key environmental and safety standards required by global electronics markets.
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What benefits does the 40-VFQFN package offer?
The 40-VFQFN exposed pad package provides a compact footprint, excellent thermal performance, and is suitable for high-density surface mount assembly, which is valuable for space-constrained PCB designs.
Is the CYW20738A2KML3G suitable for automated manufacturing processes?
Yes, it is designed for surface mount technology (SMT), making it compatible with automated assembly lines and promoting manufacturing efficiency and consistency in volume production.
